IP Library Granted Patent US 12,097,692
Granted Patent B2
US 12,097,692 · App. 17/794,345 · Granted Sep 24, 2024

Electronic device comprising a pressure sensor

Inventors: Xu Feng (Jiansu, CN); Cao Jin (Jiansu, CN); Sun Kun (Jiansu, CN); Wei Xin (Jiansu, CN)
Assignee: Peratch Holdco Limited
B32B9/00B32B7/02B32B7/12G06F3/041B32B2250/02B32B2307/51B32B2457/208
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Quick Facts
Patent No.
US 12,097,692
App. No.
17/794,345
Granted
Sep 24, 2024
Kind
B2
Abstract

An apparatus for use in the assembly of an electronic device, such as a mobile telephone, comprises a pressure sensor. The pressure sensor is embedded within an inner elastic layer and the inner elastic layer is embedded within an outer elastic layer. The inner elastic layer has an elastic modulus which is greater than the elastic modulus of the outer elastic layer.

Claims (26)

1. Apparatus for incorporating into an electronic device, comprising:

a pressure sensor;

an inner elastic layer and an outer elastic layer;

said pressure sensor being embedded within said inner elastic layer and said inner elastic layer being embedded within said outer elastic layer; wherein:

said inner elastic layer has an elastic modulus which is greater than an elastic modulus of said outer elastic layer,

said outer elastic layer comprises a plurality of grooves;

said inner elastic layer comprises a plurality of protrusions identical in number to said plurality of grooves;

each said plurality of protrusions mutually connect and co-operate with each said plurality of grooves; and

said outer elastic layer comprises a substantially viscous elastic material such that said outer elastic layer is configured to be utilized to attach between two components and stretched to overcome an influence of tolerances on said pressure sensor and a gap between said two components.

2. The apparatus of claim 1 , wherein said outer elastic layer comprises a surface to which a first adhesive layer is provided.

3. The apparatus of claim 1 , further comprising a second adhesive layer provided between said inner elastic layer and said outer elastic layer.

4. The apparatus of claim 1 , further comprising a third adhesive layer provided between said inner elastic layer and said pressure sensor.

5. The apparatus of claim 1 , wherein said inner elastic layer and said outer elastic layer each comprise a substantially rectangular-shaped structure.

6. A touch screen, comprising:

a screen;

a screen frame configured to receive said screen; and

the apparatus of claim 1 .

7. The touch screen of claim 6 , wherein said apparatus is disposed between said screen and said screen frame.

8. An electronic device comprising the touch screen of claim 6 .

9. The electronic device of claim 8 , wherein said electronic device is a mobile telephone.

10. A method of assembling an electronic device, said method comprising the steps of:

embedding a pressure sensor within an inner elastic layer having an elastic modulus and having a plurality of protrusions;

embedding said inner elastic layer comprising said pressure sensor within an outer elastic layer having an elastic modulus lower than said elastic modulus of said inner elastic layer, said outer elastic layer comprising a plurality of grooves identical in number to said plurality of protrusions and further comprising a substantially viscous elastic material;

connecting said plurality of protrusions to mutually connect and co-operate with each said plurality of grooves; and

disposing said pressure sensor, said inner elastic layer and said outer elastic layer between a first component and a second component of an electronic device, and stretching said outer elastic layer to overcome an influence of tolerances on said pressure sensor and a gap between said first component and said second component.

11. The method of claim 10 , wherein said first component is a screen of a touch screen and said second component is a screen frame which receives said screen.

Assignments (5)
LIEN Recorded Oct 28, 2024
From: PERATECH IP LTD.; PERATECH HOLDCO LTD.
To: DARK MATTER LEND CO LTD.
Reel/Frame 069272/0745 →
LICENSE Recorded Oct 28, 2024
From: PERATECH IP LTD.
To: PERATECH HOLDCO LTD.
Reel/Frame 069444/0115 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2024
From: PERATECH HOLDCO LTD.
To: PERATECH IP LTD
Reel/Frame 068840/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: FENG, XU; JIN, CAO; KUN, SUN; XIN, WEI
To: PERA ELECTRONIC TECHNOLOGY (SUZHOU) CO. LTD
Reel/Frame 060578/0630 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: PERA ELECTRONIC TECHNOLOGY (SUZHOU) CO. LTD
To: PERATECH HOLDCO LIMITED
Reel/Frame 060578/0710 →
Priority Claims (1)
CN 202020134930.7 · Jan 21, 2020 · national
Continuity (1)
Related Publication 20230142704A1 · May 11, 2023