Apparatus, system, and method for integrating conductive coil with injection-molded housing
The disclosed coil-integrated housing component may include an injection-molded housing dimensioned to house a display module of a computing device. Additionally, the coil-integrated housing component may include a conductive coil integrated into the injection-molded housing to surround a periphery of the display module, wherein the conductive coil may be electronically coupled to the computing device. Various other apparatuses, systems, and methods are also disclosed.
1. A coil-integrated housing component comprising:
an injection-molded housing dimensioned to house a display module of a computing device; and
a conductive coil integrated into the injection-molded housing to surround a periphery of the display module, wherein the conductive coil is electronically coupled to the computing device.
2. The coil-integrated housing component of claim 1 , wherein the injection-molded housing comprises a solid resin material cured from a fluid resin material.
3. The coil-integrated housing component of claim 1 , wherein the injection-molded housing is dimensioned to frame a display screen of the display module such that the display screen is visibly exposed.
4. The coil-integrated housing component of claim 3 , wherein the injection-molded housing encapsulates the display module to minimize a gap between the injection-molded housing and an edge of the display screen.
5. The coil-integrated housing component of claim 1 , wherein the conductive coil comprises a flexible metal shaped to wrap around the periphery of the display module at least one turn.
6. The coil-integrated housing component of claim 1 , wherein the conductive coil is dimensioned to function as an antenna to detect an electromagnetic signal through a material of the injection-molded housing.
7. The coil-integrated housing component of claim 1 , wherein the conductive coil generates an electrostatic field that detects a user's touch to the injection-molded housing.
8. The coil-integrated housing component of claim 1 , wherein the conductive coil is integrated into the injection-molded housing to increase a mechanical stability of the injection-molded housing.
9. A computing device comprising:
a display module with a display screen visible to a user of the computing device;
a coil-integrated housing component dimensioned to house the display module, wherein a conductive coil of the coil-integrated housing component surrounds a periphery of the display module; and
a substantially transparent cover coupled to the coil-integrated housing component such that the cover overlaps the display screen of the display module.
10. The computing device of claim 9 , wherein the display module comprises at least one of:
a polarizer;
an organic light-emitting diode (OLED) panel;
a printed circuit board (PCB); or
optically clear adhesive (OCA).
11. The computing device of claim 9 , wherein the display screen comprises a bendable OLED panel partially housed by the coil-integrated housing component.
12. The computing device of claim 9 , wherein the coil-integrated housing component is dimensioned to frame the display screen such that a gap between the coil-integrated housing component and an edge of the display screen is minimized.
13. The computing device of claim 9 , wherein the conductive coil is dimensioned to function as an antenna to receive an electromagnetic signal to the computing device.
14. The computing device of claim 9 , wherein the conductive coil generates an electrostatic field that detects a user's touch to the coil-integrated housing component.
15. The computing device of claim 14 , wherein the user's touch activates at least one of:
a touch function of the computing device; or
a gesture function of the computing device.
16. The computing device of claim 9 , wherein the cover is coupled to the display module with OCA.
17. A method of manufacturing comprising:
wrapping a conductive coil at least one turn, wherein the conductive coil is dimensioned to surround a periphery of a display module of a computing device; and
injecting a fluid resin material into a mold to contain the conductive coil, wherein the mold is dimensioned to create an injection-molded housing dimensioned to house the display module.
18. The method of claim 17 , wherein the conductive coil is electronically coupled to the computing device.
19. The method of claim 17 , further comprising curing the fluid resin material such that the injection-molded housing comprises a solid resin material.
20. The method of claim 19 , further comprising inserting the conductive coil into the cured injection-molded housing.