System and method for metamaterial array-based field-shaping
A feedback system that identifies characteristics of an object and utilizes the characteristics to initiate and adjust a field applied to the object is provided. The system includes an array of array phase elements made of metamaterials that allow precise shaping of the field to be applied to a particular portion of an object based on characteristics of the object, including location and thickness of the object. Sensors are utilized during supercooling to monitor a condition of the object being supercooled. Specifically, characteristics of the object are measured at different points, areas, or volumes on the object and the measurements are used to determine whether supercooling (or another desired result) is being achieved or whether the object is starting to freeze. Based on the measurements, parameters of the field can be adjusted to ensure supercooling of the object without freezing.
1. A device for metamaterial array-based field-shaping, comprising:
a compartment sized to hold at least one object;
an array of phase array elements, each of the phase array elements comprising a metamaterial and configured to generate a plurality of waveform components;
one or more sensors configured to determine characteristics associated with the object at one or more spatial locations at multiple time points; and
a controller configured to determine parameters based on the characteristics determined at the multiple time points and to control application of at least one field comprising one or more of the waveform components at the at least one object by at least a portion of the phase array elements based on the parameters by individually controlling at least the portion of the phase array elements generating the one or more waveform components comprised in the field.
2. A device according to claim 1 , further comprising at least one mesh formation aligned with a portion of the at least one object.
3. A device accordingly to claim 1 , wherein the parameters of the at least one field comprise at least one of phase, frequency, amplitude and strength.
4. A device according to claim 1 , wherein each of the phase array elements comprises one or more motifs, each of the motifs comprising at least one sub-motif, and wherein each of the waveform components is generated by the controller individually controlling each of the sub-motifs.
5. A device according to claim 4 , the controller further configured to:
generate parameters for each of the waveforms components based on the parameters of the at least one field and based on a portion of the at least on object to which a waveform formed by that component will be applied;
individually control the sub-motifs in the at least the portion of the phase array elements to generate the waveform components in accordance with the waveform component parameters.
6. A device according to claim 1 , wherein waveform components comprise at least one of phase, frequency, amplitude and strength.
7. A device according to claim 4 , wherein at least some of the motifs are three-dimensional.
8. A device according to claim 1 , wherein each feedback sensor comprises one of an imaging sensor, reflective sensor, electrocurrent sensor, chemical sensor, electric sensor, acoustic sensor, optical sensor, electrochemical sensor, thermal sensor, and hyperspectral imaging sensor.
9. A device according to claim 1 , wherein the characteristics comprise a location of the object within the compartment.
10. A device according to claim 1 , wherein the characteristics comprise a thickness of the object.
11. A system for metamaterial array-based field-shaping, comprising:
a compartment sized to hold at least one object;
an array of phase array elements, each of the phase array elements comprising a metamaterial and configured to generate a plurality of waveform components;
one or more sensors configured to determine characteristics associated with the object at one or more spatial locations at multiple time points;
a controller configured to determine parameters based on the characteristics determined at the multiple time points; and
a further controller configured to control application of at least one field comprising one or more of the waveform components at the at least one object by at least a portion of the phase array elements based on the parameters by individually controlling at least the portion of the phase array elements generating the one or more waveform components comprised in the field.
12. A system according to claim 11 , further comprising at least one mesh formation aligned with a portion of the at least one object.
13. A system accordingly to claim 11 , wherein the parameters of the at least one field comprise at least one of phase, frequency, amplitude and strength.
14. A system according to claim 11 , wherein each of the phase array elements comprises one or more motifs, each of the motifs comprising at least one sub-motif, and wherein each of the waveform components is generated by the controller individually controlling each of the sub-motifs.
15. A system according to claim 14 , further comprising:
the controller further configured to generate parameters for each of the waveforms components based on the parameters of the at least one field and based on a portion of the at least on object to which a waveform formed by that component will be applied; and
the further controller further configured to individually control the sub-motifs in the at least the portion of the phase array elements to generate the waveform components in accordance with the waveform component parameters.
16. A system according to claim 11 , wherein waveform components comprise at least one of phase, frequency, amplitude and strength.
17. A system according to claim 14 , wherein at least some of the motifs are three-dimensional.
18. A system according to claim 11 , wherein each feedback sensor comprises one of an imaging sensor, reflective sensor, electrocurrent sensor, chemical sensor, electric sensor, acoustic sensor, optical sensor, electrochemical sensor, thermal sensor, and hyperspectral imaging sensor.
19. A system according to claim 11 , wherein the characteristics comprise a location of the object within the compartment.
20. A system according to claim 11 , wherein the characteristics comprise a thickness of the object.