Silicon precursor compounds and method for forming silicon-containing films
Provided are certain silicon precursor compounds which are useful in the formation of silicon-containing films in the manufacture of semiconductor devices, and more specifically to compositions and methods for forming such silicon-containing films, such as films comprising silicon dioxide.
1. A method for forming a silicon-containing film on a surface of a microelectronic device in a reaction zone, which comprises introducing
to said reaction zone, under vapor deposition conditions.
2. The method of claim 1 , wherein the vapor deposition conditions are chosen from chemical vapor deposition (CVD), atomic layer deposition (ALD), plasma-enhanced ALD (PEALD), plasma enhanced cyclical chemical vapor deposition (PECCVD), a flowable chemical vapor deposition (FCVD), or a plasma-enhanced ALD-like process.
3. The method of claim 1 , wherein said silicon-containing film is chosen from silicon dioxide, silicon nitride, silicon oxynitride, silicon carbide, silicon carbonitride, silicon oxycarbonitride, low-k thin silicon-containing films, high-k gate silicate films and low temperature silicon epitaxial films.
4. The method of claim 1 , wherein the surface is chosen from silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, aluminum, tungsten, copper, cobalt, molybdenum, ruthenium, a silicon wafer, or combinations thereof.
5. The method of claim 1 , wherein the vapor deposition conditions comprise atomic layer deposition conditions, at a temperature of about 100° C. to about 1000° C.
6. The method of claim 1 , wherein the vapor deposition conditions comprise atomic layer deposition conditions at a temperature of about 100° C. to about 800° C.
7. The method of claim 1 , wherein the vapor deposition conditions comprise atomic layer deposition conditions at a temperature of about 500 to about 750° C.
8. The method of claim 1 , wherein the vapor deposition conditions comprise a gas chosen from H 2 , H 2 plasma, H 2 /O 2 mixtures, water, N 2 O, N 2 O plasma, NH 3 , NH 3 plasma, N 2 , or N 2 plasma.
9. The method of claim 1 , wherein the vapor deposition conditions comprise atomic layer deposition conditions with an oxidizing gas chosen from oxygen, oxygen plasma, and ozone.
10. The method of claim 9 , wherein the oxidizing gas is ozone.
11. The method of claim 10 , wherein the silicon-containing film is silicon dioxide, and wherein the silicon dioxide film thus formed exhibits a 200:1 dilute hydrogen fluoride solution wet etch rate which is at least about 70% improved compared to that of SiO 2 deposited with bis(tertiary-butylamino) silane (BTBAS) and ozone.