Dental cement compositions and methods of use
Provided herein are dental compositions and methods for use in dental cementation applications.
1. A dental composition kit comprising:
a first composition; and
a second composition to be mixed with the first composition to form a paste mixture,
wherein the first composition comprises at least one polymerizable monomer, a copper (II) compound, and a tertiary hydroperoxide,
wherein the second composition comprises a thiourea compound, and
wherein the thiourea compound is selected from the group consisting of 1-(2-Pyridyl)-2-thiourea (PTU), 1-Benzoyl-2-thiourea (BTU), 1-Acetyl-2-thiourea (ATU), 1-(2-Tetrahydrofurfuryl)-2-thiourea (TTU), and combinations thereof.
2. The dental composition kit of claim 1 , further comprising a bonding agent.
3. The dental composition kit of claim 2 , wherein the bonding agent comprises 8% to 16% of a phosphoric acid containing (meth)acrylic monomer.
4. The dental composition kit of claim 3 , wherein the phosphoric acid containing (meth)acrylic monomer is selected from the group consisting of GPDM (glycerol phosphate di(meth)acrylate{(meth)acrylate=acryl ate or methacrylate}), phenyl-P (phenyl methacryloxyethyl phosphate), PENTA-P (dipentaerithritol pentaacrylate phosphate), 10-MDP (methacryloyloxydecyl phosphate), HEMA-P (hydroxyethylmethacrylate phosphate), HEA-P (hydroxyethylacrylate phosphate), bis(HEMA)-P {bis(hydroxyethylmethacrylate) phosphate), bis(HEA)-P {bis(hydroxyethylacrylate) phosphate), bis((meth)acryloxypropyl)phosphate, and combinations thereof.
5. The dental composition kit of claim 2 , wherein bond strength of a bond formed by a paste mixture and the bonding agent is more than 15 MPa.
6. The dental composition kit of claim 1 , wherein the tertiary hydroperoxide includes cumene hydroperoxide (CHP).
7. The dental composition kit of claim 1 , wherein the thiourea compound is 1-(2-Pyridyl)-2-thiourea (PTU).
8. The dental composition kit of claim 3 , wherein the phosphoric acid containing (meth)acrylic monomer includes 10-Methacryloyloxydecyl dihydrogen phosphate (10-MDP).
9. A device to apply a dental paste mixture comprising:
a first chamber containing a first composition; and
a second chamber containing a second composition to be mixed with the first composition to form a paste mixture,
wherein the first composition comprises at least one polymerizable monomer, a copper (II) compound, and a tertiary hydroperoxide, and
wherein the second composition comprises a thiourea compound, wherein the thiourea compound is selected from the group consisting of 1-(2-Pyridyl)-2-thiourea (PTU), 1-Benzoyl-2-thiourea (BTU), 1-Acetyl-2-thiourea (ATU), 1-(2-Tetrahydrofurfuryl)-2-thiourea (TTU), and combinations thereof.
10. The device of claim 9 , further comprising at least one extruder to extrude the first composition from the first chamber and the second composition from the second chamber.
11. The device of claim 9 , wherein the tertiary hydroperoxide includes cumene hydroperoxide (CHP).
12. The device of claim 9 , wherein the thiourea compound is 1-(2-Pyridyl)-2-thiourea (PTU).
13. A dental restoration kit comprising:
the device of claim 9 ; and
a bonding agent to form a bond with the paste mixture,
wherein bond strength of a bond formed by the paste mixture and the bonding agent is more than 15 MPa.
14. The dental restoration kit of claim 13 , wherein the bonding agent comprises 8% to 16% of a phosphoric acid containing (meth)acrylic monomer.
15. The dental restoration kit of claim 14 , wherein the phosphoric acid containing (meth)acrylic monomer is selected from the group consisting of GPDM (glycerol phosphate di(meth)acrylate{(meth)acrylate=acrylate or methacryate }), phenyl-P (phenyl methacryloxyethyl phosphate), PENTA-P (dipentaerithritol pentaacrylate phosphate), 10-MDP (methacryloyloxydecyl phosphate), HEMA-P (hydroxyethylmethacrylate phosphate), HEA-P (hydroxyethylacrylate phosphate), bis(HEMA)-P {bis(hydroxyethylmethacrylate) phosphate), bis(HEA)-P {bis(hydroxyethylacrylate) phosphate), bis((meth)acryloxypropyl)phosphate, and combinations thereof.
16. The dental restoration kit of claim 14 , wherein the phosphoric acid containing (meth)acrylic monomer includes 10-Methacryloyloxydecyl dihydrogen phosphate (10-MDP).
17. A method of dental restoration, wherein the method comprises:
applying a bonding agent on a dental substrate
mixing a first composition comprising at least one polymerizable monomer, a copper (II) compound, and a tertiary hydroperoxide and a second composition comprising a thiourea compound, wherein the thiourea compound is selected from the group consisting of 1-(2-Pyridyl)-2-thiourea (PTU), 1-Benzoyl-2-thiourea (BTU), 1-Acetyl-2-thiourea (ATU), 1-(2-Tetrahydrofurfuryl)-2-thiourea (TTU), and combinations thereof; and
applying the mixed first and second compositions the dental substrate applied with the bonding agent.
18. The method of claim 17 , wherein the bonding agent comprises 8% to 16% of a phosphoric acid containing (meth)acrylic monomer.
19. The method of claim 18 , wherein the phosphoric acid containing (meth)acrylic monomer is selected from the group consisting of GPDM (glycerol phosphate di(meth)acrylate{(meth)acrylate=acrylate or methacrylate}), phenyl-P (phenyl methacryloxyethyl phosphate), PENTA-P (dipentaerithritol pentaacrylate phosphate), 10-MDP (methacryloyloxydecyl phosphate), HEMA-P (hydroxyethylmethacrylate phosphate), HEA-P (hydroxyethylacrylate phosphate), bis(HEMA)-P {bis(hydroxyethylmethacrylate) phosphate), bis(HEA)-P {bis(hydroxyethylacrylate) phosphate), bis((meth)acryloxypropyl)phosphate, and combinations thereof.
20. The method of claim 19 , wherein bond strength of a bond formed by the mixed first and second compositions and the bonding agent is more than 15 MPa.
21. The method of claim 17 , wherein the dental substrate includes Zirconia.
22. The method of claim 17 , wherein the tertiary hydroperoxide includes cumene hydroperoxide (CHP).