Method of manufacturing an ultrasonic probe
The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.
1. A method of manufacturing a backing, comprising:
a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames;
after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and
a laminating process, in which the plurality of backing plates are laminated; wherein
in the plate manufacturing process, for each lead frame, a masking sheet is provided on one side of the lead frame, and a mold is provided on the other side of the lead frame, and the backing material is poured into a space surrounded by the masking sheet and the mold.
2. The method of manufacturing a backing of claim 1 , wherein
the masking sheet has viscosity, and
the backing material is poured into the space in a state in which the lead row is temporarily fixed on the masking sheet.
3. The method of manufacturing a backing of claim 1 , wherein
in the coating forming process, the insulating coating is formed also with respect to a frame body in each lead frame.