Sealing layer for biodegradable electrochemical device and methods thereof
Examples of the present disclosure include an electrochemical device. The electrochemical device includes a first substrate layer. The electrochemical device also includes an anode disposed upon the first substrate layer. The electrochemical device also includes a second substrate layer. The electrochemical device also includes a cathode disposed upon the second substrate layer. The electrochemical device also includes an electrolyte composition disposed between and in contact with the anode and the cathode. The electrochemical device also includes a sintered sealing layer composition disposed between the first substrate layer and the second substrate layer. A sintered sealing layer composition and methods for producing are also disclosed.
1 . An electrochemical device, comprising:
a first substrate;
a first electrode disposed upon the first substrate;
a second substrate; and
a sintered sealing layer composition comprising a biodegradable material disposed between the first substrate and the second substrate.
2 . The electrochemical device of claim 1 , further comprising a second electrode disposed upon the first substrate, wherein the first electrode and the second electrode are disposed in a lateral X-Y plane geometry.
3 . The electrochemical device of claim 1 , further comprising a second electrode disposed upon the second substrate, wherein the first electrode and the second electrode are disposed in a stacked geometry.
4 . The electrochemical device of claim 1 , wherein the sintered sealing layer composition forms a moisture barrier for the electrochemical device.
5 . The electrochemical device of claim 1 , wherein the sintered sealing layer composition comprises poly(¿-caprolactone) (PCL), polylactic acid (PLA) or a combination thereof.
6 . The electrochemical device of claim 1 , wherein the sintered sealing layer composition comprises a biodegradable polymer and an emulsifying additive.
7 . The electrochemical device of claim 6 , wherein the emulsifying additive comprises silicon dioxide.
8 . The electrochemical device of claim 6 , wherein the emulsifying additive is present in the sintered sealing layer composition in an amount of from about 1.0% to about 10.0% based on a total weight of the sintered sealing layer composition.
9 . The electrochemical device of claim 1 , wherein the sintered sealing layer composition is disposed between the first substrate and the second substrate in a laterally non-continuous pattern.
10 . The electrochemical device of claim 1 , wherein the sintered sealing layer composition comprises a particle having a Dv(50) particle size of from about 20 μm to about 150 μm prior to sintering.
11 . The electrochemical device of claim 10 , wherein the sintered sealing layer composition comprises a bimodal particle size distribution.
12 . The electrochemical device of claim 1 , wherein the sintered sealing layer comprises a first portion and a second portion, the second portion comprising a thickness greater than that of the first portion.
13 . A sealing layer composition, comprising:
a biodegradable polymer, wherein:
the biodegradable polymer comprises a bimodal particle size distribution; and
the sealing layer composition is sintered.
14 . The sealing layer composition of claim 13 , further comprising an emulsifying additive.
15 . The composition of claim 13 , wherein the sintered sealing layer composition is incorporated into an electrochemical device and forms a moisture barrier for the electrochemical device.
16 . The composition of claim 15 , wherein the electrochemical device comprises a battery.
17 . A method of producing a sealing layer for an electrochemical device, comprising:
preparing a substrate;
dispensing a sealing layer composition onto the substrate;
sintering the sealing layer in one or more locations using a laser; and
removing any residual sealing layer composition from the substrate that was not sintered; and
wherein the sintered sealing layer comprises a biodegradable material and forms a moisture barrier for the electrochemical device.
18 . The method of producing a sealing layer of claim 17 , wherein the sealing layer is subjected to a temperature greater than or equal to a melting temperature of the sealing layer composition.
19 . The method of producing a sealing layer of claim 17 , further comprising depositing two or more layers of sealing layer composition.