Conformable die bond film (DBF) in glass cavity
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate with a cavity, where the first substrate comprises glass. In an embodiment, a second substrate is in the cavity. In an embodiment, a bond film covers a bottom of the second substrate and extends up sidewalls of the second substrate.
1 . An electronic package, comprising:
a first substrate with a cavity, wherein the first substrate comprises glass, and wherein a bottom surface of the cavity is not parallel to a top surface of the first substrate;
a second substrate in the cavity; and
a bond film that covers a bottom of the second substrate.
2 . The electronic package of claim 1 , wherein a top surface of the second substrate is substantially coplanar with a top surface of the first substrate.
3 . The electronic package of claim 1 , wherein the bond film has a variable thickness along the bottom surface of the cavity.
4 . The electronic package of claim 1 , wherein a bottom surface of the second substrate is parallel to the top surface of the first substrate.
5 . The electronic package of claim 1 , wherein through substrate vias are provided through the second substrate.
6 . The electronic package of claim 5 , wherein vias through the first substrate below the cavity are electrically coupled to the through substrate vias.
7 . The electronic package of claim 1 , further comprising:
a first die electrically coupled to the second substrate; and
a second die electrically coupled to the second substrate, wherein the second substrate is an electrical bridge between the first die and the second die.
8 . The electronic package of claim 7 , wherein the first die and the second die are coupled to the second substrate through a redistribution layer.
9 . The electronic package of claim 7 , wherein the first die and the second die are coupled to the second substrate through hybrid bonding or solder bonding.
10 . The electronic package of claim 1 , wherein a fill layer fills a remainder of the cavity not occupied by the second substrate and the bond film.
11 . The electronic package of claim 1 , wherein the bond film comprises one or more of a low filler buildup film, a liquid buildup film, and a PDMS material.
12 . The electronic package of claim 1 , wherein the bond film comprises a solder, wherein the solder is a high melting point solder or alloy.
13 . The electronic package of claim 1 , wherein the bond film extends up the sidewalls of the second substrate a distance up to approximately 100 μm.
14 . An electronic package, comprising:
a substrate, wherein the substrate comprises glass;
a cavity in the substrate, wherein the bottom of the cavity is sloped;
a bridge in the cavity; and
a bond film between the bridge and a bottom of the cavity, wherein the bond film conforms to the bridge to enable a top surface of the bridge to be substantially coplanar with a top surface of the substrate.
15 . The electronic package of claim 14 , wherein the bond film extends up sidewalls of the bridge so that bond film is between sidewalls of the bridge and sidewalls of the cavity.
16 . The electronic package of claim 15 , wherein the bond film extends up sidewalls of the bridge a distance between approximately 10% and approximately 90% of a depth of the cavity.
17 . The electronic package of claim 14 , wherein the bridge comprises through substrate vias.
18 . The electronic package of claim 17 , wherein the through substrate vias are electrically coupled to vias through the substrate, wherein the vias through the substrate are below the cavity.
19 . The electronic package of claim 14 , wherein the bond film has a variable thickness along the bottom of the cavity.
20 . The electronic package of claim 14 , further comprising:
a first die coupled to the bridge; and
a second die coupled to the bridge, wherein the bridge electrically couples the first die to the second die.
21 . The electronic package of claim 20 , wherein the first die and the second die are hybrid bonded to the bridge.
22 . The electronic package of claim 20 , wherein the first die and the second die are coupled to the bridge by solder.
23 . The electronic package of claim 14 , wherein a remainder of the cavity not occupied by the bridge and the bond film is filled with a filler material.
24 . An electronic system, comprising:
a board;
a package substrate coupled to the board, wherein the package substrate comprises glass;
a cavity in the package substrate, wherein a bottom of the cavity is non-parallel to a top surface of the package substrate;
a bridge in the cavity, wherein a bond film in the cavity conforms to a bottom surface and sidewall surfaces of the bridge; and
a first die and a second die electrically coupled together by the bridge.
25 . The electronic system of claim 24 , wherein the bond film has a variable thickness along the bottom of the cavity.
26 . An electronic package, comprising:
a first substrate with a cavity, wherein the first substrate comprises glass;
a second substrate in the cavity; and
a bond film that covers a bottom of the second substrate and extends up sidewalls of the second substrate, wherein a fill layer fills a remainder of the cavity not occupied by the second substrate and the bond film.
27 . An electronic package, comprising:
a first substrate with a cavity, wherein the first substrate comprises glass;
a second substrate in the cavity; and
a bond film that covers a bottom of the second substrate and extends up sidewalls of the second substrate, wherein the bond film comprises a solder, wherein the solder is a high melting point solder or alloy.