EXTREMELY HIGH FREQUENCY ELECTROMAGNETIC WAVE TRANSMIT/RECEIVE DEVICE

1 . A device, comprising:

a multilayer organic substrate;

an integrated circuit chip, flip-chip assembled on the multilayer organic substrate; and

a package including a first cavity, containing the multilayer organic substrate and the integrated circuit chip, the first cavity configured to communicate over a channel with a second cavity, the second cavity forming a waveguide for electromagnetic waves, the package including:

an antenna in the substrate and coupled to the integrated circuit chip, the antenna extending in the first cavity and partially into the second cavity.

2 . The device according to claim 1 , wherein the first cavity includes a first recess, the integrated circuit chip being in the first recess.

3 . The device according to claim 2 , wherein the first cavity includes a second recess that is between the second cavity and the first recess.

4 . The device according to claim 1 , wherein the multilayer organic substrate includes a main portion in the first cavity and a protrusion extending from the main portion into the channel and penetrating into the second cavity.

5 . The device according to claim 1 , wherein an electrically-insulating support in the substrate includes first and second opposite surfaces, electrically-conductive tracks extending on the first surface, and an electrically-insulating layer covering the electrically-conductive tracks.

6 . The device according to claim 5 , wherein the multilayer organic substrate further includes a coating including a graphene layer covering the electrically-insulating layer.

7 . The device according to claim 6 , wherein the multilayer organic substrate includes the antenna on a protrusion in the second cavity, and wherein the multilayer organic substrate includes an electrically-conductive line coupling the antenna to the integrated circuit chip, where the coating does not cover the electrically-conductive line in the first cavity.

8 . A device, comprising:

a package having a first surface opposite to a second surface;

a first cavity in the package;

a first plurality of conductive layers in the first cavity closer to the first surface than the second surface;

a first insulating layer in the first cavity, the first insulating layer being spaced from the first surface by the first plurality of conductive layers;

a second plurality of conductive layers in the first cavity closer to the second surface than the first surface;

a second cavity in the package, the second cavity being closer to the second surface than the first surface;

an integrated circuit chip on the first insulating layer;

a waveguide coupled to the integrated circuit and being at least partially in the second cavity; and

a plurality of electric connectors extending from a side of the package that is different from a side of the package from which the waveguide extends.

9 . The device of claim 8 wherein the first plurality of conductive layers, the first insulating layer, and the second plurality of conductive layers are a substrate in the package.

10 . The device of claim 9 wherein the plurality of electric connectors extends from the package into an external environment.

11 . The device of claim 9 wherein the second cavity extends from the substrate to an edge of the package.

12 . A method, comprising:

forming a first cavity in a package having a first surface opposite to a second surface;

forming a first plurality of conductive layers in the first cavity closer to the first surface than the second surface;

forming a first insulating layer in the first cavity, the first insulating layer being spaced from the first surface by the first plurality of conductive layers;

forming a second plurality of conductive layers in the first cavity closer to the second surface than the first surface;

forming a second cavity in the package, the second cavity being closer to the second surface than the first surface;

coupling an integrated circuit chip on the first insulating layer;

coupling a waveguide to the integrated circuit and being at least partially in the second cavity; and

forming a plurality of electric connectors extending from a side of the package that is different from a side of the package from which the waveguide extends.

13 . The method of claim 12 comprising forming a substrate from the first plurality of conductive layers, the first insulating layer, and the second plurality of conductive layers.

14 . The method of claim 13 wherein the plurality of electric connectors extends from the package into an external environment.

15 . The method of claim 13 wherein the second cavity extends from the substrate to an edge of the package.