Granted Patent B2

US 12,503,595 · App. 17/787,997 · Granted Dec 23, 2025

Inventors: Yi Li (Selkirk, NY); James Ross Fishburn (Selkirk, NY)

Assignee: SHPP GLOBAL TECHNOLOGIES B.V.

C08L77/06C08L2205/035

Abstract

Claims (70)

1 . A composition, comprising:

30 to 40 weight percent of a poly(phenylene ether), a poly(phenylene ether-siloxane), or a combination thereof;

35 to 65 weight percent of a polyamide composition, wherein the polyamide composition comprises at least one polyamide having an amine end group content of less than 75 milliequivalents per gram;

10 to 30 weight percent of a polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier, or a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer impact modifier, or a combination thereof, wherein the polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier has a styrene content 20 to 35 weight percent;

wherein each amount is based on 100 weight percent of the composition; and

wherein no conductive fillers are present in the composition.

2 . The composition of claim 1 further comprising ethylene-propylene-diene monomer-modified polyamide in an amount of 24 to 30 weight percent based on 100 weight percent of the composition.

3 . The composition of claim 1 further comprising an ethylene-propylene-diene monomer-modified polyamide, and the composition comprises 2 to 10 weight percent of the ethylene-propylene-diene monomer impact modifier.

4 . The composition of claim 3 , wherein composition comprises 2 to 10 weight percent of the ethylene-propylene-diene monomer impact modifier.

5 . The composition of claim 1 , comprising:

32 to 38 weight percent of the poly(phenylene ether);

38 to 54 weight percent of a polyamide composition, wherein the polyamide composition comprises the polyamide having an amine end group content of less than 70 milliequivalents per gram and a polyamide having an amine end group content of 75 to 140 milliequivalents per gram; and

10 to 28 weight percent of the polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier.

6 . The composition of claim 1 , comprising

33 to 37 weight percent of the poly(phenylene ether),

42 to 50 weight percent of the polyamide composition, and a polyamide having an amine end group content of 75 to 120 milliequivalents per gram is present in an amount of 8 to 35 weight percent based on the weight of polyamide composition, and

12 to 24 weight percent of the polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier.

7 . The composition of claim 1 , comprising:

30 to 40 weight percent of the poly(phenylene ether);

40 to 50 weight percent of the polyamide composition;

10 to 28 weight percent of the polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier; and

2 to 10 weight percent of an ethylene propylene diene monomer impact modifier.

8 . An article formed from the composition of claim 1 .

9 . The article of claim 8 , as a molded part for passenger transport vehicles, commercial vehicle equipment, or commercial or residential units.

10 . A method of forming the composition of claim 1 , the method comprising:

melt-mixing the components of the composition.

11 . A composition, comprising:

35 to 55 weight percent of a poly(phenylene ether), a poly(phenylene ether-siloxane), or a combination thereof;

35 to 65 weight percent of a polyamide composition, wherein the polyamide composition comprises at least one polyamide having an amine end group content of less than 75 milliequivalents per gram;

10 to 30 weight percent of a polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier, or a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer impact modifier, or a combination thereof; and

optionally:

20 to 30 weight percent of an ethylene-propylene-diene monomer-modified polyamide, or

5 to 20 weight percent of a polyamide having an amine end group content of 75 to 140 milliequivalents per gram, as a part of the polyamide composition, or

a combination thereof;

wherein each amount is based on 100 weight percent of the composition; and wherein the polyamide having an amine end group content of 75 to 140 milliequivalents per gram is present, and accounts for 20 to 40 weight percent of all the polyamide in the composition.

12 . A composition, comprising:

35 to 55 weight percent of a poly(phenylene ether), a poly(phenylene ether-siloxane), or a combination thereof;

35 to 65 weight percent of a polyamide composition, wherein the polyamide composition comprises at least one polyamide having an amine end group content of less than 75 milliequivalents per gram;

10 to 30 weight percent of a polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier, or a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer impact modifier, or a combination thereof; and

optionally:

20 to 30 weight percent of an ethylene-propylene-diene monomer-modified polyamide, or

5 to 20 weight percent of a polyamide having an amine end group content of 75 to 140 milliequivalents per gram, as a part of the polyamide composition, or

a combination thereof;

wherein each amount is based on 100 weight percent of the composition; and wherein a molded sample of the composition has at least one of the following properties:

a heat distortion temperature from 164° C. to 180° C., measured in accordance with ISO 75 at 1.8 MPa;

an Izod notched impact strength from 32 kJ/m 2 to 64 KJ/m 2 , measured in accordance with ISO 180 at −30° C.;

a tensile modulus of 2100 MPa to 2600 MPa measured in accordance with ISO 527 at −30° C.; or

ductility as measured in accordance with ASTM D2763 at 3.3 m/s at −30° C., where the molded sample is treated for 40 hours at 40° C./95% relative humidity then for 144 hours at 23° C./65% relative humidity.

13 . A composition, comprising:

35 to 55 weight percent of a poly(phenylene ether), a poly(phenylene ether-siloxane), or a combination thereof;

35 to 65 weight percent of a polyamide composition, wherein the polyamide composition comprises at least one polyamide having an amine end group content of less than 75 milliequivalents per gram;

10 to 30 weight percent of a polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier, or a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer impact modifier, or a combination thereof; and

optionally:

20 to 30 weight percent of an ethylene-propylene-diene monomer-modified polyamide, or

5 to 20 weight percent of a polyamide having an amine end group content of 75 to 140 milliequivalents per gram, as a part of the polyamide composition, or

a combination thereof;

wherein each amount is based on 100 weight percent of the composition; and wherein the polyamide composition comprises at least two different polyamides, wherein one polyamide has an amine content of less than 75 milliequivalents, and another polyamide has an amine content of 75 to 140 milliequivalents per gram.

14 . A composition, comprising:

35 to 55 weight percent of a poly(phenylene ether), a poly(phenylene ether-siloxane), or a combination thereof;

35 to 65 weight percent of a polyamide composition, wherein the polyamide composition comprises at least one polyamide having an amine end group content of less than 75 milliequivalents per gram;

10 to 30 weight percent of a polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier, or a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer impact modifier, or a combination thereof; and

optionally:

20 to 30 weight percent of an ethylene-propylene-diene monomer-modified polyamide, or

5 to 20 weight percent of a polyamide having an amine end group content of 75 to 140 milliequivalents per gram, as a part of the polyamide composition, or

a combination thereof;

wherein each amount is based on 100 weight percent of the composition; and wherein a molded sample of the composition has at least one of the following properties:

a heat distortion temperature from 164° C. to 174° C., measured in accordance with ISO 75 at 1.8 MPa;

an Izod notched impact strength from 45 to 70 KJ/m 2 , measured in accordance with ISO 180 at −30° C.;

a tensile modulus of 1700 to 2200 MPa measured in accordance with ISO 527 at −30° C.; or

ductility as measured in accordance with ASTM D2763 at 3.3 m/s at −30° C., where the molded sample is treated for 40 hours at 40° C./95% relative humidity then for 144 hours at 23° C./65% relative humidity.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (17)