Epoxy resin systems
Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
1. An epoxy resin system, comprising:
an epoxy resin blend comprising:
a liquid epoxy resin based on bisphenol F; and
a first curing agent comprising a polyarylene alkylphosphonate, and
an aryl phosphate; and
a second curing agent selected from the group consisting of a compound having an imidazole group, a compound having a fused imidazole ring, an amine and combinations thereof,
wherein the epoxy resin system comprises a viscosity of 900 mPa-s or less at 60° C.
2. The epoxy resin system of claim 1 , wherein the liquid epoxy resin component further comprises a monofunctional epoxy additive.
3. The epoxy resin system of claim 1 , wherein the polyarylene alkylphosphonate is selected from the group of poly-(m-phenylene methylphosphonate), poly-(m-phenylene phenylphosphonate), and combinations thereof.
4. The epoxy resin system of claim 1 , wherein the aryl phosphate is selected from the group of triphenyl phosphate, diphenyl methylphosphonate, diphenyl phenylphosphonate, resorcinol bis(diphenyl phosphate), t-butylated triphenyl phosphate, bisphenol A bis(diphenyl phosphate), bisphenol F bis(diphenyl phosphate), and combinations thereof.
5. The epoxy resin system of claim 1 , wherein the total phosphorus content is greater than 4 wt. % of the epoxy resin system/epoxy resin blend.
6. The epoxy resin system of claim 1 , wherein the epoxy resin blend further comprises a diluent.
7. The epoxy resin system of claim 6 , wherein the diluent is selected from the group consisting of monoglycidyl ethers of alcohols, polyglycidyl ethers of non-aromatic glycols or triols or polyols, polyglycols, glycidyl esters, and combinations thereof.
8. The epoxy resin system of claim 1 , wherein the compound having an imidazole group is selected from the group consisting of imidazole, 1-methylimidazole, 2-methylimidazole, 2-propylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and combinations thereof.
9. The epoxy resin system of claim 1 , wherein the compound having a fused imidazole ring is selected from the group consisting of benzimidazole, toluimidazole, and combinations thereof.
10. The epoxy resin system of claim 1 , wherein the epoxy resin blend comprises:
from about 40 wt. % to about 85 wt. % of the liquid epoxy resin based on bisphenol F; and
from about 15 wt. % to about 60 wt. % of the first curing agent; and
from 0.1 wt. % to 30 wt. % of the aryl phosphate, with the total of all components are 100% of the epoxy resin blend.
11. The epoxy resin system of claim 1 , wherein the epoxy resin system comprises:
from about 60 wt. % to about 99.8 wt. % of the epoxy resin blend; and
from about 0.2 wt. % to about 40 wt. % of the second curing agent.
12. The epoxy resin system of claim 1 , wherein the epoxy resin system is free of fillers.
13. The epoxy resin system of claim 1 , comprising:
an epoxy resin blend comprising:
a liquid epoxy resin based on bisphenol F; and
a first curing agent comprising a polyarylene alkylphosphonate, and
the aryl phosphate; and
a second curing agent comprising a compound having an imidazole group.
14. The epoxy resin system of claim 1 , further comprising an anhydride, an amine, or a combination thereof.