Techniques for pain relief
A method for using a patch for pain relief, and the patch are provided. The method includes determining a location corresponding to source of pain in a body, and disposing a patch including a reactive capacitance material at one of a location corresponding to source of pain or a location between location corresponding to source of pain and a brain. The patch is disposed adjacent to the surface of the body. The reactive the capacitance material comprises conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another. The patch includes a first outer layer, a reactive capacitance layer, and a second outer layer. The reactive capacitance layer is disposed between the first outer layer and the second outer layer. The reactive capacitance layer is formed of the reactive capacitance material.
1. A method for using a patch for pain relief for a body comprising a nervous system, the method comprising:
disposing the patch adjacent to a surface of the body at one of a first location on the body corresponding to a source of pain in the body or a second location on the body between the first location and a brain of the body,
wherein the patch includes a reactive capacitance layer configured to capacitively interact with the body when the patch is disposed adjacent to the surface of the body.
2. The method of claim 1 , wherein the body is a human body.
3. The method of claim 1 , wherein the body is non-human body.
4. The method of claim 1 ,
wherein the patch further includes a non-conductive layer, and
wherein the reactive capacitance layer conforms to a surface of the non-conductive layer.
5. The method of claim 4 , wherein the non-conductive layer is formed from a non-allergenic material.
6. The method of claim 4 , wherein the patch further includes one or more layers between the non-conductive layer and the reactive capacitance layer.
7. The method of claim 1 , wherein the patch is flexible so as to conform to the surface of the body at the one of the first location on the body or the second location on the body.
8. The method of claim 1 , wherein the reactive capacitance layer has a resistance of 3-17 ohms across any two points thereof.
9. The method of claim 1 , wherein the patch includes one or more additional reactive capacitance layers.
10. The method of claim 1 , wherein the surface of the body is inside the body.
11. The method of claim 1 , wherein the patch further includes at least one of an adhesive or fastening structure to fix the patch adjacent to the surface of the body.
12. The method of claim 1 , wherein, when the patch is disposed adjacent to the surface of the body, the reactive capacitance layer couples to the nervous system of the body.
13. The method of claim 1 , wherein the reactive capacitance layer is formed of conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another.
14. A patch for pain relief for a body comprising a nervous system, the patch comprising:
a reactive capacitance layer,
wherein the reactive capacitance layer is configured to capacitively interact with the body when the patch is disposed adjacent to a surface of the body.
15. The patch of claim 14 , wherein the body is a human body.
16. The patch of claim 14 , wherein the body is non-human body.
17. The patch of claim 14 , further comprising:
a non-conductive layer,
wherein the reactive capacitance layer conforms to a surface of the non-conductive layer.
18. The patch of claim 17 , wherein the non-conductive layer is formed from a non-allergenic material.
19. The patch of claim 17 , wherein the patch further includes one or more layers between the non-conductive layer and the reactive capacitance layer.
20. The patch of claim 14 , wherein the patch is flexible so as to conform to a surface of the body.
21. The patch of claim 14 , wherein the reactive capacitance layer has a resistance of 3-17 ohms across any two points thereof.
22. The patch of claim 14 , wherein the patch includes one or more additional reactive capacitance layers.
23. The patch of claim 14 , wherein the patch further includes at least one of an adhesive or fastening structure to fix the patch adjacent to a surface of the body.
24. The patch of claim 14 , wherein, when the patch is disposed adjacent to a surface of the body, the reactive capacitance layer couples to the nervous system of the body.
25. The patch of claim 14 , wherein the reactive capacitance layer is formed of conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another.