IP Library Granted Patent US 11,736,961
Granted Patent B2
US 11,736,961 · App. 17/837,092 · Granted Aug 22, 2023

Multi-band remote unit in a wireless communications system (WCS)

Inventors: Yona Henia (Mazkeret Batia, IL); Roi Yosy Ziv (Ramat-Gan, IL)
Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATION
H04W24/02H03M1/60H03M1/86H04W72/0453H04W72/21H04W72/23H04W72/29H04W88/085
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Quick Facts
Patent No.
US 11,736,961
App. No.
17/837,092
Granted
Aug 22, 2023
Kind
B2
Abstract

A multi-band remote unit is disclosed. The multi-band remote unit includes a number of radio frequency (RF) front-end circuits configured to generate a number of downlink RF communications signals associated with a number of frequency bands based on a number of downlink digital communications signals, respectively. The multi-band remote unit also includes a digital interface circuit and a digital processing circuit. The digital interface circuit is configured to receive an encapsulated downlink digital communications signal and generate the downlink digital communications signals associated with the frequency bands based on the encapsulated downlink digital communications signal. The digital processing circuit is configured to digitally process the downlink digital communications signals before providing the downlink digital communications signals to the RF front-end circuits. As such, it may be possible to share the digital processing circuit among RF front-end circuits, thus helping to reduce cost and/or power consumption of the multi-band remote unit.

Claims (80)

1. A multi-band remote unit for a wireless communications system (WCS), comprising:

a digital front-end integrated circuit (IC), comprising:

a digital interface circuit communicatively coupled to a central unit in the WCS and configured to:

receive an encapsulated downlink digital communications signal corresponding to a plurality of frequency bands from the central unit; and

generate a plurality of downlink digital communications signals associated with the plurality of frequency bands, respectively, based on the encapsulated downlink digital communications signal; and

a digital processing circuit configured to receive and digitally process the plurality of downlink digital communications signals; and

a plurality of radio frequency (RF) front-end circuits provided outside the digital front-end IC, the plurality of RF front-end circuits configured to:

receive the plurality of downlink digital communications signals, respectively, from the digital processing circuit; and

convert the plurality of downlink digital communications signals into a plurality of downlink RF communications signals for transmission in the plurality of frequency bands, respectively,

wherein the plurality of RF front-end circuits comprises a plurality of downlink paths, the plurality of downlink paths comprising:

a plurality of digital-to-analog converters (DACs) coupled to the digital processing circuit and configured to convert the plurality of downlink digital communications signals into a plurality of downlink intermediate frequency (IF) communications signals, respectively;

a plurality of downlink frequency conversion circuits; and

a plurality of power amplifiers.

2. The multi-band remote unit of claim 1 , wherein the digital front-end IC is a field-programmable gate array (FPGA).

3. The multi-band remote unit of claim 1 , wherein the digital processing circuit comprises:

a plurality of crest factor reduction (CFR) circuits configured to reduce peak-to-average ratios (PARs) of the plurality of downlink digital communications signals, respectively; and

a plurality of digital pre-distortion (DPD) circuits coupled to the plurality of CFR circuits.

4. The multi-band remote unit of claim 3 , further comprising a plurality of DPD feedback paths coupled between the plurality of power amplifiers and the plurality of DPD circuits, respectively.

5. A multi-band remote unit for a wireless communications system (WCS), comprising:

a digital front-end integrated circuit (IC), comprising:

a digital interface circuit communicatively coupled to a central unit in the WCS and configured to:

receive an encapsulated downlink digital communications signal corresponding to a plurality of frequency bands from the central unit; and

generate a plurality of downlink digital communications signals associated with the plurality of frequency bands; and

a digital processing circuit configured to receive and digitally process the plurality of downlink digital communications signals; and

a plurality of radio frequency (RF) front-end circuits provided outside the digital front-end IC, the plurality of RF front-end circuits configured to:

receive the plurality of downlink digital communications signals, respectively, from the digital processing circuit; and

convert the plurality of downlink digital communications signals into a plurality of downlink RF communications signals for transmission in the plurality of frequency bands,

wherein the plurality of RF front-end circuits comprises a plurality of downlink paths, the plurality of downlink paths comprising:

a plurality of digital-to-analog converters (DACs) coupled to the digital processing circuit and configured to convert the plurality of downlink digital communications signals into a plurality of downlink intermediate frequency (IF) communications signals, respectively;

a plurality of downlink frequency conversion circuits configured to convert the plurality of downlink IF communications signals into the plurality of downlink RF communications signals; and

a plurality of power amplifiers.

6. The multi-band remote unit of claim 5 , wherein the digital front-end IC is a field-programmable gate array (FPGA).

7. The multi-band remote unit of claim 6 , wherein the digital processing circuit comprises:

a plurality of crest factor reduction (CFR) circuits; and

a plurality of digital pre-distortion (DPD) circuits.

8. The multi-band remote unit of claim 7 , further comprising a plurality of DPD feedback paths coupled between the plurality of power amplifiers and the plurality of DPD circuits.

9. The multi-band remote unit of claim 7 , wherein the digital interface circuit comprises:

an encapsulation/decapsulation circuit coupled to the central unit; and

a routing circuit.

10. The multi-band remote unit of claim 9 , further comprising an antenna combiner/splitter circuit coupled to an antenna port, the antenna combiner/splitter circuit configured to combine the plurality of downlink RF communications signal to generate a combined downlink RF communications signal for transmission via the antenna port.

11. A multi-band remote unit for a wireless communications system (WCS), comprising:

a digital front-end printed circuit board (PCB), comprising:

a digital interface circuit communicatively coupled to a central unit in the WCS and configured to:

receive an encapsulated downlink digital communications signal corresponding to a plurality of frequency bands from the central unit; and

generate a plurality of downlink digital communications signals associated with the plurality of frequency bands, respectively, based on the encapsulated downlink digital communications signal; and

a digital processing circuit configured to receive and digitally process the plurality of downlink digital communications signals; and

a plurality of radio frequency (RF) front-end circuits provided outside the digital front-end PCB, the plurality of RF front-end circuits is configured to:

receive the plurality of downlink digital communications signals, respectively, from the digital processing circuit; and

convert the plurality of downlink digital communications signals into a plurality of downlink RF communications signals for transmission in the plurality of frequency bands, respectively,

wherein the plurality of RF front-end circuits comprises a plurality of downlink paths, the plurality of downlink paths comprising:

a plurality of digital-to-analog converters (DACs) coupled to the digital processing circuit and configured to convert the plurality of downlink digital communications signals into a plurality of downlink intermediate frequency (IF) communications signals;

a plurality of downlink frequency conversion circuits; and

a plurality of power amplifiers.

12. The multi-band remote unit of claim 11 , wherein the digital interface circuit and the digital processing circuit are provided in a field-programmable gate array (FPGA).

13. The multi-band remote unit of claim 11 , wherein the digital processing circuit comprises:

a plurality of crest factor reduction (CFR) circuits; and

a plurality of digital pre-distortion (DPD) circuits.

14. The multi-band remote unit of claim 13 , further comprising a plurality of DPD feedback paths coupled between the plurality of power amplifiers and the plurality of DPD circuits.

15. The multi-band remote unit of claim 11 , wherein the digital interface circuit comprises:

an encapsulation/decapsulation circuit; and

a routing circuit.

16. A multi-band remote unit for a wireless communications system (WCS), comprising:

a digital front-end printed circuit board (PCB), comprising:

a digital interface circuit communicatively coupled to a central unit in the WCS and configured to:

receive an encapsulated downlink digital communications signal corresponding to a plurality of frequency bands from the central unit; and

generate a plurality of downlink digital communications signals associated with the plurality of frequency bands; and

a digital processing circuit configured to receive and digitally process the plurality of downlink digital communications signals; and

a plurality of radio frequency (RF) front-end circuits provided outside the digital front-end PCB, the plurality of RF front-end circuits is configured to:

receive the plurality of downlink digital communications signals, respectively, from the digital processing circuit; and

convert the plurality of downlink digital communications signals into a plurality of downlink RF communications signals,

wherein the plurality of RF front-end circuits comprises a plurality of downlink paths, the plurality of downlink paths comprising:

a plurality of digital-to-analog converters (DACs) configured to convert the plurality of downlink digital communications signals into a plurality of downlink intermediate frequency (IF) communications signals;

a plurality of downlink frequency conversion circuits configured to convert the plurality of downlink IF communications signals into the plurality of downlink RF communications signals; and

a plurality of power amplifiers.

17. The multi-band remote unit of claim 16 , wherein the digital processing circuit comprises:

a plurality of crest factor reduction (CFR) circuits configured to reduce peak-to-average ratios (PARs) of the plurality of downlink digital communications signals, respectively; and

a plurality of digital pre-distortion (DPD) circuits.

18. The multi-band remote unit of claim 17 , further comprising a plurality of DPD feedback paths coupled between the plurality of power amplifiers and the plurality of DPD circuits, respectively, the plurality of DPD feedback paths comprising:

a plurality of feedback frequency conversion circuits; and

a plurality of feedback analog-to-digital converters (ADCs).

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2025
From: CORNING OPTICAL COMMUNICATIONS LLC
To: ANI ACQUISITION SUB, LLC
Reel/Frame 071270/0328 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2025
From: CORNING RESEARCH & DEVELOPMENT CORPORATION
To: CORNING OPTICAL COMMUNICATIONS LLC
Reel/Frame 070629/0125 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2022
From: HENIA, YONA; ZIV, ROI YOSY
To: CORNING RESEARCH & DEVELOPMENT CORPORATION
Reel/Frame 061120/0229 →