Systems for cooler devices and cooling manifolds
Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.
1. A cooler device comprising:
a manifold constructed at least partially of silicon, comprising:
an array of inlet channels, each inlet channel having a first depth;
an array of outlet channels interlaced with the array of inlet channels, each outlet channel having a second depth that is larger than the first depth, each of the array of outlet channels having a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels;
a manifold case configured to be in contact with a cold plate and encapsulate the manifold, the array of inlet channels, and the array of outlet channels, the manifold case comprising:
a fluid inlet;
a fluid outlet, wherein the fluid inlet is for receiving coolant into the manifold, and the fluid outlet is for removing the liquid coolant from the; and
at least one vapor outlet, wherein the at least one vapor outlet is for removing a vapor from the manifold.
2. The cooler device of claim 1 , wherein the manifold further comprises an array of inlet guides configured to direct coolant to each inlet channel.
3. The cooler device of claim 2 , wherein:
a center axis of each inlet guide is coaxial to a center axis of each outlet channel;
each inlet guide tapers outwardly away from the center axis of each inlet guide; and
a pair of inlet guides of the array of inlet guides direct coolant to an inlet channel of the array of inlet channels.
4. The cooler device of claim 1 , wherein each inlet channel comprises a plurality of spacer elements disposed along a length of each inlet channel, each of the plurality of spacer elements defining a jetted nozzle profile and are configured to distribute coolant by fluid capillary wicking action along the length of each inlet channel.
5. The cooler device of claim 1 , wherein each inlet channel comprises a plurality of jetted inlets.
6. The cooler device of claim 5 , wherein each of the plurality of jetted inlets comprise a plurality of steps decreasing in width as each jetted inlet extends away from a top surface of each inlet channel.
7. The cooler device of claim 5 , wherein each of the plurality of jetted inlets define a tapered profile decreasing in width as each jetted inlet extends away from a top surface of each inlet channel.
8. The cooler device of claim 1 , wherein the manifold is bonded to an array of bonding posts disposed on a cold plate.
9. A cooler device comprising:
a cold plate;
a manifold constructed at least partially of silicon, comprising:
an array of inlet channels, each inlet channel having a first depth; and
an array of outlet channels interlaced with the array of inlet channels, each outlet channel having a second depth that is larger than the first depth; each of the array of outlet channels having a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels; and
a manifold case configured to be in contact with the cold plate and encapsulate the manifold, the array of inlet channels, and the array of outlet channels, the manifold case comprising:
a fluid inlet;
a fluid outlet, wherein the fluid inlet is for receiving coolant into the manifold, and the fluid outlet is for removing the liquid coolant from the manifold; and
at least one vapor outlet, wherein the at least one vapor outlet is for removing a vapor from the manifold.
10. The cooler device of claim 9 , wherein the manifold further comprises an array of inlet guides configured to direct coolant to each inlet channel.
11. The cooler device of claim 10 , wherein:
a center axis of each inlet guide is coaxial to a center axis of each outlet channel;
each inlet guide tapers outwardly away from the center axis of each inlet guide; and
a pair of inlet guides of the array of inlet guides direct coolant to an inlet channel of the array of inlet channels.
12. A cooler device comprising:
a manifold constructed at least partially of silicon, comprising:
an array of inlet channels, each inlet channel having a first depth; and
an array of outlet channels interlaced with the array of inlet channels, each outlet channel having a second depth that is larger than the first depth, each of the array of outlet channels having a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels, wherein:
each inlet channel comprises a plurality of spacer elements disposed along a length of each inlet channel; and
each spacer element of the plurality of spacer elements defines a jetted nozzle profile and is configured to distribute coolant by fluid capillary wicking action along the length of each inlet channel.
13. The cooler device of claim 12 , wherein the manifold further comprises an array of inlet guides configured to direct coolant to each inlet channel.
14. The cooler device of claim 13 , wherein:
a center axis of each inlet guide is coaxial to a center axis of each outlet channel;
each inlet guide tapers outwardly away from the center axis of each inlet guide; and
a pair of inlet guides of the array of inlet guides direct coolant to an inlet channel of the array of inlet channels.
15. The cooler device of claim 12 , wherein each inlet channel comprises a plurality of jetted inlets.
16. The cooler device of claim 15 , wherein each of the plurality of jetted inlets comprise a plurality of steps decreasing in width as each jetted inlet extends away from a top surface of each inlet channel.
17. The cooler device of claim 15 , wherein each of the plurality of jetted inlets define a tapered profile decreasing in width as each jetted inlet extends away from a top surface of each inlet channel.