Microchannel plate and method of making the microchannel plate with an electron backscatter layer to amplify first strike electrons

1. A night vision system, comprising:

an image intensifier tube placed between a lens and an eyepiece, wherein the image intensifier tube comprises:

a photocathode;

a phosphor covered anode;

a microchannel plate arranged a spaced distance between the photocathode and the phosphor covered anode, wherein the microchannel plate comprises a spaced plurality of channel openings with an electron backscatter layer configured between a contact metal layer and secondary electron booster layer circumferentially around a sidewall surface of each of the channel openings.

2. The night vision system of claim 1 , wherein the microchannel plate comprises an input face substantially planar surface spaced from the photocathode and an opposing output face substantially planar surface spaced from the phosphor covered anode.

3. The night vision system of claim 2 , wherein the contact metal is coupled to a voltage supply to generate an electric field through each of the channel openings from the input face to the output face.

4. The night vision system of claim 2 , wherein the contact metal layer, the electron backscatter layer and the secondary electron booster layer are formed in succession on the input face and on the sidewall surface of each of the channel openings.

5. The night vision system of claim 2 , wherein the electron backscatter layer and the secondary electron booster layer are formed in succession on only the input face and on the sidewall surface of each of the channel openings extending into the channel openings a predetermined distance from the input face.

6. The night vision system of claim 2 , wherein the electron backscatter layer and the secondary electron booster layer are formed in succession on the sidewall surface of each of the channel openings with the electron backscatter layer extending into the channel openings a predetermined distance from the input face a distance equal to or less than the secondary electron booster layer.

7. The night vision system of claim 5 , wherein the predetermined distance is approximately one half a diameter of each of the channel openings.

8. The night vision system of claim 1 , wherein the contact metal layer, the electron backscatter layer and the secondary electron booster layer are formed in succession radially inward from the sidewall surface circumferentially around an entirety of the sidewall surface a distance approximately one half the diameter of each of the channel openings along the sidewall surface from an input face of the microchannel plate.

9. The night vision system of claim 1 , wherein the electron backscatter layer comprises an element having an atomic mass unit greater than 100 grams/mole, and more preferably greater than 150 grams/mole.

10. A microchannel plate comprising:

a channel having a central axis extending at a channel bias angle relative to an input face of the microchannel plate;

a first portion of the channel near the input face comprising:

a circumferentially extending glass sidewall surface;

a contact metal layer coupled to a bias voltage, wherein the contact metal layer is configured adjacent to and radially inward from the glass sidewall surface;

an electron backscatter layer configured adjacent to and radially inward from the contact metal layer, wherein the electron backscatter layer is configured to receive primary electrons emitted from a photocathode and backscatter the primary electrons from a surface of the electron backscatter layer;

a secondary electron booster layer configured adjacent to and radially inward from the electron backscatter layer, wherein the secondary electron booster layer is configured to receive the backscattered primary electrons from the surface of the electron backscatter layer and to multiply the received backscattered primary electrons.

11. The microchannel plate of claim 10 , wherein the electron backscatter layer and the secondary electron booster layer are configured on only the input face of the microchannel plate and on the glass sidewall surface of a plurality of channels adjacent to the input face.

12. The microchannel plate of claim 10 , wherein the electron backscatter layer and the secondary electron booster layer are configured along the input face and along the glass sidewall surface of each of a plurality of channels a predetermined distance from the input face.

13. The microchannel plate of claim 10 , wherein the predetermined distance is greater than one half a diameter of one of the plurality of channels.

14. The microchannel plate of claim 1 , wherein the electron backscatter layer comprises an element having an atomic mass unit greater than 100 grams/mole, and more preferably greater than 150 grams/mole.

15. The microchannel plate of claim 1 , wherein the electron backscatter layer comprises a thickness of between 30 Å to 50 Å.

16. A method of making a microchannel plate, comprising:

forming glass cores surrounded by respective glass cladding at a first angle relative to opposing input and output faces of a plate;

etching the glass cores to remove the cores entirely from the remaining glass cladding leaving a plurality of spaced channels;

forming a contact metal layer on both opposing input and output faces of the plate and partially into each of the spaced channels;

forming an electron backscatter layer on the contact metal on the input face and contiguously only partially into each of the spaced channel near only the input face;

forming a secondary electron booster layer on the electron backscatter layer on the input face and contiguously only partially into each of the spaced channels near only the input face; and

coupling the contact metal to a bias voltage to draw first strike electrons from the secondary electron booster layer, a portion of which are produced from primary electrons backscattering from the electron backscatter layer.

17. The method of claim 16 , further comprises etching the glass cladding at the boundary between the glass cores and the surrounding glass cladding prior to etching the glass cores to remove the cores entirely.

18. The method of claim 17 , wherein etching the glass cladding at the boundary and subsequently etching the glass cores to remove the cores entirely produces a funnel shaped opening into each of the spaced channels.

19. The method of claim 16 , wherein forming the electron backscatter layer comprises directionally depositing an element having an atomic mass unit greater than 100 grams/mole, and more preferably greater than 150 grams/mole.

20. The method of claim 16 , wherein forming the electron backscatter layer to a thickness of between 30 Å to 50 Å.