Granted Patent B2

US 12,484,388 · App. 17/762,378 · Granted Nov 25, 2025

Inventors: Huajie Yan (Beijing, CN); Xiaohu Li (Beijing, CN); Renquan Gu (Beijing, CN); Qingyu Huang (Beijing, CN)

Assignee: Beijing BOE Technology Development Co., Ltd.

H10K59/124H10K59/1201H10K59/353H10K59/80518H10K59/875H10K71/00H10K77/00H10K59/80515

Abstract

Claims (38)

1 . A display substrate, comprising a base and a plurality of pixel units disposed on the base, wherein:

at least one pixel unit of the plurality of pixel units comprises a plurality of sub-pixels with different colors, and at least one sub-pixel of the plurality of sub-pixels comprises a plurality of sub-pixel components with the same color;

anodes of the plurality of sub-pixel components are electrically connected with driving circuits, the driving circuits are independent of each other, and in a plane perpendicular to the display substrate, a side of an anode of at least one sub-pixel component of the plurality of sub-pixel components away from the base at least comprises a part of a surface, and a normal of the part of the surface is not perpendicular to the base; and

the anode of the at least one sub-pixel component comprises a first conductive layer, a reflective layer, and a second conductive layer which are stacked,

wherein the first conductive layer and the second conductive layer each have a thickness of 10 nm to 50 nm; and the reflective layer has a thickness of 80 nm to 200 nm, and

in the plane perpendicular to the display substrate, the display substrate comprises the base, and a planarization layer, the anodes of the plurality of sub-pixel components, an organic light emitting layer and a cathode which are stacked sequentially on the base, and in at least one sub-pixel region, the planarization layer comprises a plurality of protrusions corresponding to the plurality of sub-pixel components one-to-one;

the base comprises a plurality of driving circuits, the planarization layer is disposed with a plurality of vias, and the anode of the at least one sub-pixel component is electrically connected with a driving circuit through a via on the planarization layer, and

in the at least one sub-pixel region, the plurality of protrusions are a plurality of spherical crown-shaped protrusions arranged on the base in an array or a row-by-row staggered arrangement, or the plurality of protrusions are a plurality of semi-cylinder-shaped protrusions arranged on the base in rows or columns.

2 . The display substrate according to claim 1 , wherein, in one sub-pixel region, one spherical crown-shaped protrusion has a spherical radius of 300 nm to 1800 nm.

3 . The display substrate according to claim 1 , wherein, the anode of the at least one sub-pixel component is shaped as a first spherical housing covering the planarization layer, an organic light emitting layer of the at least one sub-pixel component is shaped as a second spherical housing covering the anode of the at least one sub-pixel component, and anodes of adjacent sub-pixel components are isolated from each other by the organic light emitting layer; in the at least one sub-pixel region, organic light emitting layers of the plurality of sub-pixel components are continuous.

4 . The display substrate according to claim 3 , wherein, a distance between spherical centers of the anodes of the adjacent sub-pixel components is 2 μm to 100 μm; and

the first spherical housing corresponding to the anode of the at least one sub-pixel component has a radius of 100 nm to 8000 nm.

5 . The display substrate according to claim 3 , wherein, the first spherical housing corresponding to the anode of the at least one sub-pixel component has an arc of π/6 to 3π/2.

6 . The display substrate according to claim 1 , wherein, in one sub-pixel region, one semi-cylinder-shaped protrusion has a bottom surface radius of 600 nm to 700 nm.

7 . The display substrate according to claim 1 , wherein, the anode of the at least one sub-pixel component is shaped as a first ring cylinder covering the planarization layer, an organic light emitting layer of the at least one sub-pixel component is shaped as a second ring cylinder covering the anode of the at least one sub-pixel component, and anodes of adjacent sub-pixel components are isolated from each other by the organic light emitting layer; in the at least one sub-pixel region, organic light emitting layers of the plurality of sub-pixel components are continuous.

8 . The display substrate according to claim 7 , wherein, a distance between bottom surface circular centers of the anodes of the adjacent sub-pixel components is 2 μm to 100 μm; and

the first ring cylinder corresponding to the anode of the at least one sub-pixel component has a bottom surface radius of 100 nm to 8000 nm.

9 . The display substrate according to claim 7 , wherein, the first ring cylinder corresponding to the anode of the at least one sub-pixel component has an arc of π/6 to 3π/2.

10 . A display device comprising the display substrate of claim 1 .

11 . A manufacturing method of a display substrate, comprising:

forming a base comprising a plurality of driving circuits independent of each other; and

forming a plurality of pixel units on the base, at least one pixel unit of the plurality of pixel units comprising a plurality of sub-pixels with different colors, and at least one sub-pixel of the plurality of sub-pixels comprising a plurality of sub-pixel components with the same color; anodes of the plurality of sub-pixel components being electrically connected with the driving circuits, and in a plane perpendicular to the display substrate, a side of an anode of at least one sub-pixel component of the plurality of sub-pixel components away from the base at least comprising a part of a surface, and a normal of the part of the surface being not perpendicular to the base;

wherein forming the plurality of pixel units on the base comprises:

forming a planarization layer on the base, and

forming the anodes of the plurality of sub-pixel components on the planarization layer; and

wherein, the anode of the at least one sub-pixel component comprises a first conductive layer, a reflective layer, and a second conductive layer; and forming the anode of the at least one sub-pixel component on the planarization layer comprises:

depositing a first conductive thin film, and forming a pattern of the first conductive layer through a first patterning process;

depositing a reflective layer thin film, and forming a pattern of the reflective layer through a second patterning process; and

depositing a second conductive thin film, and forming a pattern of the second conductive layer through a third patterning process.

12 . The manufacturing method according to claim 11 , wherein,

in at least one sub-pixel region, the planarization layer comprises a plurality of protrusions corresponding to the plurality of sub-pixel components one-to-one, and a plurality of vias are disposed on the planarization layer;

the anodes of the plurality of sub-pixel components cover the plurality of protrusions, and the anode of the at least one sub-pixel component is electrically connected with at least one driving circuit through a via on the planarization layer; and

the manufacturing method further comprises:

sequentially forming an organic light emitting layer and a cathode on the anodes of the plurality of sub-pixel components.

13 . The manufacturing method according to claim 12 , wherein, in the at least one sub-pixel region, the plurality of protrusions are a plurality of spherical crown-shaped protrusions arranged on the base in an array or a row-by-row staggered arrangement;

or

in the at least one sub-pixel region, the plurality of protrusions are a plurality of semi-cylinder-shaped protrusions arranged on the base in rows or columns.

14 . The manufacturing method according to claim 11 , wherein, the reflective layer has a thickness of 80 nm to 200 nm; the first conductive layer and the second conductive layer each have a thickness of 10 nm to 50 nm.

Assignments (2)

Continuity (1)

References Cited (17)