Granted Patent B2

US 12,419,009 · App. 17/738,038 · Granted Sep 16, 2025

Inventors: Xi Yang (Guangdong, CN); Zhao Lu (Guangdong, CN); Kailun Zhang (Guangdong, CN); Weiyang Lai (Guangdong, CN); Lichuan Wei (Guangdong, CN); Zhiqiang Cai (Guangdong, CN)

Assignee: SHENZHEN ENVICOOL TECHNOLOGY CO., LTD.

H05K7/20254H05K7/20272

Abstract

Claims (20)

1. A cooling device, comprising:

a buffer member;

a cover plate; and

a bottom plate;

wherein the buffer member and the bottom plate are respectively located at two sides of the cover plate, the cover plate is covered with the bottom plate to form a flow passage, a water inlet and a water outlet are defined on the cover plate,

wherein an inlet buffer zone and an outlet buffer zone are defined in the buffer member, liquid flows into the flow passage through the inlet buffer zone, and flows out of the flow passage through the outlet buffer zone,

wherein the buffer member further comprises a water inlet pipe and a water outlet pipe, the water inlet pipe is in communication with the inlet buffer zone, and the water outlet pipe is in communication with the outlet buffer zone,

wherein the water inlet pipe and the water outlet pipe are located on a same side of the cooling plate and are arranged in parallel in a plane of the cooling plate, the inlet buffer zone and the outlet buffer zone are located on a same side of the cooling plate, and the outlet buffer zone is spaced apart from the inlet buffer zone,

wherein a first right-angle passage is formed between the water inlet pipe and the inlet buffer zone, and a second right-angle passage is formed between the inlet buffer zone and the flow passage,

wherein a third right-angle passage is formed between the outlet buffer zone and the flow passage, and a fourth right-angle passage is formed between the water outlet pipe and the outlet buffer zone.

2. The cooling device according to claim 1 , wherein the water inlet pipe and the water outlet pipe are connected to the buffer member along a length direction of the cooling device, and the buffer member is connected to the cooling plate along a thickness direction of the cooling device.

3. The cooling device according to claim 1 , wherein along the thickness direction of the cooling device, a thickness of the buffer member is larger than an outer diameter of the water inlet pipe and is larger than an outer diameter of the water outlet pipe.

4. The cooling device according to claim 1 , wherein the flow passage comprises a first buffer section and a second buffer section;

the first buffer section is arranged close to the inlet buffer zone for buffering a pressure of the liquid flowing into the cooling plate;

the second buffer section is arranged close to the outlet buffer zone for buffering a pressure of the liquid flowing out of the cooling plate.

5. The cooling device according to claim 4 , wherein the flow passage further comprises a water inlet section, a water outlet section and a cooling section, and the water inlet section, the first buffer section, the cooling section, the second buffer section and the water outlet section are in communication in a listed sequence;

the water inlet section is corresponding to the inlet buffer zone in position, and the water outlet section is corresponding to the outlet buffer zone in position;

in a length direction of the cooling device, the first buffer section is inclined to the cooling section relative to the water inlet section;

in the length direction of the cooling device, the second buffer section is inclined to the cooling section relative to water outlet section.

6. An electronic device comprising the cooling device according to claim 1 .

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (14)