IP Library Granted Patent US 12,013,733
Granted Patent B2
US 12,013,733 · App. 17/855,797 · Granted Jun 18, 2024

Relative thermal efficiency values for controlling operation of adapter modules

Inventors: Gary D Cudak (Raleigh, NC); Vinod Kamath (Raleigh, NC); Ajay Dholakia (Cary, NC); Miroslav Hodak (Raleigh, NC)
G06F1/206G05B19/4155G05B2219/49216
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Quick Facts
Patent No.
US 12,013,733
App. No.
17/855,797
Granted
Jun 18, 2024
Kind
B2
Abstract

A computer-implemented method includes identifying a plurality of adapter modules of a particular adapter module type that are installed in a plurality of slots of a single host computer, and identifying, for each of the identified adapter modules, a slot of the plurality of slots in which the adapter module is installed. The method may further includes accessing, for each identified slot, a predetermined relative thermal efficiency value for operation of an adapter module of the particular adapter module type in a particular slot, and controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed. A computer program product may also include program instructions that are executable by a processor to cause the processor to perform the method.

Claims (50)

1. A computer program product comprising a non-volatile computer readable medium and non-transitory program instructions embodied therein, the program instructions being configured to be executable by a processor to cause the processor to perform operations comprising:

identifying a plurality of adapter modules of a particular adapter module type that are installed in a plurality of slots of a single host computer;

identifying, for each of the identified adapter modules, a slot of the plurality of slots in which the adapter module is installed;

accessing, for each identified slot, a predetermined relative thermal efficiency value for operation of an adapter module of the particular adapter module type; and

controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed.

2. The computer program product of claim 1 , wherein controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed includes:

prioritizing distribution of workload to the identified adapter modules in descending order of the predetermined relative thermal efficiency for the slot in which the identified adapter modules are installed.

3. The computer program product of claim 2 , wherein the identified adapter modules are dual in-line memory modules or solid-state drives.

4. The computer program product of claim 2 , wherein the identified adapter modules are central processing units, data processing units, or graphics processing units.

5. The computer program product of claim 2 , wherein the identified adapter modules are network interface controllers.

6. The computer program product of claim 1 , wherein controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed includes:

identifying that a first one of the identified adapter modules has a higher relative thermal efficiency than a second one of the identified adapter modules;

assigning the first one of the identified adapter modules to operate as an active module in an active/passive pair of modules; and

assigning the second one of the identified adapter modules to operate as a passive module in the active/passive pair of modules, wherein the second one of the identified adapter modules will automatically begin operating as the active module in response to failure of the first one of the identified adapter modules.

7. The computer program product of claim 1 , wherein the identified adapter modules are solid state drives, and wherein controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed includes:

identifying that a first one of the identified solid-state drives has a higher relative thermal efficiency than a second one of the identified solid-state drives;

assigning the first one of the identified solid-state drives to operate in a hot tier of solid-state drives; and

assigning the second one of the identified solid-state drives to operate in a cold tier of solid-state drives, wherein the hot tier of solid-state drives is accessed more frequently than the cold tier of solid-state drives.

8. The computer program product of claim 1 , wherein accessing, for each identified slot, a predetermined relative thermal efficiency value for operation of an adapter module of the particular adapter module type includes:

querying a baseboard management controller installed in the single host computer for the predetermined relative thermal efficiency value, wherein the predetermined relative thermal efficiency value for each identified slot is stored by the baseboard management controller.

9. The computer program product of claim 8 , wherein the baseboard management controller stores the predetermined relative thermal efficiency values for a plurality of adapter module types installed and operated in the plurality of slots of a particular host computer type including the single host computer and does not store predetermined relative thermal efficiency values for any other host computer type.

10. The computer program product of claim 1 , wherein accessing, for each identified slot, a predetermined relative thermal efficiency value for operation of an adapter module of the particular adapter module type includes:

reading the predetermined relative thermal efficiency value from a Unified Extensible Firmware Interface installed on the single host computer, wherein the predetermined relative thermal efficiency value for each identified slot is stored by the Unified Extensible Firmware Interface in association with the adapter module type.

11. The computer program product of claim 10 , wherein the predetermined relative thermal efficiency value is stored in Peripheral Component Interconnect Express data fields in Unified Extensible Firmware Interface.

12. The computer program product of claim 1 , wherein the predetermined relative thermal efficiency value for each slot is a normalized value based on a most thermally efficient slot.

13. The computer program product of claim 1 , wherein the predetermined relative thermal efficiency value for each slot is a ranking of each slot in order of thermal efficiency.

14. The computer program product of claim 1 , the operations further comprising:

determining one or more adapter module type for which there are multiple adapter modules installed in the single host computer; and

downloading, for each of the determined one or more adapter module types, predetermined relative thermal efficiency values for the adapter module type.

15. A method, comprising:

identifying a plurality of adapter modules of a particular adapter module type that are installed in a plurality of slots of a single host computer;

identifying, for each of the identified adapter modules, a slot of the plurality of slots in which the adapter module is installed;

accessing, for each identified slot, a predetermined relative thermal efficiency value for operation of an adapter module of the particular adapter module type; and

controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed.

16. The method of claim 15 , wherein controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed includes:

prioritizing distribution of workload to the identified adapter modules in descending order of the predetermined relative thermal efficiency for the slot in which the identified adapter modules are installed.

17. The method of claim 15 , wherein controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed includes:

identifying that a first one of the identified adapter modules has a higher relative thermal efficiency than a second one of the identified adapter modules;

assigning the first one of the identified adapter modules to operate as an active module in an active/passive pair of modules; and

assigning the second one of the identified adapter modules to operate as a passive module in the active/passive pair of modules, wherein the second one of the identified adapter modules will automatically begin operating as the active module in response to failure of the first one of the identified adapter modules.

18. The method of claim 15 , wherein the identified adapter modules are solid state drives, and wherein controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed includes:

identifying that a first one of the identified solid-state drives has a higher relative thermal efficiency than a second one of the identified solid-state drives;

assigning the first one of the identified solid-state drives to operate in a hot tier of solid-state drives; and

assigning the second one of the identified solid-state drives to operate in a cold tier of solid-state drives, wherein the hot tier of solid-state drives is accessed more frequently than the cold tier of solid-state drives.

19. The method of claim 15 , wherein accessing, for each identified slot, a predetermined relative thermal efficiency value for operation of an adapter module of the particular adapter module type includes:

querying a baseboard management controller installed in the single host computer for the predetermined relative thermal efficiency value, wherein the predetermined relative thermal efficiency value for each identified slot is stored by the baseboard management controller.

20. The method of claim 15 , further comprising:

installing a plurality of second adapter modules of the particular adapter module type in a plurality of slots of a second host computer of the same type as the single host computer;

measuring a steady state temperature each of the plurality of the second adapter modules while operating each of the plurality of the second adapter modules under a similar load; and

determining, for each of the plurality of slots in the second host computer, the predetermined relative thermal efficiency value for the particular adapter module type based on the measured steady state temperature of the second adapter module operating in the slot relative to lowest of the measured steady state temperatures for any of the second adapter modules operating in any of the slots the second host computer.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070269/0207 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2025
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD.
Reel/Frame 070269/0252 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2022
From: LENOVO GLOBAL TECHNOLOGY (UNITED STATES) INC.
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
Reel/Frame 062011/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2022
From: CUDAK, GARY D; KAMATH, VINOD; DHOLAKIA, AJAY; HODAK, MIROSLAV
To: LENOVO GLOBAL TECHNOLOGY (UNITED STATES) INC.
Reel/Frame 060492/0690 →