IP Library Granted Patent US 12,002,795
Granted Patent B2
US 12,002,795 · App. 17/719,857 · Granted Jun 4, 2024

Pluggable CPU modules with vertical power

Inventors: Houle Gan (Santa Clara, CA); Richard Stuart Roy (Mountain View, CA); Yujeong Shim (Cupertino, CA); William F. Edwards, Jr. (Livermore, CA); Chenhao Nan (Santa Clara, CA)
Assignee: Google LLC
H01L25/162H05K1/11H05K1/183H01L24/16H01L2224/16225H05K2201/10015H05K2201/1003H05K2201/10159H05K2201/10166H05K2201/1053H05K2201/10704H05K2201/10719
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Quick Facts
Patent No.
US 12,002,795
App. No.
17/719,857
Granted
Jun 4, 2024
Kind
B2
Abstract

A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contacts that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board. An assembly includes the pluggable processor module and a printed circuit board assembly (“PCBA”) including a module aperture that is large enough to receive the power board and narrower than the capacitor board.

Claims (29)

1. An assembly comprising:

a pluggable processor module comprising:

a microprocessor package;

a voltage regulator including a capacitor board, a power board, and conductive pillars connecting the capacitor board to the power board; and

a contact that includes a first side in contact with the microprocessor package and a second side in contact with the capacitor board; and

a printed circuit board assembly (“PCBA”) including a module aperture that is large enough to receive the power board and narrower than the capacitor board.

2. The assembly of claim 1 , the contact is monolithic.

3. The assembly of claim 1 , wherein the capacitor board is wider than the microprocessor package.

4. The assembly of claim 1 , wherein the capacitor board includes an electronic communication interface on a side that faces away from the microprocessor package.

5. The assembly of claim 1 , wherein the voltage regulator comprises a power board and conductive pillars electrically connecting the capacitor board to the power board.

6. The assembly of claim 1 , wherein the PCBA includes a first electronic communication interface and the voltage regulator includes a second electronic communication interface configured to align with the first electronic communication interface when the power board is received in the module aperture.

7. The assembly of claim 1 , wherein the PCBA includes a first bolt hole and the capacitor board includes a second bolt hole located to be alignable with the first bolt hole when the power board is received in the module aperture.

8. The assembly of claim 1 , wherein the capacitor board is wider than the microprocessor package.

9. The assembly of claim 1 , wherein the module is among a plurality of pluggable processor modules each including a microprocessor package and a voltage regulator that includes a power board receivable in the module aperture.

10. The assembly of claim 1 , wherein the module aperture is a first module aperture and the PCBA includes a second module aperture that is large enough to receive the power board and narrower than the capacitor board.

11. The assembly of claim 1 , wherein the module aperture is a hole extending through the PCBA from a first side of the PCBA to a second side of the PCBA.

12. The assembly of claim 5 , wherein the capacitor board includes a bolt hole and a conductive line extending from the bolt hole to one of the conductive pillars.

13. The assembly of claim 5 , wherein the voltage regulator includes inductors extending through the power board and transistors on a side of the power board facing away from the capacitor board.

14. The assembly of claim 6 , wherein the first electronic communication interface is adjacent to the module aperture and the second electronic communication interface is on a side of the capacitor board that faces away from the microprocessor package.

15. The assembly of claim 6 , wherein the second electronic communication interface is a land grid array or a pin grid array.

16. The assembly of claim 6 , wherein the PCBA includes a memory aperture in electronic communication with the first electronic communication interface.

17. The assembly of claim 6 , wherein the PCBA is configured to supply power to the first electronic communication interface.

18. The assembly of claim 7 , wherein the PCBA is configured to supply voltage to the first bolt hole and the capacitor board includes a conductive line extending from the second bolt hole to one of the conductive pillars.

19. A method comprising plugging a pluggable processor module into a module aperture of a PCBA, wherein:

the pluggable processor module comprises:

a microprocessor package;

a voltage regulator including a capacitor board, a power board, and conductive pillars connecting the capacitor board to the power board; and

a contact that includes a first side in contact with the microprocessor package and a second side in contact with the capacitor board; and

plugging the pluggable processor module into the module aperture includes inserting a portion of the voltage regulator into the module aperture and placing an electronic communication interface of the PCBA in contact with an electronic communication interface of the pluggable processor module.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2022
From: GAN, HOULE; ROY, RICHARD STUART; SHIM, YUJEONG; EDWARDS, JR., WILLIAM F.; NAN, CHENHAO
To: GOOGLE LLC
Reel/Frame 059773/0837 →
Continuity (1)
Related Publication 20230335541A1 · Oct 19, 2023
Cited By (1)
US 12,206,209