Display backlight having LED device with transparent LED frame
An LED backlight module includes an LED light plate, a diffusion plate, a brightening film, an MOP film, and a QBEF film. The LED light plate includes a driving circuit, a substrate, and LED devices on the substrate. Each LED device includes a transparent LED frame, an LED chip disposed on a bottom portion of the transparent LED frame, and a packaging glue layer formed inside the transparent LED frame and covering the LED chip. A diffusion agent is distributed in the packaging glue layer.
1. An LED device applicable to a backlight module, wherein the LED device comprises:
a transparent LED frame;
an LED chip disposed at a bottom portion of the transparent LED frame;
a packaging glue layer formed inside the transparent frame and covering the LED chip; and
an anti-glare light-blocking layer disposed on the packaging glue layer, wherein the anti-glare light-blocking layer does not completely cover an upper surface of the packaging glue layer;
wherein a diffusion agent is distributed in the packaging glue layer;
wherein a surface of the packaging glue layer away from the bottom portion of the transparent LED frame is a concave surface.
2. An LED backlight module, comprising:
a diffusion plate;
a brightening film;
a microlens-prism composite film (MOP);
a quantum dot optical film (QBEF);
a driving circuit;
a substrate; and
a plurality of LED devices on the substrate, each of the LED devices comprises a transparent LED frame, an LED chip disposed on a bottom portion of the transparent LED frame, a packaging glue layer formed inside the transparent LED frame and covering the LED chip, and a diffusion agent distributed in the packaging glue layer;
wherein the diffusion plate, the brightening film, the microlens-prism composite film (MOP), and the quantum dot optical film (QBEF) are sequentially arranged over the plurality of LED devices.
3. A display, comprising:
a display panel; and
an LED backlight module according to claim 2 .
4. The LED backlight module according to claim 2 , wherein in each of the LED devices, a surface of the packaging glue layer away from the bottom portion of the transparent LED frame is an inwardly concave surface.
5. The LED backlight module according to claim 4 , wherein in each of the LED devices, a height of the inwardly concave surface of the packaging glue layer is in a range between 10 μm and 60 μm.
6. The LED backlight module according to claim 4 , wherein the LED device further comprises an anti-glare light-blocking layer disposed on the packaging glue layer, wherein the anti-glare light-blocking layer does not completely cover an upper surface of the packaging glue layer.
7. The LED backlight module according to claim 2 , wherein at least two adjacent rows or two adjacent columns of the LED devices on the substrate are misaligned with each other.
8. The LED backlight module according to claim 7 , wherein the substrate comprises a plurality of sections defined by the LED devices, wherein each of the sections comprises at least two of the LED devices.
9. The LED backlight module according to claim 8 , wherein each of the sections comprises a group of two, three, or four of the LED devices.