Semiconductor package
A semiconductor package includes a semiconductor chip comprising an active surface and an inactive surface facing each other. At least one antenna module is arranged adjacent to the semiconductor chip. The at least one antenna module comprises a main antenna and a sub-antenna. A redistribution structure is disposed on the semiconductor chip and the at least one antenna module. The redistribution structure electrically connects the active surface of the semiconductor chip to the at least one antenna module. A molding member surrounds the semiconductor chip and the at least one antenna module. The inactive surface of the semiconductor chip and the main antenna are exposed from the molding member, and the sub-antenna is covered by the molding member.
1. A semiconductor package comprising:
a semiconductor chip comprising an active surface and an inactive surface facing each other;
at least one antenna module arranged adjacent to the semiconductor chip, the at least one antenna module comprising a main antenna and a sub-antenna;
a redistribution structure disposed on the semiconductor chip and the at least one antenna module, the redistribution structure electrically connecting the active surface of the semiconductor chip to the at least one antenna module; and
a molding member surrounding the semiconductor chip and the at least one antenna module, wherein the molding member the semiconductor chip and the main antenna are co-planar with each other in a thickness direction of the semiconductor package,
wherein the inactive surface of the semiconductor chip and the main antenna are exposed from the molding member, and the sub-antenna is covered by the molding member.
2. The semiconductor package of claim 1 , wherein:
the at least one antenna module comprises a printed circuit board; and
the printed circuit board comprises a plurality of wiring layers electrically connecting each of the main antenna and the sub-antenna to the redistribution structure.
3. The semiconductor package of claim 2 , further comprising an antenna protection layer disposed on the main antenna.
4. The semiconductor package of claim 1 , wherein a thickness of the at least one antenna module is greater than or equal to a thickness of the semiconductor chip.
5. The semiconductor package of claim 1 , wherein:
the at least one antenna module includes a plurality of parts that are spaced apart from each other; and
the plurality of parts are spaced apart from one side surface of the semiconductor chip by a first interval.
6. The semiconductor package of claim 1 , wherein a level of an uppermost surface of the semiconductor chip, a level of an uppermost surface of the at least one antenna module, and a level of an uppermost surface of the molding member are substantially identical to each other.
7. The semiconductor package of claim 1 , wherein:
the main antenna comprises a patch antenna arranged on an upper surface of the antenna module; and
the sub-antenna comprises a Yagi antenna arranged on a side surface of the antenna module.
8. The semiconductor package of claim 7 , wherein, in a planar view, patches of the main antenna are arranged in a plurality of rows and columns.
9. The semiconductor package of claim 1 , wherein, in the semiconductor package, the main antenna is exposed to the outside.
10. The semiconductor package of claim 1 , further comprising an external connection member arranged under the redistribution structure,
wherein the semiconductor package comprises a fan-out wafer level package.
11. A semiconductor package comprising:
a semiconductor chip comprising an active surface and an inactive surface facing each other;
at least one antenna module arranged adjacent to the semiconductor chip, the at least one antenna module comprising a main antenna and a sub-antenna, the main antenna and the sub-antenna are disposed on a same layer as each other,
a redistribution structure disposed on the semiconductor chip and the at least one antenna module, the redistribution structure electrically connecting the active surface of the semiconductor chip to the at least one antenna module;
a molding member surrounding the semiconductor chip and the at least one antenna module, wherein the molding member, the semiconductor chip and the at least one antenna module are co-planar with each other in a thickness direction of the semiconductor package; and
a heat discharging member arranged on the semiconductor chip,
wherein the main antenna is exposed from the molding member, and the sub-antenna is covered by the molding member, and
a thickness of the at least one antenna module is greater than a thickness of the semiconductor chip.
12. The semiconductor package of claim 11 , wherein:
the inactive surface of the semiconductor chip directly contacts a lower surface of the heat discharging member;
a level of an upper surface of the at least one antenna module is higher than a level of the lower surface of the heat discharging member; and
the level of the upper surface of the at least one antenna module is lower than a level of an upper surface of the heat discharging member.
13. The semiconductor package of claim 12 , wherein a portion of a side surface of the at least one antenna module is exposed from the molding member.
14. The semiconductor package of claim 11 , wherein the at least one antenna module comprises a printed circuit board,
wherein the printed circuit board comprises:
a first wiring layer electrically connecting the main antenna to the redistribution structure; and
a second wiring layer electrically connecting the sub-antenna to the redistribution structure.
15. The semiconductor package of claim 11 , wherein:
the main antenna comprises a patch antenna arranged on an upper surface of the at least one antenna module;
the sub-antenna comprises a Yagi antenna arranged on a side surface of the antenna module; and
the semiconductor package comprises a fan-out wafer level package.
16. A semiconductor package comprising:
a semiconductor chip comprising an active surface and an inactive surface facing each other;
a molding member comprising an opening in a portion thereof, and surrounding the semiconductor chip;
at least one antenna module arranged in the opening of the molding member, the at least one antenna module comprising a main antenna and a sub-antenna on a printed circuit board, wherein the molding member, the semiconductor chip and the main antenna are co-planar with each other in a thickness direction of the semiconductor package;
a redistribution structure arranged under the semiconductor chip, the molding member, and the at least one antenna module, the redistribution structure electrically connecting the active surface of the semiconductor chip to the at least one antenna module; and
an external connection member arranged under the redistribution structure,
wherein the main antenna is exposed to the outside from the molding member, and the sub-antenna directly contacts the molding member.
17. The semiconductor package of claim 16 , wherein the printed circuit board comprises:
a base board; and
a wiring layer configured to penetrate the base board, the wiring layer electrically connecting the redistribution structure to the main antenna, and the redistribution structure to the sub-antenna.
18. The semiconductor package of claim 16 , wherein:
the main antenna comprises a patch antenna having a plurality of rows and columns and arranged on an upper surface of the antenna module,
the sub-antenna comprises a Yagi antenna arranged on a side surface of the antenna module, and
the semiconductor package comprises a fan-out wafer level package.
19. The semiconductor package of claim 18 , wherein:
the patch antenna includes a plurality of parts that are separated from each other; and
the plurality of parts are spaced apart from one side surface of the semiconductor chip by a first interval.
20. The semiconductor package of claim 16 , further comprising a heat discharging member arranged to directly contact the inactive surface of the semiconductor chip.