IP Library Granted Patent US 12,613,334
Granted Patent B2
US 12,613,334 · App. 17/852,324 · Granted Apr 28, 2026

Integrated circuit to waveguide transitional structures and related sensor assemblies

Inventor: Scott B. Doyle (Sudbury, MA)
Assignee: Magna Electronics, LLC
G01S13/931H01Q1/3233H01Q13/02
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Quick Facts
Patent No.
US 12,613,334
App. No.
17/852,324
Granted
Apr 28, 2026
Kind
B2
Abstract

Antenna structures and assemblies for use in RADAR sensor assemblies and the like. In some embodiments, the assembly may comprise a printed circuit board, an integrated circuit coupled to the printed circuit board on a first surface of the printed circuit board, and an antenna coupled to the printed circuit board on a second surface of the printed circuit board opposite the first surface. A vertical waveguide may extend through the printed circuit board from the integrated circuit to the antenna and may be configured to deliver and/or receive electromagnetic energy between the integrated circuit and the antenna.

Claims (36)

1 . A vehicle sensor assembly, comprising:

a printed circuit board comprising a first surface and a second surface opposite the first surface;

a monolithic microwave integrated circuit coupled to the printed circuit board on the first surface;

a waveguide extending through the printed circuit board from the first surface to the second surface; and

an antenna structure, the antenna structure being separate from the printed circuit board and coupled with the printed circuit board, wherein the waveguide is configured to receive electromagnetic energy from the monolithic microwave integrated circuit and inject the electromagnetic energy into the antenna structure, and wherein the waveguide comprises a ridge waveguide comprising at least one ridge protruding into the waveguide and extending longitudinally along the waveguide along a propagation direction of the waveguide from the first surface to the second surface.

2 . The vehicle sensor assembly of claim 1 , wherein the waveguide comprises two opposing ridges protruding into the waveguide and extending along the waveguide between the first surface and the second surface.

3 . The vehicle sensor assembly of claim 1 , further comprising a ball grid array package comprising an array of solder balls electrically coupling the monolithic microwave integrated circuit to the printed circuit board.

4 . The vehicle sensor assembly of claim 3 , wherein the waveguide comprises a ridge waveguide comprising a ridge protruding into the waveguide and extending along the waveguide between the first surface and the second surface, wherein the ball grid array package comprises a signal ball, and wherein the signal ball is positioned on the ridge.

5 . The vehicle sensor assembly of claim 1 , wherein the monolithic microwave integrated circuit comprises:

a coplanar waveguide transmission line; and

a pair of chamfers extending between opposite sides of the coplanar waveguide transmission line.

6 . The vehicle sensor assembly of claim 5 , wherein both chamfers of the pair of chamfers extends at least partially within a footprint of the waveguide above the waveguide.

7 . The vehicle sensor assembly of claim 6 , wherein both chamfers of the pair of chamfers extends wholly within the footprint of the waveguide.

8 . A sensor assembly, comprising:

a printed circuit board;

an integrated circuit coupled to the printed circuit board on a first surface of the printed circuit board;

an antenna coupled to the printed circuit board on a second surface of the printed circuit board opposite the first surface; and

a waveguide extending through the printed circuit board from the integrated circuit to the antenna, wherein the waveguide is configured to deliver electromagnetic energy between the integrated circuit and the antenna, wherein the waveguide comprises at least one ridge extending along the waveguide, and wherein the at least one ridge extends to the first surface of the printed circuit board.

9 . The sensor assembly of claim 8 , further comprising an array of electrical coupling elements used to electrically couple the integrated circuit to the printed circuit board.

10 . The sensor assembly of claim 9 , wherein the array of electrical coupling elements comprises a ball grid array.

11 . The sensor assembly of claim 10 , wherein one of the balls of the ball grid array is positioned within a footprint of a ridge of the at least one ridge.

12 . The sensor assembly of claim 8 , wherein the integrated circuit comprises a monolithic microwave integrated circuit.

13 . The sensor assembly of claim 8 , further comprising an integrated circuit cover positioned adjacent to the integrated circuit and configured to inhibit stray electromagnetic radiation from the integrated circuit, wherein the integrated circuit is positioned in between the integrated circuit cover and the printed circuit board.

14 . The sensor assembly of claim 8 , further comprising a groove formed within the printed circuit board adjacent to but spaced apart from the integrated circuit, wherein the groove is configured to inhibit stray electromagnetic radiation from the integrated circuit.

15 . A vehicle RADAR sensor assembly, comprising:

a printed circuit board comprising a first surface and a second surface opposite the first surface;

a monolithic microwave integrated circuit;

a ball grid array package electrically coupling the monolithic microwave integrated circuit to the printed circuit board on the first surface;

a waveguide positioned adjacent to the monolithic microwave integrated circuit and extending through the printed circuit board from the first surface to the second surface;

a ridge extending along the waveguide, wherein the ridge extends within and along a propagation direction of the waveguide and terminates at the first surface of the printed circuit board; and

an antenna structure comprising one or more waveguides, the antenna structure coupled to the second surface of the printed circuit board and configured to facilitate transfer of electromagnetic energy to and from the monolithic microwave integrated circuit.

16 . The vehicle RADAR sensor assembly of claim 15 , wherein the ball grid array package comprises at least one signal ball, and wherein at least one signal ball is positioned within a footprint of the ridge.

17 . The vehicle RADAR sensor assembly of claim 15 , wherein the ridge is defined by at least substantially parallel opposing sidewalls.

18 . The vehicle RADAR sensor assembly of claim 15 , wherein the ridge decreases in width from a base of the ridge to a tip of the ridge opposite the base.

19 . The vehicle sensor assembly of claim 1 , wherein the at least one ridge extends between the first surface and the second surface so as to span an entire distance between the first surface and the second surface.

20 . The vehicle RADAR sensor assembly of claim 15 , wherein the waveguide and the waveguide ridge terminate at an opening in the printed circuit board at the first surface of the printed circuit board such that the opening exposes an end of the waveguide and a corresponding end of the waveguide ridge.

Assignments (1)
CHANGE OF NAME Recorded May 9, 2024
From: VEONEER US, LLC
To: MAGNA ELECTRONICS, LLC
Reel/Frame 067378/0436 →
Continuity (1)
Related Publication 20230417904A1 · Dec 28, 2023
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