Terahertz sensors and related systems and methods
An active radio-frequency (RF) sensing technology for determining the relative and/or absolute state (e.g., position, velocity, and/or acceleration) of a target object (e.g., a person, a car, a truck a lamp post, a utility pole, a building) is described. The sensors described herein operate in the Terahertz band (300 GHz to 3 THz). An active RF sensing device comprises a substrate and first and second semiconductor dies mounted on the substrate. The first semiconductor die has an RF transmit antenna array integrated thereon, and the transmit antenna array comprises a first plurality of RF antennas configured to generate an RF signals having frequency content in the 300 GHz-3 THz band. The second semiconductor die has an RF receive antenna array integrated thereon, and the receive antenna array comprises a second plurality of RF antennas configured to receive RF signals having frequency content in the 300 GHz-3 THz band.
1. A device comprising:
a substrate defining a plane extending in first and second directions substantially orthogonal to one another;
a first radio-frequency (RF) antenna array mounted on the substrate and having a first aperture, the first aperture having a first width extending in the first direction and a first length extending in the second direction, the first length being larger than the first width; and
a second RF antenna array mounted on the substrate and having a second aperture, the second aperture having a second width extending in the first direction and a second length extending in the second direction, the second length being less than the second width;
wherein the first RF antenna array comprises a first plurality of antennas sized to transmit Terahertz RF signals, wherein the Terahertz RF signals have frequency content in a frequency band of 300 GHz-3 THz, and
wherein the second RF antenna array comprises a second plurality of antennas sized to receive Terahertz RF signals.
2. The device of claim 1 , further comprising:
RF transmit circuitry coupled to the first RF antenna array and configured to cause the first RF antenna array to transmit first RF signals for determining a distance to a target object;
RF receive circuitry coupled to the second RF antenna array and configured to receive second RF signals from the second RF antenna array, the second RF signals generated as a result of the first RF signals being reflected by the target object; and
processing circuitry, coupled to the RF receive circuitry, configured to determine the distance between the device and the target object,
wherein the processing circuitry is further coupled to the RF transmit circuitry, and
wherein the Terahertz RF signals have a bandwidth in the range of 10 GHz-60 GHz.
3. The device of claim 1 , further comprising:
RF transmit circuitry coupled to the first RF antenna array and configured to cause the first RF antenna array to transmit first RF signals for determining a distance to a target object;
RF receive circuitry coupled to the second RF antenna array and configured to receive second RF signals from the second RF antenna array, the second RF signals generated as a result of the first RF signals being reflected by the target object;
processing circuitry, coupled to the RF receive circuitry, configured to determine the distance between the device and the target object, wherein the processing circuitry is further coupled to the RF transmit circuitry; and
a first semiconductor die mounted on the substrate, the first semiconductor die comprising the first RF antenna array, wherein the first plurality of antennas is integrated on the first semiconductor die.
4. The device of claim 3 , further comprising:
a second semiconductor die mounted on the substrate, the second semiconductor die comprising the second RF antenna array, the second plurality of antennas integrated on the second semiconductor die.
5. The device of claim 4 , wherein the first semiconductor die further comprises:
the RF transmit circuitry and
a first redistribution layer coupling the first plurality of antennas to the RF transmit circuitry.
6. The device of claim 5 , wherein the second semiconductor die further comprises:
the RF receive circuitry; and
a second redistribution layer coupling the second plurality of antennas to the RF receive circuitry.
7. The device of claim 5 , wherein the first semiconductor die comprises a first semiconductor type and the second semiconductor die comprises a second semiconductor type different from the first semiconductor type.
8. The device of claim 7 , wherein the first semiconductor die comprises a III-V semiconductor.
9. The device of claim 8 , wherein the first semiconductor die comprises indium phosphide.
10. The device of claim 7 , wherein the second semiconductor die comprises silicon.
11. The device of claim 7 , wherein the first semiconductor die comprises indium phosphide and the second semiconductor die comprises silicon.
12. A device comprising:
a substrate defining a plane extending in first and second directions substantially orthogonal to one another;
a first radio-frequency (RF) antenna array mounted on the substrate and having a first aperture, the first aperture having a first width extending in the first direction and a first length extending in the second direction, the first length being larger than the first width;
a second RF antenna array mounted on the substrate and having a second aperture, the second aperture having a second width extending in the first direction and a second length extending in the second direction, the second length being less than the second width;
RF transmit circuitry coupled to the first RF antenna array and configured to cause the first RF antenna array to transmit first RF signals for determining a distance to a target object;
RF receive circuitry coupled to the second RF antenna array and configured to receive second RF signals from the second RF antenna array, the second RF signals generated as a result of the first RF signals being reflected by the target object;
processing circuitry, coupled to the RF receive circuitry, configured to determine the distance between the device and the target object, wherein the processing circuitry is further coupled to the RF transmit circuitry; and
a first semiconductor die mounted on the substrate, the first semiconductor die comprising the first RF antenna array, wherein the first RF antenna array is integrated on the first semiconductor die.
13. The device of claim 12 , further comprising:
a second semiconductor die mounted on the substrate, the second semiconductor die comprising the second RF antenna array, the second RF antenna array integrated on the second semiconductor die.
14. The device of claim 13 , wherein the first semiconductor die further comprises:
the RF transmit circuitry and
a first redistribution layer coupling the first RF antenna array to the RF transmit circuitry.
15. The device of claim 14 , wherein the second semiconductor die further comprises:
the RF receive circuitry; and
a second redistribution layer coupling the second RF antenna array to the RF receive circuitry.
16. The device of claim 14 , wherein the first semiconductor die comprises a first semiconductor type and the second semiconductor die comprises a second semiconductor type different from the first semiconductor type.
17. A device comprising:
a substrate defining a plane extending in first and second directions substantially orthogonal to one another;
a first radio-frequency (RF) antenna array mounted on the substrate and having a first aperture, the first aperture having a first width extending in the first direction and a first length extending in the second direction, the first length being larger than the first width;
a second RF antenna array mounted on the substrate and having a second aperture, the second aperture having a second width extending in the first direction and a second length extending in the second direction, the second length being less than the second width;
RF transmit circuitry coupled to the first RF antenna array and configured to cause the first RF antenna array to transmit first RF signals for determining a distance to a target object;
RF receive circuitry coupled to the second RF antenna array and configured to receive second RF signals from the second RF antenna array, the second RF signals generated as a result of the first RF signals being reflected by the target object;
processing circuitry, coupled to the RF receive circuitry, configured to determine the distance between the device and the target object;
signal generation circuitry configured to generate reference signals and to provide the reference signals to the first RF antenna array and to the RF receive circuitry, wherein the signal generation circuitry comprises:
a signal generator configured to generate an initial RF signal; and
frequency up-conversion circuitry, coupled to the signal generator, configured to generate the reference signals by up-converting the initial RF signal; and
a first semiconductor die mounted on the substrate,
wherein the first semiconductor die comprises the first RF antenna array and at least a portion of the frequency up-conversion circuitry, and
wherein the signal generator is mounted on the substrate.
18. The device of claim 17 ,
wherein the first RF antenna array comprises a first plurality of antennas sized to transmit Terahertz RF signals, wherein the Terahertz RF signals have frequency content in a frequency band of 300 GHz-3 THz, and
wherein the second RF antenna array comprises a second plurality of antennas sized to receive Terahertz RF signals.
19. The device of claim 18 , wherein the processing circuitry is further coupled to the RF transmit circuitry, wherein the Terahertz RF signals have a bandwidth in the range of 10 GHz-60 GHz.