IP Library Granted Patent US 12,023,925
Granted Patent B2
US 12,023,925 · App. 17/834,601 · Granted Jul 2, 2024

Liquid ejection head

Inventors: Takashi Tozuka (Sunto Shizuoka, JP); Minoru Koyata (Mishima Shizuoka, JP); Tsubasa Konishi (Sunto Shizuoka, JP); Noboru Nitta (Tagata Shizuoka, JP)
Assignee: Toshiba Tec Kabushiki Kaisha
B41J2/14201B41J2/14209B41J2/1433B41J2002/14419B41J2002/14491B41J2202/08B41J2202/12B41J2202/20
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Quick Facts
Patent No.
US 12,023,925
App. No.
17/834,601
Granted
Jul 2, 2024
Kind
B2
Abstract

A liquid ejection head includes a plate with a plurality of nozzles arranged along a first direction through which liquid is ejected. A substrate is on the plate and includes a hole extending along the first direction by which the liquid is supplied. An actuator is on the substrate along the hole. The actuator has a plurality of pressure chambers, from which the liquid from the hole is ejected by the nozzles, and a plurality of air chambers. Each air chamber is between two of the pressure chambers that are adjacent to each other. A plurality of individual electrodes is formed on the substrate and each is connected to a corresponding one of the pressure chambers. A common electrode is formed on the substrate and an inner peripheral surface of the hole.

Claims (48)

1. A liquid ejection head, comprising:

a plate including a plurality of nozzles arranged along a first direction;

a substrate on the plate and including a hole extending along the first direction and through which liquid is supplied for ejection from the plurality of nozzles;

a first actuator on the substrate along the hole and including:

a plurality of pressure chambers from which the liquid is supplied from the hole to the nozzles, and

a plurality of air chambers, each air chamber disposed between two of the pressure chambers that are adjacent to each other;

a plurality of individual electrodes, each individual electrode on the substrate and connected to a corresponding one of the pressure chambers;

a common electrode on the substrate and an inner peripheral surface of the hole; and

a second actuator on the substrate along the hole, wherein

the hole is between the first and second actuators.

2. The liquid ejection head according to claim 1 , wherein the liquid is supplied to the first and second actuators through the hole.

3. The liquid ejection head according to claim 1 , wherein the substrate includes one or more grooves between the hole and the first actuator and on which a part of the common electrode is provided.

4. The liquid ejection head according to claim 3 , wherein the grooves are a plurality of V-shaped grooves arranged along a second direction intersecting the first direction and each extending along the first direction.

5. The liquid ejection head according to claim 1 , wherein the hole is at a position corresponding to a center of each of the pressure chambers in a second direction intersecting the first direction.

6. The liquid ejection head according to claim 1 , further comprising:

a manifold on the substrate and including a liquid supply flow path that communicates with the hole.

7. The liquid ejection head according to claim 1 , further comprising:

a frame attached to the substrate by an adhesive, wherein

the common electrode is covered by the adhesive.

8. The liquid ejection head according to claim 1 , wherein

the common electrode is a film of nickel, gold, or copper, and

the common electrode has a thickness between 0.5 lAm to 5 μm.

9. The liquid ejection head according to claim 1 , wherein the liquid is ink for printing or conductive particles for forming a wiring pattern.

10. A liquid ejection device, comprising:

a conveyer configured to convey a medium along a conveyance path; and

a liquid ejection head including:

a plate including a plurality of nozzles arranged along a first direction to face the conveyed medium,

a substrate on the plate and including a hole extending along the first direction and through which liquid is supplied for ejection from the plurality of nozzles,

a first actuator on the substrate along the hole and including:

a plurality of pressure chambers from which the liquid is supplied from the hole to the nozzles, and

a plurality of air chambers, each air chamber disposed between two of the pressure chambers that are adjacent to each other,

a plurality of individual electrodes, each individual electrode on the substrate and connected to a corresponding one of the pressure chambers,

a common electrode on the substrate and an inner peripheral surface of the hole, and

a second actuator on the substrate along the hole, wherein

the hole is between the first and second actuators.

11. The liquid ejection device according to claim 10 , wherein the liquid is supplied to the first and second actuators through the hole.

12. The liquid ejection device according to claim 10 , wherein the substrate includes one or more grooves between the hole and the first actuator and on which a part of the common electrode is provided.

13. The liquid ejection device according to claim 12 , wherein the grooves are a plurality of V-shaped grooves arranged along a second direction intersecting the first direction and each extending along the first direction.

14. The liquid ejection device according to claim 10 , wherein the hole is at a position corresponding to a center of each of the pressure chambers in a second direction intersecting the first direction.

15. The liquid ejection device according to claim 10 , further comprising:

a manifold on the substrate and including a liquid supply flow path that communicates with the hole.

16. The liquid ejection device according to claim 10 , further comprising:

a frame attached to the substrate by an adhesive, wherein

the common electrode is covered by the adhesive.

17. The liquid ejection device according to claim 10 , wherein

the common electrode is a film of nickel, gold, or copper, and

the common electrode has a thickness between 0.5 μm to 5 μm.

18. The liquid ejection device according to claim 10 , wherein the liquid is ink for printing or conductive particles for forming a wiring pattern.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2024
From: TOSHIBA TEC KABUSHIKI KAISHA
To: RISO TECHNOLOGIES CORPORATION
Reel/Frame 068493/0970 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2022
From: TOZUKA, TAKASHI; KOYATA, MINORU; KONISHI, TSUBASA; NITTA, NOBORU
To: TOSHIBA TEC KABUSHIKI KAISHA
Reel/Frame 060128/0448 →
Priority Claims (1)
JP 2021-154109 · Sep 22, 2021 · national
Continuity (1)
Related Publication 20230087927A1 · Mar 23, 2023