Growth of semiconductor materials by hydride vapor phase epitaxy using an external aluminum chloride generator
Disclosed herein is the controlled epitaxy of Al x Ga 1-x As, Al x In 1-x P, and Al x Ga y In 1-x-y P by hydride vapor phase epitaxy (HVPE) through use of an external AlCl 3 generator.
1 . A method for the deposition of Al-containing III-V materials by hydride vapor phase epitaxy (HVPE) through use of an external AlCl 3 generator; wherein the AlCl 3 molecules do not decompose during the deposition process.
2 . The method of claim 1 wherein the source temperature of the external AlCl 3 generator is about 400 degrees Celsius.
3 . The method of claim 1 wherein a deposition temperature ranges from 620 to 700 degrees Celsius.
4 . The method of claim 1 wherein the Al-containing III-V materials comprise Al x Ga 1-x As where x is from 0 to 1.
5 . The method of claim 4 wherein the V/III ratio of Al-containing III-V materials is from 10 to 300.
6 . The method of claim 1 wherein the group V species is selected from the group consisting of nitrogen, phosphorus, arsenic, and antimony.
7 . The method of claim 1 further comprising the use of AsH 3 .
8 . An optoelectronic device made by using a method for the deposition of Al-containing III-V materials by HVPE through use of an external AlCl 3 generator;
wherein the AlCl 3 molecules do not decompose during the deposition process.
9 . The optoelectronic device of claim 8 wherein the source temperature of the external AlCl 3 generator is about 400 degrees Celsius.
10 . The optoelectronic device of claim 8 wherein a deposition temperature ranges from 620 to 700 degrees Celsius.
11 . The optoelectronic device of claim 8 wherein the Al-containing III-V materials comprise lattice-matched Al x In 1-x P and Al x Ga y In 1-x-y P.