IP Library Granted Patent US 12,283,736
Granted Patent B2
US 12,283,736 · App. 17/703,872 · Granted Apr 22, 2025

PCB tuning for waveguide antennae

Inventors: Angelos Alexanian (Lexington, MA); Konstantinos Konstantinidis (Schweinfurt, DE)
Assignee: Magna Electronics, LLC
H01P3/121G01S7/032H01Q13/10H01Q13/18H05K1/0237H05K1/115G01S13/931H01P3/123H05K2201/10151
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,283,736
App. No.
17/703,872
Granted
Apr 22, 2025
Kind
B2
Abstract

RADAR sensor assemblies/modules, particularly those for vehicles. In some embodiments, the assembly may comprise a waveguide comprising a waveguide groove defined by opposing waveguide groove structures. An antenna structure may be operably coupled with the waveguide. A printed circuit board may be operably coupled with the waveguide and may comprise an electrically conductive top layer, an electrically conductive bottom layer, and a substrate positioned in between the electrically conductive top layer and the electrically conductive bottom layer. The electrically conductive top layer may comprise an opening exposing the substrate, which opening may extend along the waveguide groove in between the opposing waveguide groove structures. This configuration may allow for various parameters of the printed circuit board to be modified to tune a performance of a sensor/antenna.

Claims (31)

1. A waveguide antenna assembly, comprising:

a waveguide comprising a waveguide groove defined by opposing waveguide groove structures;

an antenna structure operably coupled with the waveguide; and

a printed circuit board operably coupled with the waveguide, wherein the printed circuit board comprises an electrically conductive top layer, an electrically conductive bottom layer, and a substrate positioned in between the electrically conductive top layer and the electrically conductive bottom layer, and wherein the electrically conductive top layer comprises an opening exposing the substrate, wherein the opening extends along the waveguide groove in between the opposing waveguide groove structures.

2. The waveguide antenna assembly of claim 1 , wherein the waveguide and antenna structure are configured to be coupled with a plurality of different printed circuit boards to adjust one or more performance characteristics of the waveguide antenna assembly by adjusting one or more parameters of a printed circuit board to which the waveguide and antenna structure are coupled.

3. The waveguide antenna assembly of claim 2 , wherein the one or more parameters comprises at least one of a dielectric constant of the substrate, a width of the opening exposing the substrate, a length of the opening exposing the substrate, and a thickness of the substrate.

4. The waveguide antenna assembly of claim 3 , further comprising a cavity formed in the printed circuit board, wherein the cavity is at least partially defined by the electrically conductive bottom layer and on opposing sides of the cavity by one or more electrically conductive structures coupling the electrically conductive bottom layer with the electrically conductive top layer.

5. The waveguide antenna assembly of claim 4 , wherein the one or more electrically conductive structures comprises a row of adjacent vias defining a via wall.

6. The waveguide antenna assembly of claim 4 , wherein the one or more parameters further comprises at least one of a width of the cavity and a length of the cavity.

7. The waveguide antenna assembly of claim 2 , wherein the waveguide and the antenna structure are both formed in a single, unitary structure.

8. The waveguide antenna assembly of claim 7 , wherein the single, unitary structure comprises at least one of a diecast waveguide antenna block and an injection molded waveguide antenna block.

9. The waveguide antenna assembly of claim 1 , wherein the opposing waveguide groove structures comprise one or more opposing rows of posts.

10. The waveguide antenna assembly of claim 1 , further comprising an array of electromagnetic band-gap structures formed within the opening.

11. The waveguide antenna assembly of claim 10 , wherein the array of electromagnetic band-gap structures comprises a plurality of electrically conductive rectangular structures positioned on a top surface of the substrate and comprising a via extending through the substrate to couple with the electrically conductive bottom layer of the printed circuit board.

12. The waveguide antenna assembly of claim 11 , wherein the waveguide and antenna structure are configured to be coupled with a plurality of different printed circuit boards to adjust one or more performance characteristics of the waveguide antenna assembly by adjusting one or more parameters of a printed circuit board to which the waveguide and antenna structure are coupled, and wherein the one or more parameters comprises at least one of a dielectric constant of the substrate, a width of the opening exposing the substrate, a length of the opening exposing the substrate, a thickness of the substrate, and a pattern of the array of electromagnetic band-gap structures.

13. A vehicle sensor antenna assembly, comprising:

a waveguide block comprising:

a waveguide groove;

an antenna slot extending along an axis of the waveguide groove, wherein the antenna slot is configured to deliver electromagnetic radiation therethrough as part of a signal for a vehicle sensor; and

a printed circuit board coupled with the waveguide block and forming a wall of the waveguide groove, wherein the printed circuit board comprises:

a first metallic layer;

a second metallic layer;

a substrate positioned in between the first metallic layer and the second metallic layer; and

an elongated opening formed in the first metallic layer adjacent to the waveguide groove to expose the substrate therethrough.

14. The vehicle sensor antenna assembly of claim 13 , wherein the printed circuit board is removably coupleable to the waveguide block to allow any of a plurality of other printed circuit boards having differing characteristics used to tune a performance of the vehicle sensor by changing the characteristics of the printed circuit board alone.

15. The vehicle sensor antenna assembly of claim 13 , further comprising a dielectric cavity formed in the substrate.

16. The vehicle sensor antenna assembly of claim 15 , wherein the dielectric cavity is formed, at least in part, by a first row of conductive vias extending between the first metallic layer and the second metallic layer on a first side of the dielectric cavity and a second row of conductive vias extending between the first metallic layer and the second metallic layer along a second side of the dielectric cavity opposite the first side of the dielectric cavity.

17. The vehicle sensor antenna assembly of claim 16 , wherein the printed circuit board is removably coupleable to the waveguide block to allow any of a plurality of other printed circuit boards having differing tuning characteristics used to tune a performance of the vehicle sensor by changing the tuning characteristics of the printed circuit board alone, and wherein the tuning characteristics comprise a dielectric constant of the substrate, a width of the elongated opening exposing the substrate, a length of the elongated opening exposing the substrate, a thickness of the substrate, a width of the dielectric cavity, and a length of the dielectric cavity.

18. The vehicle sensor antenna assembly of claim 13 , wherein the waveguide groove is formed by one or more opposing rows of posts.

19. The vehicle sensor antenna assembly of claim 13 , further comprising an array of electromagnetic band-gap structures formed in the elongated opening.

20. The vehicle sensor antenna assembly of claim 19 , wherein the array of electromagnetic band-gap structures comprises a mushroom shape comprising an enlarged head protruding from a surface of the substrate opposite from the second metallic layer and a relatively narrower stem extending through the substrate to the second metallic layer.

Assignments (4)
CHANGE OF NAME Recorded May 9, 2024
From: VEONEER US, LLC
To: MAGNA ELECTRONICS, LLC
Reel/Frame 067378/0436 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE FIVE APPLICATION NOS. FROM NAME CHANGE PREVIOUSLY RECORDED AT REEL: 060309 FRAME: 0353. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Jul 1, 2022
From: VEONEER US, INC.
To: VEONEER US, LLC
Reel/Frame 060562/0694 →
CHANGE OF NAME Recorded Jun 24, 2022
From: VEONEER US, INC.
To: VEONEER US, LLC
Reel/Frame 060309/0353 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2022
From: ALEXANIAN, ANGELOS; KONSTANTINIDIS, KONSTANTINOS
To: VEONEER US, INC.
Reel/Frame 059817/0132 →
Continuity (1)
Related Publication 20230307814A1 · Sep 28, 2023
References Cited (58)
US 2990547A · McDougal · 1961 [cited by applicant]
US 3231894A · Nagal · 1966 [cited by applicant]
US 6483481B1 · Sievenpiper et al. · 2002 [cited by applicant]
US 7132905B2 · Sano · 2006 [cited by applicant]
US 8058998B2 · Burnside et al. · 2011 [cited by applicant]
US 8779995B2 · Kirino et al. · 2014 [cited by applicant]
US 8803638B2 · Kildal · 2014 [cited by applicant]
US 9153851B2 · Nakamura · 2015 [cited by applicant]
US 9252475B2 · Milyakh et al. · 2016 [cited by applicant]
US 9666931B2 · Suzuki · 2017 [cited by applicant]
US 10090600B2 · Kirino et al. · 2018 [cited by applicant]
US 10164344B2 · Kirino et al. · 2018 [cited by applicant]
US 10327364B2 · Oishi et al. · 2019 [cited by applicant]
US 10381741B2 · Kirino et al. · 2019 [cited by applicant]
US 20030117245A1 · Okajima et al. · 2003 [cited by applicant]
US 20040066346A1 · Huor · 2004 [cited by applicant]
US 20070152868A1 · Schoebel · 2007 [cited by applicant]
US 20090153432A1 · Manasson et al. · 2009 [cited by applicant]
US 20110043423A1 · Kirino et al. · 2011 [cited by applicant]
US 20110050356A1 · Nakamura et al. · 2011 [cited by applicant]
US 20120068900A1 · Yatabe · 2012 [cited by examiner]
US 20140354498A1 · Balma et al. · 2014 [cited by applicant]
US 20160020522A1 · Sano et al. · 2016 [cited by applicant]
US 20160254582A1 · Jensen · 2016 [cited by applicant]
US 20170040703A1 · Cheng et al. · 2017 [cited by applicant]
US 20170084971A1 · Kildal et al. · 2017 [cited by applicant]
US 20170187121A1 · Kirino et al. · 2017 [cited by applicant]
US 20170279193A1 · Chauloux · 2017 [cited by applicant]
US 20180013208A1 · Izadian et al. · 2018 [cited by applicant]
US 20180269591A1 · Kirino et al. · 2018 [cited by applicant]
US 20180301816A1 · Kamo et al. · 2018 [cited by applicant]
US 20180351261A1 · Kamo et al. · 2018 [cited by applicant]
US 20190379136A1 · Kirino et al. · 2019 [cited by applicant]
US 20200194900A1 · Doyle et al. · 2020 [cited by applicant]
US 20210028527A1 · Doyle · 2021 [cited by examiner]
US 20210028528A1 · Alexanian · 2021 [cited by examiner]
US 20210028529A1 · Doyle · 2021 [cited by examiner]
US 20210028549A1 · Doyle · 2021 [cited by examiner]
US 20210210865A1 · Li et al. · 2021 [cited by applicant]
US 20230223671A1 · Vosoogh · 2023 [cited by examiner]
CN 102931492 · 2015 [cited by applicant]
CN 105633585 · 2016 [cited by applicant]
CN 106207357 · 2016 [cited by applicant]
EP 2267841 · 2010 [cited by applicant]
SE 543704C2 · 2021 [cited by applicant]
WO 2017078183 · 2017 [cited by applicant]
WO 2019022651 · 2019 [cited by applicant]
WO 2021122725 · 2021 [cited by applicant]
Pucci, E., Rajo-Iglesias, E., & Kildal, P.-S. (2012). New Microstrip Gap Waveguide on Mushroom-Type EBG for Packaging of Microwave Components. IEEE Microwave and Wireless Components Letters, 22(3), 129a131. https://doi.… [cited by examiner]
Rajo-Iglesias, E., & Kildal, P. (Feb. 2011). Numerical studies of bandwidth of parallel-plate cut-off realised by a bed of nails, corrugations and mushroom-type electromagnetic bandgap for use in gap waveguides. IET Mic… [cited by examiner]
Sievenpiper, D., Lijun Zhang, Broas, R. F. J., Alexopolous, N. G., & Yablonovitch, E. (1999). High-impedance electromagnetic surfaces with a forbidden frequency band. IEEE Transactions on Microwave Theory and Techniques… [cited by examiner]
Skobelev, S. P., & Kildal, P.-S. (2005). Mode-matching modeling of a hard conical quasi-TEM horn realized by an EBG structure with strips and vias. IEEE Transactions on Antennas and Propagation, 53(1), 139â143. https://… [cited by examiner]
CN102931492, Feb. 11, 2015, Beijing Institute of Telemetry Technology, Machine Translation (9 pages). [cited by applicant]
CN106207357, Dec. 7, 2016, Chengdu Xanaway Technology Co., Ltd., Machine Translation (58 pages). [cited by applicant]
Goussetis, G. et al., Tailoring the AMC and EBG characteristics of periodic metallic arrays printed on grounded dielectric substrate, IEE Transactions on Antennas and Propagation, vol. 54, No. 1, Jan. 2006 (8 pages). [cited by applicant]
Zhang, Y. et al., Planar Artificial Magnetic Conductors and Patch Antennas, IEE Transactions on Antennas and Propagation, vol. 51, No. 10, Oct. 2003 (9 pages). [cited by applicant]
Mosallaei, H., et al., Antenna Miniaturization and Bandwidth Enhancement Using a Reactive Impedance Substrate, IEE Transactions on Antennas and Propagation, vol. 52, No. 9, Sep. 2004 (12 pages). [cited by applicant]
Jun. 26, 2023—PCT/US23/15571—International Search Report & Written Opinion (7 pgs). [cited by applicant]