Cooling system and methods
Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open channels on a surface of the core; coupling a cover to the core to cover the open channels; and coupling the cover to the core with a thermal fitting. In some embodiments, an electro-osmotic (EO) pump, a heat exchanger, and one or more gas accumulators are coupled to the core via a fluid circuit. In certain embodiments, a first gas accumulator is coupled to the EO pump with a thermal fitting, the EO pump is coupled to the heat exchanger with a thermal fitting, and the heat exchange is coupled to a second gas accumulator with a thermal fitting. In one embodiment, the first gas accumulator and the second gas accumulator are coupled to the core with thermal fittings.
1. A method of manufacturing a cooling system, the method comprising:
providing a core having one or more channels, the channels configured to provide a passageway for a working fluid;
providing a cover configured to couple to the core and to cover the channels;
coupling the core and the cover with a thermal fitting;
providing a first gas accumulator configured to operationally couple to the channels, wherein the first gas accumulator comprises a gas accumulator body that defines a first gas collection chamber;
providing an electro-osmotic (EO) pump configured to couple operationally to the gas accumulator;
coupling the EO pump to the gas accumulator; and
coupling the gas accumulator to the channels.
2. The method of claim 1 , wherein the core comprises a metal core printed circuit board.
3. The method of claim 1 , wherein the core comprises a first core side and a second core side, wherein the channels are placed on the second core side, and wherein a printed circuit board is thermally coupled to the first core side.
4. The method of claim 3 , wherein the core comprises a fluid channel inlet and a fluid channel outlet placed on the first core side.
5. The method of claim 4 , further comprising providing a second gas accumulator having a second gas accumulator body that defines a second gas collection chamber, coupling the first gas accumulator operationally to the fluid channel outlet, and coupling the second gas accumulator operationally to the fluid channel inlet.
6. The method of claim 1 , further comprising providing a heat exchanger and operationally coupling the heat exchanger to the EO pump.
7. The method of claim 6 , further comprising coupling the heat exchanger to the EO pump with a thermal fitting.
8. The method of claim 1 , further comprising coupling the EO pump to the gas accumulator with a thermal fitting.
9. The method of claim 8 , further comprising coupling the gas accumulator to the core with a thermal fitting.
10. A method of manufacturing a cooling system, the method comprising:
providing a core having a first core side and a second core side;
providing one or more channels on the second core side, the channels configured to provide a passageway for a working fluid;
providing a fluid channel inlet and a fluid channel outlet on the first core side;
providing a cover configured to couple to the core and to cover the channels;
coupling the core and the cover with a thermal fitting;
providing a first gas accumulator configured to operationally couple to the channels, the first gas accumulator having a first gas accumulator body that defines a first gas collection chamber for facilitating the accumulation of a gas during operation of the cooling system;
coupling the first gas accumulator to the fluid channel outlet with a thermal fitting;
providing a second gas accumulator configured to operationally couple to the channels, the second gas accumulator having a second gas accumulator body that defines a second gas collection chamber for facilitating the accumulation of a gas during operation of the cooling system;
coupling the second gas accumulator to the fluid channel inlet with a thermal fitting;
providing an electro-osmotic (EO) pump and coupling the EO pump to the first gas accumulator with a thermal fitting; and
providing a heat exchanger and coupling the heat exchanger to the EO pump with a thermal fitting.
11. The method of claim 10 , wherein the core comprises a metal core printed circuit board.
12. The method of claim 10 , further comprising coupling the heat exchanger to the second gas accumulator with a thermal fitting.
13. The method of claim 10 , wherein the EO pump comprises an EO pump comprising a pump filling port.
14. The method of claim 13 , wherein the EO pump further comprises a filling port cap configured to cap the pump filling port, and coupling the filling port cap to the pump filling port with a thermal fitting.
15. The method of claim 10 , wherein the heat exchanger comprises a pump filling port.
16. The method of claim 15 , further comprising providing a filling port cap configured to cap the pump filling port, and coupling the filling port cap to the pump filling port with a thermal fitting.
17. The method of claim 10 , wherein the EO pump comprises a membrane, the membrane configured to receive a DC current.
18. The method of claim 10 , wherein the first gas accumulator is made of copper.
19. The method of claim 10 , wherein coupling the core and the cover with a thermal fitting comprises shrinking the core by cooling the core, then placing the core inside the cover.
20. The method of claim 10 , wherein coupling the core and the cover with a thermal fitting comprises expanding the cover by heating the cover, then placing the core inside the cover.