Heat sink that varies in height
A heat sink for cooling computing devices such as in a data center is disclosed. The heat sink includes a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side. The plurality of fin stages have a height that increases from the intake side to the exhaust side.
1. A heat sink for cooling computing devices, comprising: a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side; wherein a height of the plurality of fin stages increases from the intake side to the exhaust side; and a plurality of air separators extending from the intake side downstream to a corresponding one of the plurality of fin stages, wherein the plurality of air separators are positioned at a different height relative to one another.
2. The heat sink of claim 1 , wherein the height of the plurality of fin stages increases successively with a shortest one of the plurality of fin stages being disposed proximate to the intake side and a tallest one of the plurality of fin stages being disposed proximate to the exhaust side.
3. The heat sink of claim 1 , wherein the height of each of the plurality of fin stages increases by 5%-25% from the intake side to the exhaust side.
4. The heat sink of claim 1 , wherein the plurality of fin stages have a width that increases from the intake side to the exhaust side.
5. The heat sink of claim 1 , wherein the plurality of air separators comprise baffles.
6. The heat sink of claim 5 , wherein each of the plurality of air separators have a different longitudinal extent from one another.
7. The heat sink of claim 1 , wherein the plurality of fin stages are separated by a spacing from one another.
8. A system for cooling computing devices, comprising: a casing having an air inlet and an air outlet; a chip board arranged within the casing; a heat sink disposed on the chip board, the heat sink including a plurality of fin stages arranged in spaced relation from one another between the air inlet and the air outlet; wherein the plurality of fin stages have a height that increases from the air inlet to the air outlet; and wherein the casing includes a plurality of air separators of different lengths extending from the air inlet in a downstream direction, wherein the plurality of air separators are disposed at different heights relative to the chip board to separate air for the plurality of fin stages.
9. The system of claim 8 , wherein the plurality of fin stages have a width that increases from the air inlet to the air outlet.
10. The system of claim 8 , wherein the plurality of air separators comprise baffles and/or the plurality of air separators are formed integrally with the casing.
11. The system of claim 8 , further comprising a first fan disposed at the air inlet and a second fan disposed at the air outlet.
12. The heat sink of claim 1 , further comprising a shroud configured to divert incoming air toward a first fin stage of the plurality of fin stages.
13. The heat sink of claim 12 , wherein the shroud extends toward and short of the first fin stage.
14. The heat sink of claim 1 , further comprising a shroud configured to divert incoming air toward at least one fin stage of the plurality of fin stages that would otherwise flow over the at least one fin stage.
15. The system of claim 8 , further comprising a shroud connected to the casing and configured to divert incoming air toward a first fin stage of the plurality of fin stages.
16. The system of claim 15 , wherein the shroud extends toward and short of the first fin stage.
17. The system of claim 8 , further comprising a shroud connected to the casing and configured to divert incoming air toward at least one fin stage of the plurality of fin stages that would otherwise flow over the at least one fin stage.