Tin compound, thin-film forming raw material containing said compound, thin film formed from said thin-film forming raw material, method of producing said thin film using said compound as precursor, and method of producing said thin film
The present invention provides a tin compound represented by the following general formula (1) (in the formula (1), R 1 to R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, and R 5 represents an alkanediyl group having 1 to 15 carbon atoms), a thin-film forming raw material including the compound, a thin-film formed by using the thin-film forming raw material, a method of using the compound as a precursor for producing the thin-film, and a method of producing a thin-film including: introducing a raw material gas obtained by vaporizing the thin-film forming raw material into a treatment atmosphere having a substrate set therein; and subjecting the tin compound in the raw material gas to decomposition and/or a chemical reaction in the treatment atmosphere, to thereby produce a thin-film containing a tin atom on a surface of the substrate.
1. A tin compound represented by the following general formula (1):
wherein R 1 and R 4 each independently represent an ethyl group or an isopropyl group, R 2 and R 3 each independently represent an alkyl group having 1 to 5 carbon atoms, and R 5 represents an alkanediyl group represented by the following formula (x−6)
wherein each * represents a linking position to a nitrogen atom in the general formula (1), and
having a molecular weight of 230 to 300.
2. A thin-film forming raw material, containing the tin compound of claim 1 .
3. A method of using the tin compound of claim 1 as a precursor for producing a thin-film containing a tin atom by a chemical vapor deposition method, the method comprising:
vaporizing the tin compound to obtain a raw material gas,
introducing the raw material gas into a treatment atmosphere having a substrate set therein, and depositing the tin compound in the raw material gas on a surface of the substrate to form a precursor layer, and
introducing a reactive gas into the treatment atmosphere and causing the tin compound in the precursor layer and the reactive gas to react, to thereby produce the thin-film containing a tin atom on the surface of the substrate.
4. A method of producing a thin-film, comprising:
introducing a raw material gas obtained by vaporizing the thin-film forming raw material of claim 2 into a treatment atmosphere having a substrate set therein; and
subjecting the tin compound in the raw material gas to decomposition and/or a chemical reaction in the treatment atmosphere, to thereby produce a thin-film containing a tin atom on a surface of the substrate.
5. A method of producing a thin-film containing a tin atom on a surface of a substrate by an atomic layer deposition method, the method comprising:
a first step of introducing a raw material gas obtained by vaporizing the thin-film forming raw material of claim 2 into a treatment atmosphere, and depositing the tin compound in the raw material gas on the surface of the substrate, to thereby form a precursor layer; and
a second step of introducing a reactive gas into the treatment atmosphere to cause the precursor layer and the reactive gas to react with each other.
6. The method of producing a thin-film according to claim 5 , further comprising a step of exhausting a gas in the treatment atmosphere at least one of between the first step and the second step or after the second step.