COOLING METHOD, A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
A cooling method is a method of cooling a processed substrate in a state of being held by a substrate holder, the method including: a first cooling step of cooling the substrate by supplying a gas toward the substrate holder disposed at a reference position; a stopping step of stopping supply of the gas; and a second cooling step of cooling the processed substrate held in a lower portion of the substrate holder.
1 . A cooling method of cooling processed substrates in a state of being held by a substrate holder, the cooling method comprising:
(a) cooling the processed substrates by supplying a gas toward the substrate holder disposed at a predetermined reference position;
(b) stopping supply of the gas; and
(c) cooling the processed substrates held in a lower portion of the substrate holder.
2 . The cooling method of claim 1 , wherein (b) further comprises at least one among:
(b-1) measuring a temperature of the processed substrates held by the substrate holder; and
(b-2) checking a placement state of the processed substrates.
3 . The cooling method of claim 2 , wherein (c) is omitted when a temperature of the substrate is lower than a pre-set temperature.
4 . The cooling method of claim 1 , wherein, in (a), the gas is supplied to a top plate of the substrate holder, a substrate holding region of the substrate holder in which the processed substrates are loaded, and a boundary of the substrate holding region of the substrate holder.
5 . The cooling method of claim 1 , wherein (a) is performed until a temperature of a substrate of one of the processed substrates held in a center portion of the substrate holder becomes lower than or equal to 100° C.
6 . The cooling method of to claim 1 , wherein (b) further comprises
(b-3) moving the substrate holder from the reference position to a position at which one substrate of the processed substrates is transferable.
7 . The cooling method of claim 6 , wherein (b-3) further comprises:
measuring a temperature of the one substrate held by the substrate holder; and
checking a placement state thereof.
8 . The cooling method of claim 1 , wherein a flow rate of the gas supplied in (c) is less than a flow rate of the gas supplied in (a).
9 . The cooling method of claim 1 , wherein a gas supply time in (c) is shorter than a gas supply time in (a).
10 . The cooling method of claim 1 , wherein, in (c), the gas is supplied to at least one among: a substrate holding region of the substrate holder; a heat insulating region of the substrate holder; a boundary between the substrate holding region and the heat insulating region.
11 . The cooling method of claim 1 , wherein, in (a) and (c), it is enabled to supply the gas to a top plate of the substrate holder and a boundary between the substrate holding region of the substrate holder in which the processed substrates are loaded and the heat insulating region.
12 . The cooling method of claim 1 , wherein in (c), it is enabled to supply the gas to a boundary between a substrate holding region of the substrate holder in which the processed substrates are loaded and a heat insulating region of the substrate holder.
13 . The cooling method of claim 7 , wherein (c) is omitted in a case where a temperature of the processed substrates are lower than a predetermined pre-set temperature.
14 . The cooling method of claim 1 , further comprising (d) is performed, wherein (d) performing either one of:
measuring a temperature of one of the processed substrates; and
checking a placement state of the one of the processed substrates.
15 . The cooling method of claim 1 , wherein in (b), further comprises either one of:
(b-1) measuring a temperature of the processed substrates held by the substrate holder when a pre-set time has elapsed; and
(b-2) checking a placement state of the processed substrates when a pre-set time has elapsed.
16 . The cooling method of claim 15 , wherein (c) is omitted in a case where a temperature of the processed substrates are lower than a predetermined temperature.
17 . A method of manufacturing a semiconductor device comprising:
(A) cooling processed substrates in a state of being held by a substrate holder, wherein (A) comprises:
(a) cooling the processed substrates by supplying a gas toward the substrate holder disposed at a predetermined reference position;
(b) stopping supply of the gas; and
(c) cooling the processed substrates held in a lower portion of the substrate holder.
18 . A non-transitory computer-readable recording medium from which it is enabled to read a program for causing a substrate processing apparatus, the program that cause, by a computer, the substrate processing apparatus to perform:
(A) cooling a substrate in a state of being held by a substrate holder, wherein (A) comprises:
(a) cooling the substrates by supplying a gas toward the substrate holder disposed at a predetermined reference position;
(b) stopping supply of the gas; and
(c) cooling the substrate held in a lower portion of the substrate holder.