IP Library Granted Patent US 12,179,463
Granted Patent B2
US 12,179,463 · App. 17/723,728 · Granted Dec 31, 2024

Recyclable paper with polymeric barrier layer and method of recycling the same

Inventor: Scott William Huffer (Hartsville, SC)
Assignee: Sonoco Development, Inc.
B32B29/002B32B7/12B32B15/08B32B27/308B32B2250/03B32B2255/26B32B2307/31B32B2307/718
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Quick Facts
Patent No.
US 12,179,463
App. No.
17/723,728
Granted
Dec 31, 2024
Kind
B2
Abstract

A recyclable structure and methods of recycling are provided herein. A recyclable structure for use in packaging comprises a paper layer, and a polymeric film layer. An adhesive layer adhesively joins the paper layer and the polymeric layer. The adhesive layer comprises an acrylic or a urethane adhesive. The recyclable structure 85% by subjecting the structure to mechanical stresses and repulping. The adhesive layer has a greater affinity for the polymeric film layer than the paper layer. Upon repulping the adhesive layer is mostly separated from the fibers within the paper layer.

Claims (25)

1. A recyclable structure for use in packaging, the structure comprising:

a paper layer forming an exterior layer of the structure;

a polymeric layer forming an interior layer of the structure;

an adhesive layer adhesively joining the paper layer and the polymeric layer, wherein the adhesive layer has a greater affinity for the polymeric layer than the paper layer such that when exposed to mechanical stress the adhesive layer fractures internally into at least a first portion adjacent the paper layer and a second portion adjacent the polymeric layer and wherein, in a cross-section of the layers, the first portion is smaller than the second portion.

2. The structure of claim 1 , wherein the adhesive layer is releasable from the paper layer upon repulping.

3. The structure of claim 1 , wherein the polymeric layer includes a barrier layer.

4. The structure of claim 3 , wherein the barrier layer is aluminum oxide.

5. The structure of claim 3 , wherein the barrier layer is transparent.

6. The structure of claim 3 , further comprising a coating layer disposed adjacent either the polymeric layer or the barrier layer.

7. The structure of claim 6 , wherein the coating layer is a heat seal.

8. The structure of claim 7 , wherein the heat seal is polyester, styrene acrylic, or styrene butadiene.

9. The structure of claim 6 , wherein the coating layer is a cold seal.

10. The structure of claim 3 , wherein paper layer comprises a plurality of exposed fibers on an inner surface thereof, and wherein the adhesive layer is configured to prevent the polymeric layer or the barrier layer from binding with or encapsulating the plurality of exposed fibers.

11. The structure of claim 1 , wherein the structure is at least 90% paper by weight.

12. The structure of claim 1 , wherein at least 80% by weight of the paper layer is recovered upon recycling of the structure.

13. The structure of claim 1 , wherein the adhesive layer has a thickness of less than 10 microns.

14. The structure of claim 13 , wherein the adhesive layer has a thickness of less than 6 microns.

15. The structure of claim 1 , wherein the adhesive layer is transparent.

16. A recyclable structure for use in packaging, the structure comprising:

a paper layer defining a first surface and a second surface;

an adhesive layer disposed adjacent the second surface;

a polymeric layer disposed adjacent the adhesive layer, opposite the paper layer, wherein the adhesive layer has an affinity for the polymeric layer, such that when exposed to mechanical stress the adhesive layer fractures internally into at least a first portion adjacent the paper layer and a second portion adjacent the polymeric layer and wherein, in a cross-section of the layers, the first portion is smaller than the second portion; and

a barrier layer disposed on the polymeric layer.

17. The structure of claim 16 , wherein the adhesive layer is an acrylic or urethane based adhesive.

18. The structure of claim 16 , wherein the barrier layer is aluminum oxide.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2025
From: SONOCO DEVELOPMENT, INC.
To: TOPPAN PACKAGING AMERICAS HOLDINGS, INC.
Reel/Frame 071338/0486 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2023
From: HUFFER, SCOTT WILLIAM
To: SONOCO DEVELOPMENT, INC.
Reel/Frame 064202/0152 →