Copper alloy powder having Si coating film and method for producing same
Provided is a copper alloy powder which is a metal powder to be used for additive manufacturing by a laser beam system, and which is able to achieve a higher laser absorption rate and additionally suppress heat transfer through necking, and a method for producing this copper alloy powder. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, and a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less.
1. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm −1 exists in a range of 1200 to 1850 cm −1 .
2. A copper alloy powder which contains Cr in an amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm −1 exists in a range of 1200 to 1850 cm −1 .
3. A copper alloy powder which contains Cr in an amount of 12 wt % or less and Zr in an amount of 3 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm −1 exists in a range of 1200 to 1850 cm −1 .
4. A copper alloy powder which contains Cr in an amount of 8 wt % or less and Nb in an amount of 7 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm −1 exists in a range of 1200 to 1850 cm −1 .
5. The copper alloy powder according to claim 4 , wherein an oxygen concentration in the copper alloy powder with the coating film containing Si atoms is 2000 wt ppm or less.
6. The copper alloy powder according to claim 4 , wherein, when an LMM spectrum of Cu is analyzed based on XPS analysis in the copper alloy powder with the coating film containing Si atoms, a maximum peak intensity exists in a binding energy range of 569 to 571 eV.
7. The copper alloy powder according to claim 4 , wherein an average particle diameter D50 (median diameter) in the copper alloy powder is 10 μm or more and 150 μm or less.
8. A method of producing the copper alloy powder according to claim 4 , wherein a copper alloy powder is immersed in a solution containing a silane-based coupling agent, a coating film containing Si atoms is formed on the copper alloy powder, and the copper alloy powder is thereafter heated at a temperature of 1000° C. or less.
9. The copper alloy powder according to claim 3 , wherein an oxygen concentration in the copper alloy powder with the coating film containing Si atoms is 2000 wt ppm or less.
10. The copper alloy powder according to claim 3 , wherein, when an LMM spectrum of Cu is analyzed based on XPS analysis in the copper alloy powder with the coating film containing Si atoms, a maximum peak intensity exists in a binding energy range of 569 to 571 eV.
11. The copper alloy powder according to claim 3 , wherein an average particle diameter D50 (median diameter) in the copper alloy powder is 10 μm or more and 150 μm or less.
12. A method of producing the copper alloy powder according to claim 3 , wherein a copper alloy powder is immersed in a solution containing a silane-based coupling agent, a coating film containing Si atoms is formed on the copper alloy powder, and the copper alloy powder is thereafter heated at a temperature of 1000° C. or less.
13. The copper alloy powder according to claim 2 , wherein an oxygen concentration in the copper alloy powder with the coating film containing Si atoms is 2000 wt ppm or less.
14. The copper alloy powder according to claim 2 , wherein, when an LMM spectrum of Cu is analyzed based on XPS analysis in the copper alloy powder with the coating film containing Si atoms, a maximum peak intensity exists in a binding energy range of 569 to 571 eV.
15. The copper alloy powder according to claim 2 , wherein an average particle diameter D50 (median diameter) in the copper alloy powder is 10 μm or more and 150 μm or less.
16. A method of producing the copper alloy powder according to claim 2 , wherein a copper alloy powder is immersed in a solution containing a silane-based coupling agent, a coating film containing Si atoms is formed on the copper alloy powder, and the copper alloy powder is thereafter heated at a temperature of 1000° C. or less.
17. The copper alloy powder according to claim 1 , wherein an oxygen concentration in the copper alloy powder with the coating film containing Si atoms is 2000 wt ppm or less.
18. The copper alloy powder according to claim 1 , wherein, when an LMM spectrum of Cu is analyzed based on XPS analysis in the copper alloy powder with the coating film containing Si atoms, a maximum peak intensity exists in a binding energy range of 569 to 571 eV.
19. The copper alloy powder according to claim 1 , wherein an average particle diameter D50 (median diameter) in the copper alloy powder is 10 μm or more and 150 μm or less.
20. A method of producing the copper alloy powder according to claim 1 , wherein a copper alloy powder is immersed in a solution containing a silane-based coupling agent, a coating film containing Si atoms is formed on the copper alloy powder, and the copper alloy powder is thereafter heated at a temperature of 1000° C. or less.