Method and apparatus for multiple axis direct transfers of semiconductor devices
An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. A needle is disposed adjacent a second side of the wafer tape opposite the first side. A length of the needle extends in a direction toward the wafer tape. A first needle actuator is used to adjust an angle of the needle to align the die, wafer tape, and transfer surface at which point the needle presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate.
1. An apparatus, comprising:
a transfer mechanism configured to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace, the transfer mechanism including:
a needle pivotably coupled to a frame of the transfer mechanism at a pivot location;
a first actuator configured to pivot the needle about the pivot location to align an axis of the needle with the transfer location;
a second actuator configured to actuate the needle in a direction along the axis to press the electrically-actuatable element into contact with the circuit trace at the transfer location; and
a controller configured to at least:
determine an electrically actuatable element location on the wafer tape;
determine an orientation for the needle based at least in part on the electrically-actuatable element location and the transfer location; and
cause the first actuator to pivot the needle based on the orientation.
2. The apparatus according to claim 1 , wherein the first actuator includes a first actuation mechanism and a second actuation mechanism, the first actuation mechanism arranged perpendicular to the second actuation mechanism.
3. The apparatus according to claim 2 , wherein the first actuation mechanism includes a first electromechanical actuator and the second actuation mechanism includes a second electromechanical actuator.
4. The apparatus according to claim 2 , wherein:
the first actuation mechanism includes a first component positioned on a first side of the needle and a second component positioned on a second side of the needle opposite the first side; and
the second actuation mechanism includes a third component positioned on a third side of the needle and a fourth component positioned on a fourth side of the needle opposite the third side.
5. The apparatus according to claim 1 , further comprising a guide including a passage through which the needle passes, the guide coupled to the first actuator and configured to pivot the needle by changing a position of the guide.
6. The apparatus according to claim 1 , wherein the apparatus is configured to accommodate the transfer of the electrically-actuatable element, which is a micro-sized unpackaged light-emitting diode (“LED”), a height of the micro-sized unpackaged LED ranging between 12.5 microns and 200 microns, or between 25 microns and 100 microns, or between 50 microns to 80 microns.