IP Library Patent Application 17863266
Patent Application
App. No. 17/863,266

ELECTRONIC CIRCUIT INTEGRATION TO SMART GLASSES FOR ENHANCED REALITY APPLICATIONS

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Quick Facts
Patent No.
US None
App. No.
17/863,266
Abstract

A device including a frame and an eyepiece is provided. The eyepiece includes a front glass, a rear glass, and an active element sandwiched between the front glass and the rear glass. The active layer is electrically activated, via an interconnect, by a flex circuit enclosed between a top portion of the frame and a cap, the flex circuit including a memory and a processor. A method for assembling the above device is also provided.

Claims (35)

1 . A device, comprising:

a frame; and

an eyepiece, wherein the eyepiece includes:

a front glass,

a rear glass, and

an active element sandwiched between the front glass and the rear glass, and configured to be electrically activated, via an interconnect, by a flex circuit enclosed between a top portion of the frame and a cap, the flex circuit comprising a memory and a processor.

2 . The device of claim 1 , wherein the front glass has a larger cross section than a cross section of the rear glass and the active element, to allow a clamping device to press the eyepiece into a groove formed in the frame, during assembly.

3 . The device of claim 1 , further comprising a prescription optical layer adjacent to the rear glass, the prescription optical layer having a cross section no larger than a cross section of the rear glass.

4 . The device of claim 1 , further comprising a cast-in-place gasket including a foaming material filling a space between the frame and the cap.

5 . The device of claim 1 , wherein the interconnect comprises an insulating material over-molded onto the rear glass and the front glass to fit a groove formed in the frame, and at least one conducting prong to make electrical contact with a pin connector inserted in the frame and electrically coupled with the flex circuit, wherein the front glass and the rear glass have a shape to snugly fit within the frame.

6 . The device of claim 1 , wherein the interconnect includes a conductive rubber gasket for electrically coupling an active element in the eyepiece and the flex circuit, and for mechanically securing the interconnect to the frame.

7 . The device of claim 1 , wherein the interconnect includes a conductive adhesive or a conductive ink reaching different terminals in the active element.

8 . The device of claim 1 , further comprising a perimeter gasket to mount the eyepiece on the frame, and a compliant snap feature for mechanically coupling the eyepiece to the perimeter gasket.

9 . The device of claim 1 , further comprising a clip that snap fits onto a front portion of the frame to securely hold the eyepiece against a resilient stop on a back portion of the frame.

10 . The device of claim 1 , further comprising an alignment feature molded on the frame to align an active element the eyepiece with the interconnect.

11 . An augmented reality headset, comprising:

a frame including a flex circuit, a memory, and a processor;

an eyepiece mounted on the frame, including an active element configured to modify an image transmitted through a front glass and a rear glass; and

an interconnect configured to electrically couple the flex circuit with the active element.

12 . The augmented reality headset of claim 11 , wherein the active element is sandwiched between a front glass and a rear glass, the front glass configured to mechanically couple the eyepiece to the frame.

13 . The augmented reality headset of claim 11 , wherein the eyepiece comprises a removable prescription optical layer.

14 . The augmented reality headset of claim 11 , further comprising a cast-in-place gasket including a foaming material securing the flex circuit, the memory and the processor inside the frame.

15 . A method for assembling a headset, comprising:

placing a flex circuit inside a top portion of a frame for the headset, the flex circuit comprising a memory and a processor;

placing an eyepiece on the frame for the headset, the eyepiece including an electrically active element having an interconnect;

coupling the interconnect of the electrically active element in the eyepiece to the flex circuit in the frame; and

placing a cap over the flex circuit and the interconnect.

16 . The method of claim 15 , wherein placing an eyepiece on the frame of the headset comprises clamping a front glass in the eyepiece and snapping the front glass in a groove of the frame with a clamping device.

17 . The method of claim 15 , wherein placing an eyepiece on the frame of the headset comprises:

over-molding, on the interconnect, an electrically insulating material;

fixing the electrically insulating material to a groove in the frame; and

snuggly fitting the eyepiece within the frame.

18 . The method of claim 15 , wherein placing a cap over the flex circuit and the interconnect comprises filling a space between the flex circuit and the interconnect with a moisture absorbing material that is also electrically insulating.

19 . The method of claim 15 , wherein placing an eyepiece on the frame for the headset, comprises snap-fitting a clip onto a front portion of the frame to securely hold the eyepiece against a resilient stop on a back portion of the frame.

20 . The method of claim 15 , wherein placing an eyepiece on the frame for the headset comprises mechanically coupling the eyepiece to a perimeter gasket with a compliant snap feature.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2023
From: MARKOVSKY, IGOR; ESCUDERO, JOHANA GABRIELA COYOC; KARANIKOS, DEMETRIOS BASIL; POTENS, BRANDON; MEHDI, RAFAT; SZTUK, SEBASTIAN; CANALES, PABLO CASTILLO; DANIELS, ERIC; PLETENETSKYY, ANDRIY; SUBRAMANI, ABHINAV; CHOKSI, JAYKISHAN DAKSHESH; TORIGOE, KATHERINE SUZI; LEE, RAYMOND; COONS, EVAN LAWRENCE; KUO, YI-CHEN; MCKENNEY, KAI TASHIMA; HODGSON, SIMON DAVID-LEVINSKAS; BOSWELL, TREVOR GRANT; GOVENJI, PUNIT NARENDRA; WANG, NAN; SZABO, MELINDA DORA; CHEN, YEWCHING; JAMALI, AFSOON
To: META PLATFORMS TECHNOLOGIES, LLC
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