IP Library Granted Patent US 11,930,329
Granted Patent B2
US 11,930,329 · App. 17/813,280 · Granted Mar 12, 2024

Reproducing audio signals with a haptic apparatus on acoustic headphones and their calibration and measurement

Inventors: Rocky Chau-Hsiung Lin (Cupertino, CA); Thomas Yamasaki (Anaheim Hills, CA)
Assignee: ALPINE ELECTRONICS OF SILICON VALLEY, INC.
H04R29/00G01H11/06G06F3/165H04R1/1008H04R1/1091H04R1/22H04R3/04H04R31/00H04R1/1041H04R2420/07H04R2460/13
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Quick Facts
Patent No.
US 11,930,329
App. No.
17/813,280
Granted
Mar 12, 2024
Kind
B2
Abstract

Method and devices for testing a headphone with increased sensation are provided. The headphone can filter and amplify low frequency audio signals, which are then sent to a haptic device in the headphone. The haptic device can cause bass sensations at the top of the skull and at both ear cups. The testing system can evaluate the haptic and acoustic sensations produced by the headphone to evaluate if they have been properly assembled and calibrate the headphones if necessary.

Claims (27)

1. A headset, comprising:

a headband configured to be placed on the top of a head;

a first circumaural ear cup incorporating a first driver therein attached to one end of the headband, wherein the first driver is configured to receive a first channel of an audio signal;

a second circumaural ear cup incorporating a second driver therein, attached to the opposite end of the headband and oriented to face back toward the first circumaural ear cup, wherein the second driver is configured to receive a second channel of an audio signal;

a signal processor configured to receive at least one of the first and second audio channels;

an amplifier, wherein the input of the amplifier is connected to the output of the signal processor;

a first haptic device incorporated in the first circumaural ear cup, wherein the first haptic device is a mono, low-frequency driver configured to receive at least one of the first and second audio channels; and

a second haptic device incorporated in the second circumaural ear cup, wherein the second haptic device is a mono, low-frequency driver configured to receive at least one of the first and second audio channels.

2. The headset of claim 1 , wherein the headband provides a clamping force of approximately 300 g to 600 g.

3. The headset of claim 2 , wherein at least one of the first and second circumaural ear cups includes a headphone jack.

4. The headset of claim 3 , wherein the mass of the first haptic device is not significantly higher or lower than the mass of the headband.

5. The headset of claim 1 , wherein the first haptic device uses a voice coil or magnet to generate vibrations.

6. The headset of claim 5 , wherein the first haptic device is connected to the output of the amplifier.

7. The headset of claim 6 , wherein the first haptic device is configured to limit reproduction to low-frequency content from the at least one of the first and second audio channels.

8. The headset of claim 7 , wherein the headset includes a user control to adjust the operation of the first haptic device.

9. The headset of claim 1 , wherein the headset includes a network interface.

10. The headset of claim 9 , wherein the network interface is configured to receive audio information.

11. The headset of claim 10 , wherein the network interface is a wireless network interface.

12. The headset of claim 11 , wherein the network interface includes a radio for making a communication connection.

13. The headset of claim 1 , wherein at least one of the first and second circumaural ear cups is configured to swivel.

14. The headset of claim 1 , wherein the headset is configured to receive non-audio information.

15. The headset of claim 14 , wherein the non-audio information includes a haptic event.

16. The headset of claim 15 , wherein the headset is configured to simulate a shaking sensation to occur substantially simultaneously with the haptic event.

17. The headset of claim 16 , wherein the haptic event includes an explosion event on a gaming device.

18. The headset of claim 14 , wherein the non-audio information includes a sound profile.

19. The headset of claim 18 , wherein the sound profile is customized to a user.

20. The headset of claim 19 , further comprising electronics configured to receive the sound profile and modify the first and second audio channels in accordance with the sound profile.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2022
From: LIN, ROCKY CHAU-HSIUNG; YAMASAKI, THOMAS
To: ALPINE ELECTRONICS OF SILICON VALLEY, INC.
Reel/Frame 060715/0111 →
Continuity (8)
Continuation 16787532 · Feb 11, 2020
Continuation 15669823 · Aug 4, 2017
Continuation 14609357 · Jan 29, 2015
Continuation 14512679 · Oct 13, 2014
Continuation In Part 14269015 · May 2, 2014
Continuation 14181512 · Feb 14, 2014
Provisional Application 61924148 · Jan 6, 2014
Related Publication 20230044408A1 · Feb 9, 2023