METAL AND GRAPHITE OVER FOAM FOR PLACEMENT BETWEEN COMPONENTS IN ELECTRONIC DEVICES
Embodiments relate to a compressible conductive foam having high heat conductivity and high electrical conductivity by having a graphite layer surround a core material, and having a metal layer surround the graphite layer. The metal layer may be a metal sheet or a metal fabric including copper. The metal layer increases the electrical conductivity of the compressible conductive foam while retaining the high thermal conductivity due to the graphite layer.
1 . A conductive compressible foam, comprising:
a core material that is compressible;
a graphite layer extending over a periphery of the core material; and
a metal layer on the graphite layer for contacting a first component and a second component of an electronic device.
2 . The foam of claim 1 , further comprising:
a first adhesive layer on a portion of the metal layer for securing the conductive foam to the first component; and
a second adhesive layer on another portion of the metal layer for securing the conductive foam to the second component.
3 . The foam of claim 2 , wherein the first adhesive layer and the second adhesive are pressure activated.
4 . The foam of claim 2 , wherein the metal layer wrap around the core material and edges of the metal layer partially overlap, and the second adhesive layer spans across the overlapping edges of the metal layer.
5 . The foam of claim 1 , wherein the metal layer is made of copper.
6 . The foam of claim 1 , wherein the metal layer is a metal sheet or a metal-infused fabric.
7 . The foam of claim 1 , wherein the core material is made of polyurethane.
8 . An electronic device comprising
a first component;
a second components separate from the first component; and
a conductive compressible foam between the first component and the second components, the conductive compressible foam comprising:
a core material that is compressible,
a graphite layer extending over a periphery of the core material, and
a metal layer on the graphite layer for contacting the first component and the second component.
9 . The electronic device of claim 8 , wherein the first component generates heat and the second component dissipates the generated heat transferred from the first component via the conductive compressible foam.
10 . The electronic device of claim 8 , wherein the compressible conductive foam further comprises:
a first adhesive layer on a portion of the metal layer for securing the conductive foam to the first component; and
a second adhesive layer on another portion of the metal layer for securing the conductive foam to the second component.
11 . The electronic device of claim 10 , wherein the first adhesive layer and the second adhesive are pressure activated.
12 . The electronic device of claim 10 , wherein the metal layer wrap around the core material and edges of the metal layer partially overlap, and the second adhesive layer spans across the overlapping edges of the metal layer.
13 . The electronic device of claim 8 , wherein the metal layer is made of copper.
14 . The electronic device of claim 8 , wherein the metal layer is a metal sheet or a metal-infused fabric.
15 . The electronic device of claim 8 , wherein the core material is made of polyurethane.