IP Library Granted Patent US 12,427,729
Granted Patent B2
US 12,427,729 · App. 17/828,999 · Granted Sep 30, 2025

Method of joining molded or three-dimensional printed parts to thermoplastic composite structures

Inventor: Mark Anthony Wadsworth (Wichita, KS)
Assignee: Spirit AeroSystems, Inc.
B29C70/342B29C70/544B33Y80/00B29K2101/12B29K2905/00B29L2031/3082
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Quick Facts
Patent No.
US 12,427,729
App. No.
17/828,999
Granted
Sep 30, 2025
Kind
B2
Abstract

A method for fusing thermoplastic composite structures includes placing a thermoplastic substructure on an inner surface of a skin that is laid up on a shaping surface of a tool configured to maintain the shape of an outer mold line. The method further includes applying at least one metal layer over the substructure and applying an insulation layer over edge portions of the substructure and over exposed portions of the inner surface of the skin not in contact with the substructure and applying a vacuum bag that at least partly encloses the skin, the substructure, and the metal layer. The method yet still further includes applying heat to the shaping surface to fuse the substructure to the skin such that the skin exceeds its melting point and at least a portion of a raised segment of the substructure does not exceed its melting point.

Claims (12)

1. A method for fusing thermoplastic substructures with thermoplastic composite skins to form composite structures, the method comprising:

laying a skin comprising an outer surface and an inner surface on a shaping surface of a tool configured to maintain the outer surface in a shape of an outer mold line, the inner surface of the skin comprising a first faying surface;

laying a substructure on the inner surface of the skin, the substructure comprising a second faying surface and a non-faying surface, the second faying surface contacting the first faying surface of the skin, wherein the substructure is a thermoplastic component made by a molding process, three-dimensional printing, or extrusion prior to being laid on the inner surface of the skin;

applying at least one metal layer over at least a portion of the substructure;

applying at least one insulation layer over at least a portion of the metal layer and over exposed portions of the inner surface of the skin not in contact with the substructure;

applying a vacuum bag over the skin and the substructure such that the skin and the substructure are enclosed by the combination of the vacuum bag and the shaping surface of the tool; and

applying heat to the shaping surface to fuse the substructure to the skin such that the skin exceeds its melting point;

wherein the substructure is fully enclosed between the skin and the metal layer.

2. The method of claim 1 , wherein the vacuum bag comprises a first side adjacent the composite part and a second side opposite the first side, further comprising flowing a coolant fluid into contact with and over the second side of the vacuum bag during the fusing of the substructure to the skin, the coolant fluid being at a lower temperature than the skin.

3. The method of claim 1 , wherein the metal layer is placed over the at least a portion of the substructure via electroless deposition of a metal coating.

4. The method of claim 1 , wherein the metal layer is a foil sheet shaped onto non-faying surfaces of the substructure.

5. The method of claim 1 , wherein the metal layer is a reusable metal mold and a release agent is applied between the reusable metal mold and the substructure.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Dec 9, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073900/0653 →
RELEASE OF SECURITY INTEREST Recorded Dec 9, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073916/0346 →
SECURITY AGREEMENT Recorded Jul 8, 2024
From: SPIRIT AEROSYSTEMS, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 068217/0456 →
RELEASE OF SECURITY INTEREST Recorded Dec 4, 2023
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: SPIRIT AEROSYSTEMS, INC.; SPIRIT AEROSYSTEMS HOLDINGS, INC.; SPIRIT AEROSYSTEMS NORTH CAROLINA, INC.
Reel/Frame 065757/0004 →
SECURITY AGREEMENT (SECOND LIEN NOTES) Recorded Nov 21, 2023
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 065659/0585 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2023
From: WADSWORTH, MARK ANTHONY
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 063090/0283 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 23, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 061993/0847 →
SECURITY INTEREST Recorded Nov 23, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 061869/0241 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 23, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 061993/0236 →
Continuity (4)
Continuation In Part 17028569 · Sep 22, 2020
Continuation In Part PCTUS2020031784 · May 7, 2020
Continuation In Part 16404794 · May 7, 2019
Related Publication 20220288873A1 · Sep 15, 2022
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