Metallic thermal interface materials and associated devices, systems, and methods
A heat-transfer component defines a thermal-interface surface and has a metallic thermal-interface material bonded to the thermal-interface surface. The metallic thermal-interface material has a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.
1. An integrated heat-spreader configured to overlie an integrated-circuit die, the integrated heat-spreader comprising:
a first major surface defining a thermal-interface surface and being configured to face a heat-removal device;
a second major surface positioned opposite the thermal-interface surface and being configured to face the integrated-circuit die; and
a metallic thermal-interface material bonded to the thermal-interface surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C, wherein the metallic thermal-interface material is a eutectic mixture of Bismuth, Indium, Tin and Gallium.
2. The integrated heat-spreader according to claim 1 , wherein the solid-to-liquid transition temperature is about 60° C., about 70° C., about 80° C., or about 90° C.
3. An integrated heat-spreader configured to overlie an integrated-circuit die, the integrated heat-spreader comprising:
a first major surface defining a thermal-interface surface and being configured to face a heat-removal device;
a second major surface positioned opposite the thermal-interface surface and being configured to face the integrated-circuit die; and
a metallic thermal-interface material bonded to the thermal-interface surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C., wherein the metallic thermal-interface material is a non-eutectic mixture of Bismuth, Indium, Tin and Gallium.
4. The integrated heat-spreader according to claim 3 , wherein the solid-to-liquid transition temperature is about 90° C.
5. The integrated heat-spreader according to claim 4 , wherein the metallic thermal-interface material has a liquid-to-solid transition temperature of about 70° C.
6. The integrated heat-spreader according to claim 3 , wherein the solid-to-liquid transition temperature is less than about 90° C. and the liquid-to-solid transition temperature is above about 70° C.
7. A heat-removal device configured to dissipate heat received from a heat-generating electronic component, the heat-removal device comprising:
a base defining a first major surface and a second major surface opposite the first major surface;
a metallic thermal-interface material bonded to the first major surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C., wherein the metallic thermal-interface material is a eutectic mixture of Bismuth, Indium, Tin and Gallium; and
a plurality of fins extending from the second major surface.
8. The heat-removal device according to claim 7 , wherein the solid-to-liquid transition temperature is about 60° C., about 70° C., about 80° C., or about 90° C.
9. An electrical device, comprising:
a heat-generating component defining a first thermal-interface surface;
an integrated heat spreader configured to overlie the heat-generating component, the integrated heat spreader defining a first major surface and a second major surface positioned opposite the first major surface, the first major surface being configured to face a heat-removal device and the second major surface being configured to face the heat-generating component; and
a metallic thermal-interface material bonded to the second major surface of the integrated heat spreader, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.; wherein the metallic thermal-interface material is a eutectic mixture of Bismuth, Indium, Tin and Gallium.
10. The electrical device according to claim 9 , wherein the solid-to-liquid transition temperature is about 60° C., about 70° C., about 80° C., or about 90° C.
11. The electrical device according to claim 9 , wherein the heat-generating component is an electronic processing unit.
12. The electrical device according to claim 9 , wherein the heat-generating component is an electrical storage battery.
13. An electrical device, comprising:
a heat-generating component defining a first thermal-interface surface;
a heat-removal device configured to dissipate heat received from the heat-generating electronic component, the heat-removal device having a base defining a first major surface and further defining a second major surface opposite the first major surface, wherein a plurality of fins extends from the second major surface of the heat-removal device, and wherein a metallic thermal-interface material is bonded to the first major surface of the base, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.; wherein the metallic thermal-interface material is a eutectic mixture of Bismuth, Indium, Tin and Gallium.
14. The electrical device according to claim 13 , wherein the solid-to-liquid transition temperature is about 60° C., about 70° C., about 80° C., or about 90° C.
15. The electrical device according to claim 13 , wherein the heat-generating component is an electronic processing unit.
16. The electrical device according to claim 13 , wherein the heat-generating component is an electrical storage battery.
17. A heat-removal device configured to dissipate heat received from a heat-generating electronic component, the heat-removal device comprising:
a base defining a first major surface and a second major surface opposite the first major surface;
a metallic thermal-interface material bonded to the first major surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C., wherein the metallic thermal-interface material is a non-eutectic mixture of Bismuth, Indium, Tin and Gallium; and
a plurality of fins extending from the second major surface.
18. The heat-removal device according to claim 17 , wherein the solid-to-liquid transition temperature is about 90° C.
19. The heat-removal device according to claim 18 , wherein the metallic thermal-interface material has a liquid-to-solid transition temperature of about 70° C.
20. The heat-removal device according to claim 17 , wherein the solid-to-liquid transition temperature is less than about 90° C. and the liquid-to-solid transition temperature is above about 70° C.
21. An electrical device, comprising:
a heat-generating component defining a first thermal-interface surface;
an integrated heat spreader configured to overlie the heat-generating component, the integrated heat spreader defining a first major surface and a second major surface positioned opposite the first major surface, the first major surface being configured to face a heat-removal device and the second major surface being configured to face the heat-generating component; and
a metallic thermal-interface material bonded to the second major surface of the integrated heat spreader, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.; wherein the metallic thermal-interface material is a non-eutectic mixture of Bismuth, Indium, Tin and Gallium.
22. The electrical device according to claim 21 , wherein the heat-generating component is an electronic processing unit.
23. The electrical device according to claim 21 , wherein the heat-generating component is an electrical storage battery.
24. The electrical device according to claim 21 , wherein the solid-to-liquid transition temperature is about 90° C.
25. The electrical device according to claim 24 , wherein the metallic thermal-interface material has a liquid-to-solid transition temperature of about 70° C.
26. The electrical device according to claim 21 , wherein the solidus-to-liquidus transition temperature is less than about 90° C. and the liquidus-to-solidus transition temperature is above about 70° C.
27. An electrical device, comprising:
a heat-generating component defining a first thermal-interface surface;
a heat-removal device configured to dissipate heat received from the heat-generating electronic component, the heat-removal device having a base defining a first major surface and further defining a second major surface opposite the first major surface, wherein a plurality of fins extends from the second major surface of the heat-removal device, and wherein a metallic thermal-interface material is bonded to the first major surface of the base, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.; wherein the metallic thermal-interface material is a non-eutectic mixture of Bismuth, Indium, Tin and Gallium.
28. The electrical device according to claim 27 , wherein the heat-generating component is an electronic processing unit.
29. The electrical device according to claim 27 , wherein the heat-generating component is an electrical storage battery.
30. The electrical device according to claim 27 , wherein the solid-to-liquid transition temperature is about 90° C.
31. The electrical device according to claim 30 , wherein the metallic thermal-interface material has a liquid-to-solid transition temperature of about 70° C.
32. The electrical device according to claim 27 , where solid-to-liquid transition temperature is less than about 90° C. and the liquid-to-solid transition temperature is above about 70° C.