RFID-Enabled Transaction Cards Of Metal And Plastic
An RFID-enabled metal face transaction card may comprise a thin front face metal layer (ML 1 ) with a “P 1 ” module opening (MO) and a micro-slit (SI), and a thick metal layer (ML 2 ) with “P 2 ” module opening and a narrow slit. The metal layer (ML 1 ) may be color printed or coated, and have its surface protected by a laser-reactive diamond coat. The two metal layers may be separated by a PEN dielectric with a thermosetting epoxy on both sides which has been cured to an irreversible state (C-stage). The “P 2 ” module opening in the metal layer (ML 2 ) may have a shape and geometry which matches the shape and geometry of the module antenna (MA) of a transponder chip module (TCM). The shape of the “P 1 ” and “P 2 ” openings may be polygonal in form. The “P 1 ” module opening in the metal layer (ML 1 ) may have an alignment feature (GP) for ensuring correct alignment of the transponder chip module, when it is inserted into the openings.
1 . An RFID-enabled metal face transaction card comprising: a first metal layer (ML 1 ; 1030 ) with a first module opening (PI); a second metal layer (ML 2 ; 930 ) with a second module opening (P 2 ; 914 ); wherein: the second module opening has a shape and geometry which matches the shape and geometry of a module antenna (MA; 912 , 1012 ) of a transponder chip module (TCM; 910 , 1010 ) which will be inserted into the card.
2 . The card of claim 1 , wherein: the first module opening has an alignment feature (GP; 1016 ) for ensuring correct alignment of a transponder chip module (TCM) inserted into the opening.
3 . The card of claim 1 , wherein: at least one of the first and second module openings has a polygonal shape which matches the shape of the module antenna, with a size that allows for the module antenna to at least partially overlap the metal layer outside of the module opening.
4 . The card of claim 1 , wherein: the second metal layer is at least approximately twice as thick as the first metal layer.
5 . The card of claim 1 , wherein: the first metal layer has a first slit (SI); and a second metal layer has a second slit (S 2 ) which is wider than the first slit.
6 . The card of claim 1 , further comprising: a polymeric carrier layer which is a PET or PEN dielectric layer with thermosetting epoxy on both sides disposed between the first and second metal layers.
7 . The card of claim 6 , wherein the thermosetting epoxy is cured to an irreversible state (C-stage) when it is laminated with the first and second metal layers.
8 . The card of claim 1 , further comprising: a transparent, translucent, white, or colored print layer disposed behind the second metal layer; and a laser-reactive overlay layer disposed behind the transparent print layer.
9 . The card of claim 1 , further comprising: a transponder chip module (TCM) disposed in the first and second module openings.
10 . The card of claim 9 , wherein: the chip module has contact pads, and is a dual-interface module.
11 . An RFID-enabled metal face transaction card comprising: a first metal layer (ML 1 , 830 ) having a first slit (SI, 820 a ); and a second metal layer (ML 2 , 840 ) having a second slit (S 2 , 820 b ); wherein: the first metal layer is thin, having a thickness of approximately 100-160 pm, and serves as a front face of the card; and the second metal layer is approximately twice as thick as the first metal layer, having a thickness of approximately 300-350 pm, and supports the first metal layer.
12 . The card of claim 11 , wherein: the first slit is a micro-slit having a width of approximately 50 pm; and the second slit is a narrow slit having a width of approximately 100 pm.
13 . The card of claim 11 , wherein: the first slit is offset from the second slit, yet the two slits are located as close to one another as possible, without overlapping.
14 . The card of claim 11 , further comprising: a color printing or coating ( 826 ) disposed over the first slit to disguise or camouflage the first slit.
15 . The card of claim 11 , further comprising: a laser-reactive diamond coat ( 824 ) disposed on a surface of the first metal layer; wherein the laser-reactive diamond coat comprises a protective coating having several layers of ink, varnish or a polymer coating, or a hard top-coat lamination film; and wherein the laser-reactive diamond coat protects the first metal layer and disguises or camouflages the first slit.
16 . The card of claim 11 , further comprising: a polymeric carrier layer which is a PET or PEN dielectric layer ( 835 ) with thermosetting epoxy on both sides disposed between the first and second metal layers; wherein the thermosetting epoxy is cured to an irreversible state (C-stage) when laminated with the first and second metal layers, a transparent, translucent, white, or colored print layer ( 850 ) with printed information (PI) comprising primer and ink disposed behind the second metal layer; and an adhesive layer ( 845 ) of thermosetting epoxy disposed between the second metal layer and the transparent print layer;
a laser-reactive overlay layer ( 860 ) disposed behind the transparent print layer;
wherein: the print layer has a thickness of approximately 152 pm; and the adhesive layer has a thickness of approximately 25 pm.
17 .- 19 . (canceled)
20 . The card of claim 19 , further comprising: at least one of a magnetic stripe ( 864 ) and security elements disposed on the overlay layer; and
information ( 866 ) inscribed by a laser into or onto the laser-reactive overlay layer;
wherein: the laser-reactive overlay layer has a thickness of approximately 64 pm.
21 .- 22 . (canceled)
23 . The card of claim 1 , further comprising: a first module opening (PI; 812 ) disposed in the first metal layer; a second module opening (P 2 ; 814 ) disposed in the second metal layer; a transponder chip module (TCM; 810 ) disposed in the first and second module openings; and
a layer ( 811 ) of adhesive, the size of the transponder chip module, disposed on an underside of the chip module;
wherein the chip module has contact pads, and is a dual-interface module.
24 .- 25 . (canceled)
26 . A method of making an RFID-enabled metal face transaction card comprising: providing a first metal layer (ML 1 ; 830 ) with a first slit (SI; 820 a ); providing a second metal layer (ML 2 ; 840 ) with a second slit (S 2 ; 820 b ); providing a dielectric layer ( 835 ) between the first and second metal layers; providing a transparent, translucent, white or colored print layer ( 850 ) below the second metal layer; providing an adhesive film layer ( 845 ) between the print layer and the second metal layer; and providing a laser-reactive diamond coat ( 824 ) on a surface of the first metal layer; wherein the laser-reactive diamond coat comprises a protective coating having several layers of ink, varnish or a polymer coating, or a hard top-coat lamination film; and wherein the laser-reactive diamond coat protects the first metal layer and disguises or camouflages the first slit.
27 . The method of claim 26 , further comprising: providing a laser-reactive overlay layer ( 860 ) below the print layer, a transponder chip module (TCM; 810 ) with a layer of adhesive ( 811 ), the size of the transponder chip module, disposed on an underside of the chip module;
prior to inserting the transponder chip module into the card, milling a first module opening (MO, PI) in the first metal layer, and milling a second module opening (MO, P 2 ) in the second metal layer;
wherein the dielectric layer comprises: a layer ( 834 ) of PET or PEN with thermosetting epoxy adhesive ( 832 ) on both sides thereof.
28 .- 33 . (canceled)