Cooling system and methods
Disclosed are systems and methods for cooling electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open, fluid channels on a first core side; providing a cover configured to cover the channels, and the cover further configured to couple to the core to form a leak proof seal. In some embodiments, a leak proof seal can be obtained through an interference fit. In certain embodiments, a leak proof seal can be obtained through a thermal fitting. In one embodiment, the core is shrank through cooling and then placed inside the cover. In some embodiments, the cover is expanded through heating and the core is placed inside the cover. In certain embodiments, the core is a metal core printed circuit board. In one embodiment, an electro-osmotic pump, a gas accumulator, and a heat exchanger can be operationally coupled to the channels.
1. A method of manufacturing a cooling system, the method comprising:
providing a core having one or more open channels made on a first side of the core;
providing a printed circuit board in thermal communication with a second side of the core:
providing a cover configured to couple to the core and to cover the channels;
thermally fitting the core and the cover;
wherein thermally fitting comprises:
heating the cover to a first temperature to cause an expansion of the cover;
placing the core at least partially in the cover; and
wherein, after the cover cools to a second temperature, the core and the cover form a sealed joint between the core and the cover.
2. The method of claim 1 , wherein providing a core further comprises providing a core having a fluid channel inlet and a fluid channel outlet, both the fluid channel inlet and the fluid channel outlet placed on a second side of the core.
3. The method of claim 2 , further comprising providing a first gas accumulator operationally coupled to the channels.
4. The method of claim 3 , further comprising providing a heat exchanger and an electro-osmotic pump, both the heat exchanger and the electro-osmotic pump operationally coupled to the channels.
5. The method of claim 1 , wherein providing a core comprises providing a metal core printed circuit board.
6. The method of claim 1 , wherein providing a cover comprises providing a cover made of copper.
7. The method of claim 1 , wherein providing a core further comprises providing a core having fluid channel inlet and a fluid channel outlet placed on a second side of the core, and further comprising providing a first gas accumulator and coupling the first gas accumulator to the fluid channel inlet.
8. The method of claim 1 , further comprising providing a first gas accumulator operationally coupled to the channels.
9. The method of claim 1 , further comprising providing a heat exchanger operationally coupled to the channels.
10. The method of claim 1 , further comprising providing an electro-osmotic pump operationally coupled to the channels.
11. A method of manufacturing a cooling system, the method comprising:
providing a core having one or more open channels made on a first side of the core;
providing a printed circuit board in thermal communication with a second side of the core;
providing a cover configured to couple to the core and to cover the channels;
thermally fitting the core and the cover to form a sealed joint between the core and the cover; and
providing a first gas accumulator operationally coupled to the channels, a pump operationally coupled to the first gas accumulator, a heat exchanger operationally coupled to the pump, and a second gas accumulator operationally coupled to the heat exchanger and to the channels.
12. The method of claim 11 , further comprising coupling the first gas accumulator to the channels with a thermal fitting.
13. The method of claim 11 , further comprising coupling the pump to the gas accumulator with a thermal fitting.
14. The method of claim 11 , further comprising coupling the heat exchanger to the pump with a thermal fitting.
15. The method of claim 11 , further comprising coupling the heat exchanger to the second gas accumulator with a thermal fitting.
16. The method of claim 11 , further comprising the second gas accumulator to the channels with a thermal fitting.
17. A method of manufacturing a cooling system, the method comprising:
providing a core having one or more open channels made on a first side of the core;
providing a cover configured to couple to the core and to cover the channels;
thermally fitting the core and the cover;
wherein thermally fitting comprises:
cooling the core to a first temperature to cause a shrinking of the core;
placing the core at least partially in the cover; and
wherein, after the cover warms up to a second temperature, the core and the cover form a sealed joint between the core and the cover.
18. A method of manufacturing a cooling system, the method comprising:
providing a core having one or more open channels made on a first side of the core;
providing a cover configured to couple to the core and to cover the channels;
thermally fitting the core and the cover to form a sealed joint between the core and the cover; and
wherein providing a cover comprises providing a cover having a peripheral raised wall, said wall configured to couple to a side edge of the core.
19. A method of manufacturing a cooling system, the method comprising:
providing a core having one or more open channels made on a first side of the core;
providing a printed circuit board in thermal communication with a second side of the core;
providing a cover configured to couple to the core and to cover the channels;
thermally fitting the core and the cover to form a sealed joint between the core and the cover;
wherein providing a core further comprises providing a core having a fluid channel inlet and a fluid channel outlet placed on a second side of the core;
providing a first gas accumulator and coupling the first gas accumulator to the fluid channel outlet; and
providing a second gas accumulator and coupling the second gas accumulator to the fluid channel inlet.