Display panel, and method for manufacturing same and display device
Provided is a display panel. The display panel comprises a base substrate; a gate metal layer and a source/drain metal layer sequentially laminated on a side of the base substrate; and an inorganic insulating layer and an organic planarization layer sequentially laminated between the gate metal layer and the source/drain metal layer; wherein an orthographic projection of the gate metal layer on the base substrate and an orthographic projection of the source/drain metal layer on the base substrate have an overlapped portion, and an orthographic projection of the organic planarization layer on the substrate overlaps the overlapped portion.
1 . A display panel, comprising:
a base substrate;
a gate metal layer and a source/drain metal layer sequentially laminated on a side of the base substrate along a direction away from the base substrate; and
an inorganic insulating layer and an organic planarization layer sequentially laminated between the gate metal layer and the source/drain metal layer along the direction away from the base substrate;
wherein an orthographic projection of the gate metal layer on the base substrate and an orthographic projection of the source/drain metal layer on the base substrate have an overlapped portion, and an orthographic projection of the organic planarization layer on the substrate overlaps the overlapped portion; and
the base substrate is provided with a display region and a non-display region surrounding the display region; wherein the organic planarization layer is disposed in the display region and is not disposed in the non-display region; and each of the source/drain metal layer, the gate metal layer and the inorganic insulating layer is disposed in both the display region and the non-display region.
2 . The display panel according to claim 1 , wherein the orthographic projection of the organic planarization layer on the base substrate covers the overlapped portion.
3 . The display panel according to claim 1 , wherein a dielectric constant of a material of the organic planarization layer is greater than or equal to 3 and less than or equal to 4.
4 . The display panel according to claim 1 , wherein
the gate metal layer comprises: a first gate metal layer and a second gate metal layer sequentially laminated along a direction away from the base substrate; and
the inorganic insulating layer comprises:
a first gate insulating layer disposed between the first gate metal layer and the second gate metal layer; and
an interlayer dielectric (ILD) layer disposed between the second gate metal layer and the source/drain metal layer.
5 . The display panel according to claim 1 , further comprising:
an inorganic layer substrate, an active layer and a second gate insulating layer disposed between the gate metal layer and the base substrate and sequentially laminated along a direction away from the base substrate; and
a target planarization layer, a pixel electrode and a pixel definition layer sequentially laminated on a side of the source/drain metal layer away from the base substrate;
wherein the source/drain metal layer is connected to the active layer through a via hole penetrating the organic planarization layer, the inorganic insulating layer and the second gate insulating layer.
6 . The display panel according to claim 5 , wherein the via hole comprises: a first via hole penetrating the organic planarization layer, and a second via hole penetrating the inorganic insulating layer and the second gate insulating layer, wherein
an orthographic projection of an opening, close to the base substrate, of the first via hole on the base substrate coincides with an orthographic projection of an opening, away from the base substrate, of the second via hole on the base substrate.
7 . The display panel according to claim 6 , wherein
the base substrate is provided with a display region and a non-display region surrounding the display region; wherein the organic planarization layer is disposed in the display region; and each of the source/drain metal layer, the gate metal layer and the inorganic insulating layer is disposed in the display region and the non-display region;
the orthographic projection of the organic planarization layer on the base substrate covers the overlapped portion;
a dielectric constant of a material of the organic planarization layer is greater than or equal to 3 and less than or equal to 4; and
the gate metal layer comprises: a first gate metal layer and a second gate metal layer sequentially laminated along a direction away from the base substrate; and the inorganic insulating layer comprises: a first gate insulating layer disposed between the first gate metal layer and the second gate metal layer, and an interlayer dielectric (ILD) layer disposed between the second gate metal layer and the source/drain metal layer.
8 . A method for manufacturing a display panel, comprising:
providing a base substrate;
forming a gate metal layer on a side of the base substrate;
forming a source/drain metal layer on a side of the gate metal layer away from the base substrate; and
forming an inorganic insulating layer and an organic planarization layer sequentially laminated between the gate metal layer and the source/drain metal layer along a direction away from the base substrate;
wherein an orthographic projection of the gate metal layer on the base substrate and an orthographic projection of the source/drain metal layer on the base substrate have an overlapped portion, and an orthographic projection of the organic planarization layer on the substrate overlaps the overlapped portion; and
the base substrate is provided with a display region and a non-display region surrounding the display region; wherein the organic planarization layer is disposed in the display region and is not disposed in the non-display region; and each of the source/drain metal layer, the gate metal layer and the inorganic insulating layer is disposed in both the display region and the non-display region.
9 . The method according to claim 8 , wherein forming the inorganic insulating layer and the organic planarization layer sequentially laminated between the gate metal layer and the source/drain metal layer along the direction away from the base substrate comprises:
forming an inorganic material layer on the side of the gate metal layer away from the base substrate;
forming the organic planarization layer with a first via hole on a side of the inorganic material layer away from the gate metal layer; and
etching the inorganic material layer by using the organic planarization layer as a protective layer to form the inorganic insulating layer with a second via hole;
wherein an orthographic projection of the first via hole on the base substrate overlaps an orthographic projection of the second via hole on the base substrate.
10 . The method according to claim 8 , wherein forming the inorganic insulating layer and the organic planarization layer sequentially laminated between the gate metal layer and the source/drain metal layer along the direction away from the base substrate comprises:
forming an inorganic material layer on the side of the gate metal layer away from the base substrate;
forming a photoresist pattern on a side of the inorganic material layer away from the gate metal layer;
etching the inorganic material layer by using the photoresist pattern as a protective layer to form the inorganic insulating layer with a second via hole;
stripping off the photoresist pattern; and
forming the organic planarization layer with a first via hole on a side of the inorganic insulating layer away from the gate metal layer;
wherein an orthographic projection of the first via hole on the base substrate overlaps an orthographic projection of the second via hole on the base substrate.
11 . A display device, comprising: a driver IC, and a display panel; wherein
the display panel comprises:
a base substrate;
a gate metal layer and a source/drain metal layer sequentially laminated on a side of the base substrate along a direction away from the base substrate; and
an inorganic insulating layer and an organic planarization layer sequentially laminated between the gate metal layer and the source/drain metal layer along the direction away from the base substrate; wherein
an orthographic projection of the gate metal layer on the base substrate and an orthographic projection of the source/drain metal layer on the base substrate have an overlapped portion, and an orthographic projection of the organic planarization layer on the substrate overlaps the overlapped portion; and
the base substrate is provided with a display region and a non-display region surrounding the display region; wherein the organic planarization layer is disposed in the display region and is not disposed in the non-display region; and each of the source/drain metal layer, the gate metal layer and the inorganic insulating layer is disposed in both the display region and the non-display region;
wherein the driver IC is connected to the display panel and configured to drive the display panel to display.
12 . The display device according to claim 11 , wherein the orthographic projection of the organic planarization layer on the base substrate covers the overlapped portion.
13 . The display device according to claim 11 , wherein a dielectric constant of a material of the organic planarization layer is greater than or equal to 3 and less than or equal to 4.