IP Library Patent Application 17708054
Patent Application
App. No. 17/708,054

SUSPENSION FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) AND METHOD EMPLOYING THE SAME

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Quick Facts
Patent No.
US None
App. No.
17/708,054
Abstract

The present disclosure relates to aqueous suspensions suitable for chemical mechanical planarization (CMP), the use of aqueous suspensions and a method of CMP using aqueous suspensions. The suspensions and method can be used for CMP of silicon carbide surfaces.

Claims (25)

1 . An aqueous suspension comprising:

(a) one or more metal salts of permanganic acid;

(b) zirconia nanoparticles;

(c) alumina nanoparticles; and

(d) one or more salts of nitric acid.

2 . The aqueous suspension of claim 1 , further comprising at least one pH adjusting agent and/or at least one pH buffering agent.

3 . The aqueous suspension of claim 1 , wherein the aqueous suspension has a pH value in a range from 2 to 5.

4 . The aqueous suspension of claim 1 , wherein the one or more metal salts of permanganic acid is selected from the group consisting of LiMnO 4 , KMnO 4 , NaMnO 4 , and mixtures thereof.

5 . The aqueous suspension of claim 1 , wherein the zirconia nanoparticles comprise ZrO 2 .

6 . The aqueous suspension of claim 1 , wherein the alumina nanoparticles comprise colloidal alumina particles.

7 . The aqueous suspension of claim 6 , wherein the colloidal alumina particles comprise γ-AlOOH particles and/or γ-Al 2 O 3 particles.

8 . The aqueous suspension of claim 1 , wherein the one or more salts of nitric acid comprises Al(NO 3 ) 3 .

9 . A method of chemically-mechanically planarizing a substrate, comprising:

(i) contacting the substrate with an aqueous suspension of claim 1 ;

(ii) moving the aqueous suspension with a polishing pad relative to the substrate; and

(iii) abrading at least a portion of the substrate to polish the substrate.

10 . The method of claim 9 , wherein the substrate does not exceed a temperature of 60° C. during abrading.

11 . The method of claim 9 , further comprising, before contacting the substrate with the aqueous suspension, reducing a pH of the aqueous suspension to a range of 2 to 2.5.

12 . A method for preparing an aqueous suspension, comprising:

(i) adding aluminum nitrate to the aqueous suspension comprising alumina nanoparticles and zirconia nanoparticles; and

(ii) adding an aqueous solution of one or more metal salts of permanganic acid to the aqueous suspension.

13 . The method of claim 12 , further comprising, prior to the adding the aluminum nitrate, filtering the aqueous suspension.

14 . The method of claim 12 , further comprising, prior to the adding the aqueous solution, filtering the aqueous solution of one or more metal salts of permanganic acid.

15 . The method of claim 12 , wherein the aqueous suspension has a pH value in a range from 2 to 5 at 23° C.

16 . The method of claim 12 , wherein the step (i) and the step (ii) are sequentially carried out.

Assignments (2)
SECURITY INTEREST Recorded Jun 2, 2023
From: ENTEGRIS, INC.; CMC MATERIALS LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 063857/0199 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2023
From: ALETY, SRIDEVI R.; MAHADEV, NIRAJ; CYFFKA, MARK
To: ENTEGRIS, INC.
Reel/Frame 062951/0904 →