SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND NEGATIVE ELECTRODE FOR SECONDARY BATTERY INCLUDING SAME
Disclosed herein are a surface-treated copper foil for a negative electrode current collector for secondary batteries, a method for producing the same, and a negative electrode for secondary batteries including the same. The surface-treated copper foil includes needle-shaped copper particles formed on at least one surface thereof, wherein the copper particles have an average major-axis length of about 0.6 μm to about 2.0 μm and are separated from one another by a distance of about 1 μm to about 5 μm.
1 . A surface-treated copper foil for a negative electrode current collector for secondary batteries, the surface-treated copper foil comprising needle-shaped copper particles formed on at least one surface thereof,
wherein the copper particles have an average major-axis length of about 0.6 μm to about 2.0 μm and are separated from one another by a distance of about 1 μm to about 5 μm.
2 . The surface-treated copper foil according to claim 1 , wherein the copper particles have an aspect ratio of about 1.5 to about 10.
3 . The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil has a thickness of about 1 μm to about 100 μm.
4 . The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil has an interfacial resistance of about 10% or more lower than that of untreated copper foil.
5 . The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil has an interfacial resistance of about 0.0025 ohm/m 2 to about 0.0032 ohm/m 2 .
6 . The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil has an adhesive strength of about 20% or more greater than that of untreated copper foil.
7 . The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil has an adhesive strength of about 3 gf/mm to about 5 gf/mm.
8 . The surface-treated copper foil according to claim 1 , further comprising:
an antirust layer covering the copper particles, the antirust layer comprising an inorganic antirust layer, an organic antirust layer, or a combination thereof.
9 . The surface-treated copper foil according to claim 8 , wherein the inorganic antirust layer comprises chromium (Cr), nickel (Ni), cobalt (Co), or an alloy or combination thereof, and the organic antirust layer comprises an azole compound, a silane compound, or a combination thereof.
10 . A method for producing the surface-treated copper foil according to claim 1 , the method comprising:
performing primary plating by immersing a copper foil in a primary electrolyte containing about 5 g/L to about 15 g/L of a nickel salt and about 5 g/L to about 20 g/L of a copper salt, followed by electrolysis at a liquid temperature of about 25° C. to about 45° C. and a current density of about 1 A/dm 2 to about 5 A/dm 2 for about 1 to 5 seconds; and
performing secondary plating by immersing the primarily plated copper foil in a secondary electrolyte containing about 40 g/L to about 70 g/L of a copper salt and about 100 g/L to about 150 g/L of sulfuric acid, followed by electrolysis at a liquid temperature of about 25° C. to about 45° C. and a current density of about 10 A/dm 2 to about 20 A/dm 2 for about 1 to 5 seconds.
11 . A negative electrode for secondary batteries, comprising:
the surface-treated copper foil according to claim 1 ; and
a negative electrode active material coated on the surface-treated copper foil.
12 . The negative electrode according to claim 11 , wherein the negative electrode active material comprises carbon, a metal, a metal oxide, a metal carbide, or a combination thereof.