Device for voltage equalization in square wave voltages for an electric motor
Various embodiments of the teachings herein include an apparatus for voltage equalization in square-wave voltages of electric motors. The apparatus may include: a terminal board circuit wherein phases U, V, and W each comprises input and output cabled conductors summing to at least 6 cables; and a bridge between two of the at least six cables connecting two or more of the at least 6 cable inputs and outputs. The bridge is partially conductive such that its electrical resistance markedly reduces above a threshold value. The partial conductivity results from filler particles in an embedding matrix determining a reduction of the resistance in the bridge above the threshold value.
1. An apparatus for voltage equalization in square-wave voltages of electric motors, the apparatus comprising:
a terminal board circuit wherein phases U, V, and W each comprises input and output cabled conductors summing to at least 6 cables; and
a bridge between two of the at least six cables connecting two or more of the at least 6 cable inputs and outputs;
wherein the bridge is partially conductive such that its electrical resistance markedly reduces above a threshold value;
wherein the partial conductivity results from filler particles in an embedding matrix determining a reduction of the resistance in the bridge above the threshold value.
2. The apparatus as claimed in claim 1 , wherein the filler particles are embedded in a polymeric and/or ceramic matrix.
3. The apparatus as claimed in claim 1 , wherein at least some of the filler particles have a partially conductive coating.
4. The apparatus as claimed in claim 3 , wherein the partially conductive coating comprises a doped material.
5. The apparatus as claimed in claim 3 , wherein a thickness of the partially conductive coating of the filler particles is in a range from 10 nm to 100 nm.
6. The apparatus as claimed in claim 1 , wherein at least one fraction of the filler particles comprises hollow filler particles having a partially conductive coating.
7. The apparatus as claimed in claim 1 , further comprising a substrate including wood, pressboard, plastic, epoxy resin, polysiloxane, thermoplastic, fiber-reinforced plastic, ceramic, and/or leather, and carrying the embedding matrix and filler particles.
8. The apparatus as claimed in claim 7 , further comprising a lacquer applied to the substrate in a film thickness in a range between 10 μm and 3 mm.
9. The apparatus as claimed in claim 1 , wherein the embedding matrix comprises a lacquer with the filler particles.
10. The apparatus as claimed in claim 9 , wherein the lacquer comprises a resin or a resin mixture with a compound selected from the group consisting of: epoxy resin, polyetherimide, polysiloxane, and polysilazane.
11. The apparatus as claimed in claim 1 , wherein the filler particles comprise at least one material selected from the group consisting of: a metal oxide, a metal carbide, and a metal nitride.
12. The apparatus as claimed in claim 11 , wherein the filler particles comprise an oxide and/or a carbide including at least one element selected from the group consisting of: tin, zinc, iron, molybdenum, bismuth, lead, chromium, manganese, nickel, cobalt, titanium, vanadium, indium, zirconium, tungsten, silicon, antimony, tellurium, and germanium.
13. The apparatus as claimed in claim 1 , wherein the filler particles are present in the embedding matrix in a concentration of 0.5% by volume to 30% by volume.
14. The apparatus as claimed in claim 1 , wherein the filler particles have a size in a range from 500 nm to 50 μm.
15. The apparatus as claimed in claim 1 , wherein the filler includes two or more filler fractions.