IP Library Granted Patent US 12,298,749
Granted Patent B2
US 12,298,749 · App. 17/748,241 · Granted May 13, 2025

Method and device for predicting defects

Inventors: Taelim Choi (Seoul, KR); Jun Haeng Lee (Hwaseong-si, KR)
Assignee: Samsung Electronics Co., Ltd.
G05B19/41875G05B2219/32222
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Quick Facts
Patent No.
US 12,298,749
App. No.
17/748,241
Granted
May 13, 2025
Kind
B2
Abstract

A method and device for predicting a defect. The method includes determining a sequence between a plurality of sub-models by modeling a production process into the plurality of sub-models, mapping production process data into each of the plurality of sub-models, determining, by a corresponding sub-model, output data comprising defect information on a potential defect occurring in a corresponding step, for each of the plurality of sub-models, predicting information associated with a defect in the production process based on the output data corresponding to each of the plurality of sub-models, and inputting the output data of each of the sub-models to a subsequent sub-model of the corresponding sub-model, based on the sequence.

Claims (52)

1. A processor-implemented defect prediction method, comprising:

determining a sequence, being a sequential order of execution of a plurality of sub-models, by modeling a production process into the plurality of sub-models;

mapping production process data into each of the plurality of sub-models;

determining, by a corresponding sub-model, output data comprising defect information on a potential defect occurring in a corresponding step based on predicted third data of the corresponding sub-model and measured third data, for each of the plurality of sub-models;

predicting information associated with a defect in the production process based on the output data corresponding to each of the plurality of sub-models; and

inputting the output data of each of the sub-models to a subsequent sub-model of the corresponding sub-model, based on the sequence.

2. The processor-implemented defect prediction method of claim 1 , further comprising:

obtaining the production process data.

3. The processor-implemented defect prediction method of claim 1 , wherein the production process data comprises any one of or any combination of:

first data measured as the production process is performed;

second data processed based on the first data; and

the measured third data measured to determine whether a defect is present.

4. The processor-implemented defect prediction method of claim 1 , wherein the determining of the output data comprises:

receiving previous output data of a previous sub-model of the corresponding sub-model; and

determining the output data of the corresponding sub-model based on the previous output data and the production process data of the corresponding sub-model.

5. The processor-implemented defect prediction method of claim 4 , wherein the determining of the output data of the corresponding sub-model comprises:

predicting the predicted third data of the corresponding sub-model based on the previous output data, first data of the corresponding sub-model, and second data of the corresponding sub-model; and

determining final third data based on the predicted third data and the measured third data.

6. The processor-implemented defect prediction method of claim 5 , wherein the determining of the final third data comprises:

determining the measured third data to be the final third data in response to the measured third data being present; and

determining the predicted third data to be the final third data in response to the measured third data being absent.

7. The processor-implemented defect prediction method of claim 5 , wherein the determining of the output data of the corresponding sub-model comprises:

generating latent space information of the corresponding sub-model based on the previous output data, the first data of the corresponding sub-model, and the second data of the corresponding sub-model; and

determining the output data based on any one of or any combination of the first data of the corresponding sub-model and the second data of the corresponding sub-model, the final third data, and the latent space information.

8. The processor-implemented defect prediction method of claim 1 , wherein the mapping of the production process data into each of the plurality of sub-models comprises dividing the production process data based on steps.

9. The processor-implemented defect prediction method of claim 1 , wherein the determining of the sequence comprises determining the sequence between the plurality of sub-models based on any one of or any combination of a temporal order and a physical correlation of the production process.

10. A non-transitory computer-readable storage medium storing instructions that, when executed by a processor, cause the processor to perform the defect prediction method of claim 1 .

11. A defect prediction device, comprising:

a processor configured to:

determine a sequence, being a sequential order of execution of a plurality of sub-models, by modeling a production process into the plurality of sub-models,

map production process data into each of the plurality of sub-models, determine, by a corresponding sub-model, output data comprising defect information on a potential defect occurring in a corresponding step based on predicted third data of the corresponding sub-model and measured third data, for each of the plurality of sub-models, and

predict information associated with a defect in the production process based on the output data corresponding to each of the plurality of sub-models,

wherein the output data of each of the sub-models is input to a subsequent sub-model of the corresponding sub-model, based on the sequence.

12. The defect prediction device of claim 11 , wherein the processor is configured to obtain the production process data.

13. The defect prediction device of claim 11 , wherein the production process data comprises any one of or any combination of:

first data measured as the production process is performed;

second data processed based on the first data; and

the measured third data measured to determine whether a defect is present.

14. The defect prediction device of claim 11 , wherein the processor is configured to:

receive previous output data of a previous sub-model of the corresponding sub-model; and

determine the output data of the corresponding sub-model based on the previous output data and the production process data of the corresponding sub-model.

15. The defect prediction device of claim 14 , wherein the processor is configured to:

predict the predicted third data of the corresponding sub-model based on the previous output data, the first data of the corresponding sub-model, and the second data of the corresponding sub-model; and

determine final third data based on the predicted third data and the measured third data.

16. The defect prediction device of claim 15 , wherein the processor is configured to:

determine the measured third data to be the final third data in response to the measured third data being present; and

determine the predicted third data to be the final third data in response to the measured third data being absent.

17. The defect prediction device of claim 15 , wherein the processor is configured to:

generate latent space information of the corresponding sub-model based on the previous output data, the first data of the corresponding sub-model, and the second data of the corresponding sub-model; and

determine the output data based on any one of or any combination of the first data of the corresponding sub-model and the second data of the corresponding sub-model, the final third data, and the latent space information.

18. The defect prediction device of claim 11 , wherein the processor is configured to divide the production process data based on steps.

19. The defect prediction device of claim 11 , wherein the processor is configured to determine the sequence between the plurality of sub-models based on any one of or any combination of a temporal order and a physical correlation of the production process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2022
From: CHOI, TAELIM; LEE, JUN HAENG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 059956/0993 →
Priority Claims (1)
KR 10-2021-0110942 · Aug 23, 2021 · national
Continuity (1)
Related Publication 20230054159A1 · Feb 23, 2023
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