Chemical resistant multi-layer coatings applied by atomic layer deposition
Described are multi-layer coatings, substrates (i.e., articles) coated with a multi-layer coating, and methods of preparing a multi-layer coating by atomic layer deposition, wherein the coating includes layers alumina and yttria.
1. A method of applying a coating to a substrate, comprising:
depositing, by atomic layer deposition, amorphous alumina on a substrate; and
depositing, by atomic layer deposition, yttria having a crystallinity of less than 10% on the substrate,
wherein the coating of has a measured Y/Al ratio in a range from 2:1 to 1:2.
2. The method of claim 1 , wherein the coating has a thickness in a range from 0.01 to 1.0 micron.
3. The method of claim 1 , wherein the coating is a composite coating of yttria and amorphous alumina.
4. The method of claim 1 , wherein the coating has substantially no grain boundaries.
5. The method of claim 1 , wherein the coating has substantially no pinholes.
6. The method of claim 1 , wherein the substrate is a reactor component of a microelectronic device or semiconductor manufacturing system.
7. The method of claim 1 , wherein the substrate is a vacuum-compatible substrate.
8. The method of claim 1 , wherein the substrate comprises a wall surface of a plasma etch chamber, a wafer susceptor, a chuck, a showerhead, a liner, a ring, a nozzle, a baffle, a fastener, a wafer support, a wafer transport structure, or a portion or component of any one or these.
9. The method of claim 1 , wherein the substrate includes a three-dimensional feature selected from a threaded screw, a threaded nut, a porous membrane, a filter, a three-dimensional network, a hole, and a channel.
10. The method of claim 1 , wherein the substrate includes a three-dimensional structure having an aspect ratio of at least 20:1.