Method of mounting electronic component
According to one embodiment, a method of mounting electronic components, includes placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components, bringing the pressure jig into contact with a part of the sapphire substrate to apply a load on a contact part between a part of an upper surface of the spacer and the second surface, pressing the sapphire substrate toward the circuit board with the pressure jig, to bring other part of the upper surface of the spacer into contact with the second surface and flatten the sapphire substrate.
1. A method of mounting electronic components, comprising:
placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion located on a side of the first surface and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components located on a side of the second surface, between a stage and a pressure jig so that the first surface and the second surface oppose each other;
bringing the pressure jig into contact with a part of the sapphire substrate to apply a load on a contact part between a part of an upper surface of the spacer and the second surface;
pressing the sapphire substrate toward the circuit board with the pressure jig to bring other part of the upper surface of the spacer into contact with the second surface and flatten the sapphire substrate;
irradiating first laser beam onto the workpiece through a window of the pressure jig, and joining the electronic components to the circuit board;
irradiating second laser light having a wavelength band different from that of the first laser light onto the workpiece through the window, to remove the electronic components from the sapphire substrate; and
releasing the pressure jig from the sapphire substrate.
2. The method of claim 1 , wherein
when the pressure jig is brought into contact with the part of the sapphire substrate to apply a load to the contact part between the part of the upper surface of the spacer and the second surface, the other part of the upper surface of the spacer is separated from the second surface.
3. The method of claim 1 , wherein
when the sapphire substrate is flattened, the entire upper surface of the spacer and the second surface are in contact with each other.
4. The method of claim 1 , wherein
the spacer includes a plurality of hole portions, and
when the sapphire substrate is pressurized with the pressure jig toward the circuit board, the electronic components are placed in the hole portions.
5. The method of claim 1 , wherein
a rigidity of the spacer is equal to or higher than a rigidity of the sapphire substrate.