IP Library Granted Patent US 12,040,695
Granted Patent B2
US 12,040,695 · App. 17/754,633 · Granted Jul 16, 2024

Power conversion device and method for manufacturing the same

Inventors: Naoya Shibata (Tokyo, JP); Masahiro Kinoshita (Tokyo, JP); Issei Fukasawa (Tokyo, JP)
Assignee: TMEIC CORPORATION
H02M1/10H02M7/003H02M1/42
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Quick Facts
Patent No.
US 12,040,695
App. No.
17/754,633
Granted
Jul 16, 2024
Kind
B2
Abstract

A power conversion device includes a power conversion module, a phase change material, a heat dissipation member, a cooling mechanism, and a controller. A semiconductor switching element and a freewheeling diode configure a power conversion circuit. The phase change material is provided on a principal plane of a casing. The heat dissipation member includes a heat dissipation surface. The heat dissipation surface is overlapped with the principal plane to sandwich the phase change material. The cooling mechanism cools the heat dissipation member. The controller generates a driving signal for driving the power conversion circuit and controls the cooling mechanism. The controller includes a predetermined heating operation. The heating operation may drive the power conversion circuit, in a state that the cooling mechanism is stopped or intermittently operated, such that heat generation occurs in both the semiconductor switching element and the freewheeling diode.

Claims (23)

1. A power conversion device comprising:

a power conversion module including a casing having a principal plane, and a semiconductor switching element and a freewheeling diode housed in the casing and arranged in a plane direction of the principal plane, in which the semiconductor switching element and the freewheeling diode configure a power conversion circuit;

a phase change material provided on the principal plane of the casing;

a heat dissipation member including a heat dissipation surface, in which the heat dissipation surface is overlapped with the principal plane to sandwich the phase change material;

cooling means for cooling the heat dissipation member; and

control means for generating a driving signal for driving the power conversion circuit and controlling the cooling means,

the control means including a predetermined heating operation,

the heating operation executing, in a state where the cooling means is stopped or intermittently operated, a low power factor AC-DC conversion mode for driving the power conversion circuit so as to generate AC power from DC power at a predetermined target power factor less than 1.

2. A power conversion device comprising:

a power conversion module including a casing having a principal plane, and a semiconductor switching element and a freewheeling diode housed in the casing and arranged in a plane direction of the principal plane, in which the semiconductor switching element and the freewheeling diode configure a power conversion circuit;

a phase change material provided on the principal plane of the casing;

a heat dissipation member including a heat dissipation surface, in which the heat dissipation surface is overlapped with the principal plane to sandwich the phase change material;

cooling means for cooling the heat dissipation member; and

control means for generating a driving signal for driving the power conversion circuit and controlling the cooling means,

the control means including a predetermined heating operation,

the heating operation being constructed to switch from one of an AC-DC conversion mode and a low power factor AC-DC conversion mode to the other in a state where the cooling means is stopped or intermittently operated,

the AC-DC conversion mode being for driving the power conversion circuit to generate DC power from AC power, and

the low power factor AC-DC conversion mode is for driving the power conversion circuit so as to generate AC power from DC power at a predetermined target power factor less than 1.

3. A method for manufacturing a power conversion device, the method comprising:

a process for preparing a power conversion module including a casing having a principal plane and a phase change material provided on the principal plane, in which the power conversion module includes a semiconductor switching element and a freewheeling diode housed in the casing and arranged in a plane direction of the principal plane, and the semiconductor switching element and the freewheeling diode configure a power conversion circuit;

a process for overlapping a heat dissipation surface of a heat dissipation member with the principal plane so as to sandwich the phase change material; and

a process for performing a heating operation for heating the phase change material in a product pre-shipment test,

the heating operation executing, in a state where cooling means for cooling the heat dissipation member is continuously driven, a low power factor AC-DC conversion mode for driving the power conversion circuit so as to generate AC power from DC power at a predetermined target power factor less than 1.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2022
From: SHIBATA, NAOYA; KINOSHITA, MASAHIRO; FUKASAWA, ISSEI
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 059535/0010 →
Continuity (1)
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