IP Library Granted Patent US 12,308,505
Granted Patent B2
US 12,308,505 · App. 17/723,147 · Granted May 20, 2025

Connecting electrical circuitry in a quantum computing system

Inventors: Tristan Ossama El Bouayadi (Berkeley, CA); Damon Stuart Russell (Pasadena, CA); Jean-Philip Paquette (Berkeley, CA); Saniya Vilas Deshpande (Berkeley, CA)
Assignee: Rigetti & Co, LLC
H01P3/08G06N10/40H01P1/30H05K1/0203H05K1/0243H05K1/0245H05K1/147H01B7/04H01R12/79H05K1/0204H05K1/025H05K2201/1006
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,308,505
App. No.
17/723,147
Granted
May 20, 2025
Kind
B2
Abstract

In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.

Claims (37)

1. A flexible cable comprising:

a flexible strip with first and second parallel surfaces and first and second ends, the flexible strip being electrically insulating;

a first metal stripline within the flexible strip;

first and second metallic grounding planes on the first and second parallel surfaces, respectively; and

a mechanical stiffener material attached to at least an end portion of one of the first and second ends of the flexible cable to at least one of the first and second metallic grounding planes, wherein the mechanical stiffener material comprises a fiberglass composite.

2. The flexible cable of claim 1 , wherein the metal stripline is formed of superconducting material.

3. The flexible cable of claim 2 , wherein the metal stripline comprises a type-one superconducting metal.

4. The flexible cable of claim 2 , wherein the metal stripline comprises a type-two superconducting metal.

5. The flexible cable of claim 1 , further comprising a second metal stripline parallel to the metal stripline along a length of the flexible strip.

6. The flexible cable of claim 1 , further comprising a multiplicity of metallic vias through the flexible strip connecting the first and second metallic grounding planes, the metallic vias being arrayed on both sides of the metal stripline, wherein the metal stripline is within an electromagnetically shielded volume defined by the multiplicity of metallic vias and the first and second grounding planes.

7. The flexible cable of claim 6 , further comprising a second metal stripline parallel to the metal stripline along a length of the flexible strip, the metallic vias being arrayed on both sides of and between the metal stripline and the second metal stripline, wherein the metal stripline and the second metal stripline are within an electromagnetically shielded volume defined by the multiplicity of metallic vias and the first and second grounding planes.

8. The flexible cable of claim 1 , wherein the flexible strip comprises polyimide.

9. The flexible cable of claim 1 , wherein the flexible strip comprises KAPTON®.

10. The flexible cable of claim 6 , wherein the electromagnetic shielding is over at least a range comprising microwave frequencies.

11. The flexible cable of claim 1 , wherein the flexible strip comprises a composite material, the composite material comprising an insulating material and metallic particles for absorption of high-frequency electromagnetic waves.

12. The flexible cable of claim 1 , further comprising:

a second flexible strip on the second metallic grounding plane, a third metallic grounding plane on the surface of the second flexible strip wherein the second and third metallic grounding planes are parallel, the flexible strip being electrically insulating; and

a second layer metal stripline within the second flexible strip; and

wherein the second layer metal stripline is electrically connected to electrical circuitry on a first circuit board.

13. The flexible cable of claim 6 , further comprising:

a second flexible strip on the second metallic grounding plane, a third metallic grounding plane on the surface of the second flexible strip wherein the second and third metallic grounding planes are parallel, the flexible strip being electrically insulating;

a second multiplicity of metallic vias through the flexible strip connecting the third and second metallic grounding planes, the metallic vias being arrayed on both sides of the second layer metal stripline, wherein the second layer metal stripline is within an electromagnetically shielded volume defined by the second multiplicity of metallic vias and the third and second grounding planes;

a second layer metal stripline within the second flexible strip; and

wherein the second layer metal stripline is electrically connected to electrical circuitry on a first circuit board.

14. A cryogenic system comprising:

a plurality of isothermal plates; and

at least one flexible cable comprising:

a flexible strip with first and second parallel surfaces and first and second ends, the flexible strip being electrically insulating;

a first metal stripline within the flexible strip;

first and second metallic grounding planes on the first and second parallel surfaces, respectively; and

a mechanical stiffener material attached to at least an end portion of one of the first and second ends of the flexible cable to at least one of the first and second metallic grounding planes; and

a quantum processing unit electrically connected to the at least one flexible cable at the first end, the quantum processing unit comprising superconducting circuits, wherein the cryogenic system is configured for the flexible cable to carry one or more signals to the quantum processing unit; and

an electrical connector providing electrical connection of the at least one flexible cable and the quantum processing unit.

15. The cryogenic system of claim 14 , wherein the quantum processing unit comprises greater than or equal to fifty quantum bits.

16. The cryogenic system of claim 14 , wherein the quantum processing unit comprises greater than or equal to one hundred quantum bits.

17. The cryogenic system of claim 14 , wherein the at least one flexible cable passes through all of the plurality of isothermal plates, including a mixing plate, except for a room temperature plate, the second end being mechanically and thermally connected to the room temperature plate.

18. The cryogenic system of claim 14 , wherein the electrical connector is a compliant joint.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Dec 12, 2024
From: TRINITY CAPITAL INC.
To: RIGETTI & CO, LLC
Reel/Frame 069603/0771 →
RELEASE OF SECURITY INTEREST Recorded Dec 12, 2024
From: TRINITY CAPITAL INC.
To: RIGETTI & CO, LLC; RIGETTI INTERMEDIATE LLC; RIGETTI COMPUTING, INC.
Reel/Frame 069603/0831 →
AMENDED AND RESTATED INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Jul 8, 2024
From: RIGETTI & CO, LLC; RIGETTI INTERMEDIATE LLC; RIGETTI COMPUTING, INC.
To: TRINITY CAPITAL INC.
Reel/Frame 068146/0416 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2022
From: EL BOUAYADI, TRISTAN OSSAMA; RUSSELL, DAMON STUART; PAQUETTE, JEAN-PHILIP; DESHPANDE, SANIYA VILAS
To: RIGETTI & CO, INC.
Reel/Frame 059671/0362 →
CHANGE OF NAME Recorded Apr 21, 2022
From: RIGETTI & CO, INC.
To: RIGETTI & CO, LLC
Reel/Frame 059756/0937 →
Continuity (6)
Continuation 16903609 · Jun 17, 2020
Continuation 15981731 · May 16, 2018
Provisional Application 62634647 · Feb 23, 2018
Provisional Application 62594928 · Dec 5, 2017
Provisional Application 62506881 · May 16, 2017
Related Publication 20230067066A1 · Mar 2, 2023
References Cited (66)
US 3482201A · Schneck · 1969 [cited by examiner]
US 5041003A · Smith · 1991 [cited by examiner]
US 5083238A · Bousman · 1992 [cited by examiner]
US 5156553A · Katsumata · 1992 [cited by examiner]
US 5251095A · Miller · 1993 [cited by examiner]
US 5856678A · Hey-Shipton et al. · 1999 [cited by applicant]
US 5856768A · Hey-Shipton · 1999 [cited by examiner]
US 6055722A · Tighe · 2000 [cited by examiner]
US 6202439B1 · Mikheev et al. · 2001 [cited by applicant]
US 6366185B1 · Keesey · 2002 [cited by examiner]
US 6930240B1 · Giboney · 2005 [cited by examiner]
US 7429702B2 · Kobayashi · 2008 [cited by examiner]
US 9524470B1 · Chow · 2016 [cited by examiner]
US 10141493B2 · Tuckerman · 2018 [cited by examiner]
US 10269469B2 · Yosui · 2019 [cited by examiner]
US 10681842B1 · Hart et al. · 2020 [cited by applicant]
US 10734696B2 · El Bouayadi et al. · 2020 [cited by applicant]
US 10855010B2 · Kato · 2020 [cited by examiner]
US 20040108921A1 · Sacco · 2004 [cited by examiner]
US 20040159460A1 · Passiopoulos · 2004 [cited by examiner]
US 20050012199A1 · Rosenau · 2005 [cited by examiner]
US 20050136703A1 · Van Schuylenbergh · 2005 [cited by examiner]
US 20050256007A1 · Amin et al. · 2005 [cited by applicant]
US 20070066126A1 · Dutta · 2007 [cited by examiner]
US 20090000804A1 · Kobayashi · 2009 [cited by examiner]
US 20100182105A1 · Hein · 2010 [cited by examiner]
US 20120132458A1 · Sekine · 2012 [cited by examiner]
US 20130121702A1 · Han · 2013 [cited by examiner]
US 20140014409A1 · Lin · 2014 [cited by examiner]
US 20140111291A1 · Kinpara · 2014 [cited by examiner]
US 20140147128A1 · Han et al. · 2014 [cited by applicant]
US 20140262448A1 · Kato · 2014 [cited by examiner]
US 20150018055A1 · Yosui · 2015 [cited by examiner]
US 20150091676A1 · Kato · 2015 [cited by examiner]
US 20150229016A1 · Biddle · 2015 [cited by applicant]
US 20160007510A1 · Cheng · 2016 [cited by examiner]
US 20160087598A1 · Thom et al. · 2016 [cited by applicant]
US 20160087698A1 · Thom et al. · 2016 [cited by applicant]
US 20160125311A1 · Fuechsle · 2016 [cited by examiner]
US 20160268666A1 · Wakabayashi · 2016 [cited by examiner]
US 20160362627A1 · Worthington · 2016 [cited by examiner]
US 20160372811A1 · Yosui · 2016 [cited by examiner]
US 20170125870A1 · Baba · 2017 [cited by examiner]
US 20170149111A1 · Yosui · 2017 [cited by examiner]
US 20180048044A1 · Ou · 2018 [cited by examiner]
US 20180083334A1 · Petrovic et al. · 2018 [cited by applicant]
US 20180270949A1 · Fukumori · 2018 [cited by applicant]
US 20180294401A1 · Tuckerman · 2018 [cited by examiner]
US 20190157763A1 · Kato · 2019 [cited by examiner]
US 20190267692A1 · Roberts · 2019 [cited by examiner]
US 20210111470A1 · El Bouayadi et al. · 2021 [cited by applicant]
WO 2016199029 · 2016 [cited by applicant]
WIPO, International Search Report and Written Opinion mailed Sep. 11, 2018, in PCT/US2018/033031, 17 pgs. [cited by applicant]
USPTO, Third Party Submission filed Apr. 10, 2019, in U.S. Appl. No. 15/981,731, 51 pgs. [cited by applicant]
EPO, Extended European Search Report mailed Jan. 28, 2021, in EP 18801848.5, 9 pgs. [cited by applicant]
Delft Circuits , “Cryogenic Circuit Technologies”, Brochure distributed at APS March Meeting, Mar. 2017, 5 pages. [cited by applicant]
Geller, M. R., et al., “Quantum Computing with Superconductors I: Architectures”, arXiv:quant-ph/0603224v1, Mar. 24, 2006, 24 pages. [cited by applicant]
Liu, et al., “Common-Mode Filters with Interdigital Fingers for Harmonics Suppression and Lossy Materials for Broadband Suppression”, IEEE Transactions on Electromagnetic Compatibility, vol. 57, No. 6, Dec. 6, 2015, 9 p… [cited by applicant]
National Security Agency , “Superconducting Technology Assessment”, Office of Corporate Assessments, dated Aug. 2005, 257 pgs. [cited by applicant]
Rodger, D. C., “Flexible Circuit Technologies for Biomedical Applications”, Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies, May 2013, 41 pages. [cited by applicant]
Tuckerman, D. B., et al., “Flexible superconducting Nb transmission lines on thin film polyimide for quantum computing applications”, Supercond. Sci. Technol. 29 (2016) 084007, Jul. 11, 2016, 13 pages. [cited by applicant]
Van Weers , et al., “Niobium flex cable for low temperature high density interconnects”, Cryogenics 55-56, 1-4, 2013, 4 pgs. [cited by applicant]
Walter , et al., “Laminated NbTi-on-Kapton Microstrip Cables for Flexible Sub-Kelvin RF Electronics”, IEEE Transactions on Applied Superconductivity, vol. 28, No. 1, Jan. 2018, 5 pgs. [cited by applicant]
Webber, R. J., et al., “Operation of YBCO current leads as bias lines to cryocooler-mounted 4 K superconducting electronics”, Physics Procedia 36 (2012) 256-261, 2012, 6 pages. [cited by applicant]
EPO, Communication pursuant to Article 94(3) issued in Application No. 18801848.5 on Mar. 21, 2024, 4 pages. [cited by applicant]
EPO, Extended European Search Report issued in Application No. 24211641.6 on Feb. 12, 2025, 9 pages. [cited by applicant]