Method of using processing oven
A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.
1. A method of using a processing oven, comprising:
disposing at least one substrate in a chamber of the oven;
activating a lamp assembly disposed above the at least one substrate to increase a temperature of the at least one substrate to a first temperature;
after increasing the temperature, admitting a chemical vapor into the chamber above the at least one substrate while admitting an inert gas into the chamber below the at least one substrate;
after admitting the chemical vapor, further increasing the temperature of the at least one substrate to a second temperature higher than the first temperature;
maintaining the at least one substrate at the second temperature for a first time; and
after the maintaining, cooling the at least one substrate.
2. The method of claim 1 , wherein before admitting the chemical vapor into the chamber reducing an oxygen concentration in the chamber to below about 750 ppm.
3. The method of claim 1 , wherein further increasing the temperature includes further increasing the temperature of the at least one substrate using the lamp assembly.
4. The method of claim 1 , wherein increasing the temperature includes increasing the temperature of the at least one substrate to a temperature between about 150° C.-180° C., and further increasing the temperature includes further increasing the temperature of the at least one substrate to a temperature between about 220° C.-250° C.
5. The method of claim 1 , wherein admitting chemical vapor into the chamber includes admitting formic acid vapor into the chamber.
6. The method of claim 5 , wherein admitting formic acid vapor into the chamber includes admitting formic acid vapor having a concentration of 3-15 wt. % formic acid into the chamber.
7. The method of claim 5 , wherein admitting formic acid vapor into the chamber includes directing formic acid vapor into the chamber from a source configured to vary a concentration of formic acid in the formic acid vapor.
8. The method of claim 5 , wherein admitting formic acid vapor into the chamber includes admitting formic acid vapor into the chamber from a bubbler.
9. The method of claim 1 , wherein cooling the at least one substrate includes cooling the at least one substrate to a temperature between about 15° C.-30° C., and the first time is between about 0.5 minutes to 4 minutes.
10. The method of claim 1 , further including rotating the at least one substrate in the chamber before admitting the chemical vapor into the chamber.
11. The method of claim 1 , wherein cooling the at least one substrate includes contacting the at least one substrate with a cold plate of the chamber.
12. The method of claim 11 , further including directing a liquid coolant through the cold plate to assist in cooling the at least one substrate.
13. The method of claim 1 , wherein cooling the at least one substrate includes directing an inert gas on the at least one substrate to assist in cooling the at least one substrate.
14. A method of using a processing oven, comprising:
supporting at least one substrate on a rotatable spindle of the processing oven;
rotating the spindle with the at least one substrate;
heating the at least one substrate to a first temperature using a lamp assembly of the processing oven, wherein the lamp assembly includes a plurality of spaced-apart lamps disposed above the at least one substrate;
after the heating, directing a chemical vapor into the processing oven above the top surface of the at least one substrate;
after directing the chemical vapor, further heating the at least one substrate to a second temperature higher than the first temperature using the lamp assembly; and
after the further heating, cooling the at least substrate to a temperature below the first temperature.
15. The method of claim 14 , wherein directing the chemical vapor into the processing oven includes simultaneously admitting an inert gas into the processing oven below the at least one substrate.
16. The method of claim 14 , wherein, before admitting the chemical vapor into the processing oven reducing an oxygen concentration in the processing oven to below about 750 ppm.
17. The method of claim 14 , wherein, before admitting the chemical vapor into the processing oven, lowering a pressure in the processing oven to a value between about 100 milliTorr-100 Torr.
18. The method of claim 14 , wherein admitting a chemical vapor into the processing oven includes admitting formic acid vapor into the processing oven.
19. A method of using a processing oven, comprising:
supporting at least one substrate on a rotatable spindle of the processing oven;
rotating the rotatable spindle supporting the at least one substrate;
reducing an oxygen concentration in the processing oven to below about 750 ppm;
heating a top surface of the at least one substrate using a lamp assembly of the processing oven, wherein the lamp assembly includes a plurality of spaced-apart lamps disposed above the at least one substrate;
after the heating, admitting a chemical vapor into the processing oven above the at least one substrate while directing an inert gas into the processing oven below the at least one substrate;
removing at least a portion of the chemical vapor from the processing oven;
after the removing, further heating the at least one substrate to a second temperature higher than the first temperature using the lamp assembly; and
after the further heating, cooling the at least one substrate.
20. The method of claim 19 , wherein the chemical vapor includes formic acid vapor.